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Publications 1984 2017

  • 21 h-Index
  • 50 Article
  • 25 Conference contribution
  • 7 Chapter
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2017
1 Citations

Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

Wu, Y., Subramanian, K. N., Barton, S. C. & Lee, A., Nov 1 2017, In : Microelectronics Reliability. 78, p. 355-361 7 p.

Research output: Contribution to journalArticle

Intermetallics
intermetallics
corrosion
wire
Wire
6 Citations

Nanoscale toughening of carbon fiber reinforced/epoxy polymer composites (CFRPs) using a triblock copolymer

Kamar, N. T., Drzal, L. T., Lee, A. & Askeland, P., Feb 24 2017, In : Polymer (United Kingdom). 111, p. 36-47 12 p.

Research output: Contribution to journalArticle

Toughening
Block copolymers
Carbon fibers
Polymers
Composite materials
2016

Influence of nano-structured silanols on the microstructure and mechanical properties of a4047 and a359 aluminum casting alloys

Lee, A., Lu, Y., Roche, A. & Pan, T. Y. Jul 1 2016 In : International Journal of Metalcasting. 10, 3, p. 322-328 7 p.

Research output: Contribution to journalArticle

Aluminum castings
Aluminum
Mechanical properties
Casting
Microstructure
3 Citations

Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

Ma, L., Zuo, Y., Liu, S., Guo, F., Lee, A. & Subramanian, K. N., Feb 5 2016, In : Journal of Alloys and Compounds. 657, p. 400-407 8 p.

Research output: Contribution to journalArticle

Soldering alloys
Composite materials
Thermal cycling
Thermal aging
Electromigration
2014
8 Citations

Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints

Zuo, Y., Ma, L., Guo, F., Qiao, L., Shu, Y., Lee, A. & Subramanian, K. N., 2014, In : Journal of Electronic Materials. 43, 12, p. 4395-4405 11 p.

Research output: Contribution to journalArticle

thermal fatigue
Thermal fatigue
Electromigration
electromigration
solders
3 Citations

Effects of poss-silanol addition on whisker formation in Sn-based Pb-free electronic solders

Liu, S., Ma, L., Shu, Y., Subramanian, K. N., Lee, A. & Guo, F., Jan 2014, In : Journal of Electronic Materials. 43, 1, p. 26-32 7 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
electronics
Intermetallics
intermetallics
6 Citations

Separation and solubility of cis and trans isomers in nanostructured double-decker silsequioxanes

Schoen, B. W., Lira, C. T. & Lee, A., May 8 2014, In : Journal of Chemical and Engineering Data. 59, 5, p. 1483-1493 11 p.

Research output: Contribution to journalArticle

Isomers
Hexanes
Hexane
Solubility
Activity coefficients
2013
7 Citations

Identification and quantification of cis and trans isomers in aminophenyl double-decker silsesquioxanes using 1H-29Si gHMBC NMR

Schoen, B. W., Holmes, D. & Lee, A., Aug 2013, In : Magnetic Resonance in Chemistry. 51, 8, p. 490-496 7 p.

Research output: Contribution to journalArticle

Isomers
Nuclear magnetic resonance
Nanostructured materials
Chemical properties
Physical properties
2012

Tetrabutylammonium tetrakis(trimethyl-silanolato-κO)ferrate(III)

Hay, M., Staples, R. & Lee, A., Sep 2012, In : Acta Crystallographica Section E: Structure Reports Online. 68, 9

Research output: Contribution to journalArticle

ferrates
Atoms
Anions
atoms
Cations
2010
14 Citations

A novel linear titanium(IV)-POSS coordination polymer

Hay, M. T., Seurer, B., Holmes, D. & Lee, A., Mar 9 2010, In : Macromolecules. 43, 5, p. 2108-2110 3 p.

Research output: Contribution to journalArticle

Titanium
Polymers
Magic angle spinning
Silicones
X ray powder diffraction
30 Citations

Electromigration in Sn-Bi modified with polyhedral oligomeric silsesquioxane

Zhang, R., Xu, G., Wang, X., Guo, F., Lee, A. & Subramanian, K. N., Dec 2010, In : Journal of Electronic Materials. 39, 12, p. 2513-2521 9 p.

Research output: Contribution to journalArticle

Electromigration
electromigration
solders
Soldering alloys
eutectics
2 Citations

Foreword: Pb-free solders and emerging interconnect and packaging technologies

Lin, K. L., Kang, S. K., Duh, J. G., Lee, A., Bieler, T., Turbini, L., Sidhu, R., Guo, F. & Anderson, I., Dec 2010, In : Journal of Electronic Materials. 39, 12, p. 2503 1 p.

Research output: Contribution to journalArticle

23 Citations

Thermal transitions and reaction kinetics of polyhederal silsesquioxane containing phenylethynylphthalimides

Seurer, B., Vij, V., Haddad, T., Mabry, J. M. & Lee, A., Nov 23 2010, In : Macromolecules. 43, 22, p. 9337-9347 11 p.

Research output: Contribution to journalArticle

Reaction kinetics
Isomers
Melting point
Derivatives
Polyenes
2009
6 Citations

Impact behavior of thermomechanically fatigued Sn-based solder joints

Kobayashi, T., Lee, A. & Subramanian, K. N. Dec 2009 In : Journal of Electronic Materials. 38, 12, p. 2659-2667 9 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
specimen geometry
impact strength
Temperature
2008
4 Citations

Effect of strain on whisker growth in matte tin

Southworth, A. R., Ho, C. E., Lee, A. & Subramanian, K. N., 2008, In : Soldering and Surface Mount Technology. 20, 1, p. 4-7 4 p.

Research output: Contribution to journalArticle

Tin
tin
Copper
methodology
coatings
2007
19 Citations

Design of solder joints for fundamental studies on the effects of electromigration

Ho, C. E., Lee, A. & Subramanian, K. N., Jun 2007, In : Journal of Materials Science: Materials in Electronics. 18, 6, p. 569-574 6 p.

Research output: Contribution to journalArticle

Electromigration
electromigration
solders
Soldering alloys
Joints
11 Citations

Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c

Ho, C. E., Lee, A., Subramanian, K. N. & Liu, W., 2007, In : Applied Physics Letters. 91, 2, 021906

Research output: Contribution to journalArticle

solders
eutectics
anodes
electromigration
valleys
13 Citations

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Lee, A., Ho, C. E. & Subramanian, K. N., Nov 2007, In : Journal of Materials Research. 22, 11, p. 3265-3272 8 p.

Research output: Contribution to journalArticle

Electromigration
electromigration
solders
eutectics
Soldering alloys
31 Citations

Morphology and phase transitions in styrene-butadiene-styrene triblock copolymer grafted with isobutyl-substituted polyhedral oligomeric silsesquioxanes

Drazkowski, D. B., Lee, A. & Haddad, T. S., Apr 17 2007, In : Macromolecules. 40, 8, p. 2798-2805 8 p.

Research output: Contribution to journalArticle

Butadiene
Block copolymers
Styrene
Phase transitions
Polystyrenes
23 Citations

Synchrotron x-ray microscopy studies on electromigration of a two-phase material

Lee, A., Liu, W., Ho, C. E. & Subramanian, K. N., 2007, In : Journal of Applied Physics. 102, 5, 053507

Research output: Contribution to journalArticle

electromigration
synchrotrons
microscopy
crowding
x rays
2006
46 Citations

Chemical substituent effects on morphological transitions in styrene-butadiene-styrene triblock copolymer grafted with polyhedral oligomeric silsesquioxanes

Drazkowski, D. B., Lee, A., Haddad, T. S. & Cookson, D. J., Mar 7 2006, In : Macromolecules. 39, 5, p. 1854-1863 10 p.

Research output: Contribution to journalArticle

Polystyrenes
Butadiene
Block copolymers
Styrene
Order disorder transitions
2005
55 Citations

Development of nano-composite lead-free electronic solders

Lee, A. & Subramanian, K. N. Nov 2005 In : Journal of Electronic Materials. 34, 11, p. 1399-1407 9 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
Lead
composite materials
Composite materials
49 Citations

New approach in the synthesis of hybrid polymers grafted with polyhedral oligomeric silsesquioxane and their physical and viscoelastic properties

Lee, A., Xiao, J. & Feher, F. J. Jan 25 2005 In : Macromolecules. 38, 2, p. 438-444 7 p.

Research output: Contribution to journalArticle

Polymers
Copolymers
phosphine
Oxides
Gelation
9 Citations

Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints

Rhee, H., Subramanian, K. N. & Lee, A., Mar 2005, In : Journal of Materials Science: Materials in Electronics. 16, 3, p. 169-176 8 p.

Research output: Contribution to journalArticle

stress relaxation
Stress relaxation
solders
eutectics
Soldering alloys
2004
8 Citations

Characterization of Polymeric Composites with Low CTE Ceramic Particulate Fillers

Sonje, P. U., Subramanian, K. N. & Lee, A., Jan 2004, In : Journal of Advanced Materials. 36, 1, p. 22-29 8 p.

Research output: Contribution to journalArticle

Epoxy Resins
Thermal expansion
Fillers
Epoxy resins
Composite materials
2 Citations

Flammability and thermophysical characterization of thermoplastic elastomer nanocomposites

Marchant, D., Koo, J. H., Blanski, R. L., Weber, E. H., Ruth, P. N., Lee, A. & Schlaefer, C., 2004, In : Unknown Journal. 228, 2

Research output: Contribution to journalArticle

Thermoplastic elastomers
Flammability
Thermal expansion
Thermal conductivity
Nanocomposites
114 Citations

Styrene-butadiene-styrene triblock copolymers modified with polyhedral oligomeric silsesquioxanes

Fu, B. X., Lee, A. & Haddad, T. S., Jul 13 2004, In : Macromolecules. 37, 14, p. 5211-5218 8 p.

Research output: Contribution to journalArticle

Polystyrenes
Butadiene
Polybutadienes
Block copolymers
Styrene
2003
20 Citations

Caractérisation mécanique des joints de brasage Sn-3,5Ag à diverses températures

Rhee, H., Subramanian, K. N., Lee, A. & Lee, J. G., 2003, In : Soldering and Surface Mount Technology. 15, 3, p. 4-5+21

Research output: Contribution to journalArticle

solders
Soldering alloys
shear strain
Shear strain
shear stress
119 Citations

Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses

Fu, B. X., Namani, M. & Lee, A., Nov 14 2003, In : Polymer. 44, 25, p. 7739-7747 9 p.

Research output: Contribution to journalArticle

Amines
Diamines
Glass
Curing
Polypropylene oxides
20 Citations

Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

Rhee, H., Subramanian, K. N., Lee, A. & Lee, J. G., Dec 1 2003, In : Soldering and Surface Mount Technology. 15, 3, p. 21-26 6 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
shear strain
Shear strain
shear stress
2001
17 Citations

Material issues in electronic interconnects and packaging

Subramanian, K. N., Lee, A., Choi, S. & Sonje, P., Apr 2001, In : Journal of Electronic Materials. 30, 4, p. 372-378 7 p.

Research output: Contribution to journalArticle

packaging
Thermal expansion
thermal expansion
Packaging
coefficients
2000
4 Citations

New insight into the structure-property relationships of hybrid (inorganic/organic) POSS™ thermoplastics

Phillips, S. H., Blanski, R. L., Svejda, S. A., Haddad, T. S., Lee, A., Lichtenhan, J. D., Feher, F. J., Mather, P. T. & Hsiao, B. S., 2000, In : Materials Research Society Symposium - Proceedings. 628, p. CC4.6.1-CC4.6.10

Research output: Contribution to journalArticle

Thermoplastics
Polymers
Organic polymers
polymers
Polymer matrix
41 Citations

New method to reduce cure-induced stresses in thermoset polymer composites, Part III: correlating stress history to viscosity, degree of cure, and cure shrinkage

Russell, J. D., Madhukar, M. S., Genidy, M. S. & Lee, A. Y., 2000, In : Journal of Composite Materials. 34, 22, p. 1926-1947 22 p.

Research output: Contribution to journalArticle

Thermosets
Polymers
Viscosity
Composite materials
Fibers
5 Citations

Silica coatings on bismaleimide (BMI) polymeric substrates

Mukherjee, C., Case, E. D. & Lee, A., 2000, In : Journal of Materials Science. 35, 6, p. 1389-1396 8 p.

Research output: Contribution to journalArticle

Ceramic coatings
Indentation
Silicon Dioxide
Polymers
Silica
1999
196 Citations

Thermal and Viscoelastic Property of Epoxy-Clay and Hybrid Inorganic-Organic Epoxy Nanocomposites

Lee, A. & Lichtenhan, J. D., Sep 6 1999, In : Journal of Applied Polymer Science. 73, 10, p. 1993-2001 9 p.

Research output: Contribution to journalArticle

Nanocomposites
Reinforcement
Clay
Stress relaxation
Differential scanning calorimetry
1998
341 Citations

Viscoelastic responses of polyhedral oligosilsesquioxane reinforced epoxy systems

Lee, A. & Lichtenhan, J. D., Jul 28 1998, In : Macromolecules. 31, 15, p. 4970-4974 5 p.

Research output: Contribution to journalArticle

Nanocomposites
Bearings (structural)
Aging of materials
Epoxy Resins
Epoxy Compounds
1997
23 Citations

Anomalous aging in two-phase systems: Creep and stress relaxation differences in rubber-toughened epoxies

Lee, A. & McKenna, G. B., Jun 1997, In : Journal of Polymer Science, Part B: Polymer Physics. 35, 8, p. 1167-1174 8 p.

Research output: Contribution to journalArticle

binary systems (materials)
Rubber
stress relaxation
Stress relaxation
rubber
12 Citations

Fracture of an epoxy polymer containing recycled elastomeric particles

Boynton, M. J. & Lee, A., Oct 10 1997, In : Journal of Applied Polymer Science. 66, 2, p. 271-277 7 p.

Research output: Contribution to journalArticle

Rubber
Polymers
Fracture toughness
Toughening
Liquids
40 Citations

Isochoric and isobaric glass formation: Similarities and differences

Colucci, D. M., Mckenna, G. B., Filliben, J. J., Lee, A., Curliss, D. B., Bowman, K. B. & Russell, J. D., 1997, In : Journal of Polymer Science, Part B: Polymer Physics. 35, 10, p. 1561-1573 13 p.

Research output: Contribution to journalArticle

Glass transition
Free volume
Glass
glass
Carbonates
1996
2 Citations

Kinetics of network re-formation in hydrolytic degraded AFR700B polyimide resin

Lee, A. Dec 1996 In : High Performance Polymers. 8, 4, p. 475-489 15 p.

Research output: Contribution to journalArticle

Polyimides
Curing
Resins
Kinetics
Temperature
1991
20 Citations

Aging in glasses subjected to large stresses and deformations

McKenna, G. B., Santore, M. M., Lee, A. & Duran, R. S., Jun 11 1991, In : Journal of Non-Crystalline Solids. 131-133, PART 1, p. 497-504 8 p.

Research output: Contribution to journalArticle

Aging of materials
Glass
glass
stimuli
recovery
1990
93 Citations

The physical ageing response of an epoxy glass subjected to large stresses

Lee, A. & McKenna, G. B., 1990, In : Polymer. 31, 3, p. 423-430 8 p.

Research output: Contribution to journalArticle

Aging of materials
Glass
Creep
Quenching
Recovery
29 Citations

Viscoelastic response of epoxy glasses subjected to different thermal treatments

Lee, A. & McKenna, G. B., Apr 1990, In : Polymer Engineering and Science. 30, 7, p. 431-435 5 p.

Research output: Contribution to journalArticle

Aging of materials
Heat treatment
Glass
Stress relaxation
Creep
1988
119 Citations

Effect of crosslink density on physical ageing of epoxy networks

Lee, A. & McKenna, G. B., 1988, In : Polymer. 29, 10, p. 1812-1817 6 p.

Research output: Contribution to journalArticle

Aging of materials
Stress relaxation
Temperature
Polypropylene oxides
Calorimeters
1987
21 Citations

Relaxation mechanism of polymer melts

Lee, A. & Wool, R. P., 1987, In : Macromolecules. 20, 8, p. 1924-1927 4 p.

Research output: Contribution to journalArticle

Polymer melts
Polystyrenes
Dichroism
Infrared radiation
1986
2 Citations

ADHESION AND THE SURFACE BEHAVIOR OF THE SILICONE ELASTOMER RTV-142.

Bretzlaff, R. S., Freitag, T. A. & Lee, A. Jul 1986 In : Polymer Engineering and Science. 26, 13, p. 931-939 9 p.

Research output: Contribution to journalArticle

Silicone Elastomers
Elastomers
Silicones
Polymers
Adhesion
2 Citations

Concentration dependence of the initial decay rate of the polymer dynamical scattering factor

Baldwin, P. R. & Lee, A., Feb 10 1986, In : Physics Letters A. 114, 3, p. 153-158 6 p.

Research output: Contribution to journalArticle

scattering functions
decay rates
expansion
polymers
scattering
4 Citations

Effect of an external electric field on liquid crystalline polymers

Lee, A. Jan 6 1986 In : Physics Letters A. 113, 7, p. 391-394 4 p.

Research output: Contribution to journalArticle

transition temperature
electric fields
polymers
electric moments
liquids
33 Citations

FT-IR study of orientation relaxation in uniaxially oriented monodisperse atactic polystyrenes

Lee, A. & Wool, R. P., 1986, In : Macromolecules. 19, 4, p. 1063-1068 6 p.

Research output: Contribution to journalArticle

Polystyrenes
Fourier transforms
Molecular weight
Infrared radiation
Molecular orientation
1984
33 Citations

Initial decay rate of the dynamical-scattering factor for dilute polymer solutions

Lee, A., Baldwin, P. R. & Oono, Y., 1984, In : Physical Review A. 30, 2, p. 968-978 11 p.

Research output: Contribution to journalArticle

decay rates
group theory
polymers
scattering
kinetic equations