Publications 1984 2017

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2017

Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

Wu, Y., Subramanian, K. N., Barton, S. C. & Lee, A. Nov 1 2017 In : Microelectronics Reliability. 78, p. 355-361 7 p.

Research output: Research - peer-reviewArticle

Intermetallics
Wire
Corrosion
intermetallics
corrosion
2 Citations

Nanoscale toughening of carbon fiber reinforced/epoxy polymer composites (CFRPs) using a triblock copolymer

Kamar, N. T., Drzal, L. T., Lee, A. & Askeland, P. Feb 24 2017 In : Polymer (United Kingdom). 111, p. 36-47 12 p.

Research output: Research - peer-reviewArticle

Toughening
Block copolymers
Polymers
Composite materials
carbon fiber
2016

Influence of nano-structured silanols on the microstructure and mechanical properties of a4047 and a359 aluminum casting alloys

Lee, A., Lu, Y., Roche, A. & Pan, T. Y. Jul 1 2016 In : International Journal of Metalcasting. 10, 3, p. 322-328 7 p.

Research output: Research - peer-reviewArticle

Aluminum castings
Aluminum
Mechanical properties
Microstructure
silanol
2 Citations

Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

Ma, L., Zuo, Y., Liu, S., Guo, F., Lee, A. & Subramanian, K. N. Feb 5 2016 In : Journal of Alloys and Compounds. 657, p. 400-407 8 p.

Research output: Research - peer-reviewArticle

Soldering alloys
Composite materials
silanol
Thermal cycling
Thermal aging
2014
8 Citations

Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints

Zuo, Y., Ma, L., Guo, F., Qiao, L., Shu, Y., Lee, A. & Subramanian, K. N. 2014 In : Journal of Electronic Materials. 43, 12, p. 4395-4405 11 p.

Research output: Research - peer-reviewArticle

Thermal fatigue
Electromigration
Soldering alloys
Creep
thermal fatigue
3 Citations

Effects of poss-silanol addition on whisker formation in Sn-based Pb-free electronic solders

Liu, S., Ma, L., Shu, Y., Subramanian, K. N., Lee, A. & Guo, F. Jan 2014 In : Journal of Electronic Materials. 43, 1, p. 26-32 7 p.

Research output: Research - peer-reviewArticle

Soldering alloys
silanol
solders
electronics
Intermetallics
3 Citations

Separation and solubility of cis and trans isomers in nanostructured double-decker silsequioxanes

Schoen, B. W., Lira, C. T. & Lee, A. May 8 2014 In : Journal of Chemical and Engineering Data. 59, 5, p. 1483-1493 11 p.

Research output: Research - peer-reviewArticle

Isomers
Solubility
Hexanes
Hexane
Activity coefficients
2013
6 Citations

Identification and quantification of cis and trans isomers in aminophenyl double-decker silsesquioxanes using 1H-29Si gHMBC NMR

Schoen, B. W., Holmes, D. & Lee, A. Aug 2013 In : Magnetic Resonance in Chemistry. 51, 8, p. 490-496 7 p.

Research output: Research - peer-reviewArticle

Isomers
Nuclear magnetic resonance
Nanostructured materials
Chemical properties
Physical properties
2012

Tetrabutylammonium tetrakis(trimethyl-silanolato-κO)ferrate(III)

Hay, M., Staples, R. & Lee, A. Sep 2012 In : Acta Crystallographica Section E: Structure Reports Online. 68, 9

Research output: Research - peer-reviewArticle

Atoms
ferrate ion
tetrabutylammonium
ferrates
atoms
2010
10 Citations

A novel linear titanium(IV)-POSS coordination polymer

Hay, M. T., Seurer, B., Holmes, D. & Lee, A. Mar 9 2010 In : Macromolecules. 43, 5, p. 2108-2110 3 p.

Research output: Research - peer-reviewArticle

Titanium
Polymers
Magic angle spinning
Silicones
X ray powder diffraction
26 Citations

Electromigration in Sn-Bi modified with polyhedral oligomeric silsesquioxane

Zhang, R., Xu, G., Wang, X., Guo, F., Lee, A. & Subramanian, K. N. Dec 2010 In : Journal of Electronic Materials. 39, 12, p. 2513-2521 9 p.

Research output: Research - peer-reviewArticle

electromigration
solders
Electromigration
Soldering alloys
eutectics
2 Citations

Foreword: Pb-free solders and emerging interconnect and packaging technologies

Lin, K. L., Kang, S. K., Duh, J. G., Lee, A., Bieler, T., Turbini, L., Sidhu, R., Guo, F. & Anderson, I. Dec 2010 In : Journal of Electronic Materials. 39, 12, p. 2503 1 p.

Research output: Research - peer-reviewArticle

16 Citations

Thermal transitions and reaction kinetics of polyhederal silsesquioxane containing phenylethynylphthalimides

Seurer, B., Vij, V., Haddad, T., Mabry, J. M. & Lee, A. Nov 23 2010 In : Macromolecules. 43, 22, p. 9337-9347 11 p.

Research output: Research - peer-reviewArticle

Reaction kinetics
Temperature
Hot Temperature
Isomers
Melting point
2009
6 Citations

Impact behavior of thermomechanically fatigued Sn-based solder joints

Kobayashi, T., Lee, A. & Subramanian, K. N. Dec 2009 In : Journal of Electronic Materials. 38, 12, p. 2659-2667 9 p.

Research output: Research - peer-reviewArticle

Soldering alloys
Temperature
solders
temperature
Hot Temperature
2008
4 Citations

Effect of strain on whisker growth in matte tin

Southworth, A. R., Ho, C. E., Lee, A. & Subramanian, K. N. 2008 In : Soldering and Surface Mount Technology. 20, 1, p. 4-7 4 p.

Research output: Research - peer-reviewArticle

tin
Tin
Temperature
methodology
coatings
2007
19 Citations

Design of solder joints for fundamental studies on the effects of electromigration

Ho, C. E., Lee, A. & Subramanian, K. N. Jun 2007 In : Journal of Materials Science: Materials in Electronics. 18, 6, p. 569-574 6 p.

Research output: Research - peer-reviewArticle

electromigration
solders
Electromigration
Soldering alloys
Joints
11 Citations

Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c

Ho, C. E., Lee, A., Subramanian, K. N. & Liu, W. 2007 In : Applied Physics Letters. 91, 2, 021906

Research output: Research - peer-reviewArticle

solders
eutectics
anodes
electromigration
valleys
13 Citations

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Lee, A., Ho, C. E. & Subramanian, K. N. Nov 2007 In : Journal of Materials Research. 22, 11, p. 3265-3272 8 p.

Research output: Research - peer-reviewArticle

Electromigration
Soldering alloys
Eutectics
Cathodes
Microstructure
30 Citations

Morphology and phase transitions in styrene-butadiene-styrene triblock copolymer grafted with isobutyl-substituted polyhedral oligomeric silsesquioxanes

Drazkowski, D. B., Lee, A. & Haddad, T. S. Apr 17 2007 In : Macromolecules. 40, 8, p. 2798-2805 8 p.

Research output: Research - peer-reviewArticle

Phase transitions
1,3-butadiene
styrene-butadiene-styrene triblock copolymer
Butadiene
Block copolymers
22 Citations

Synchrotron x-ray microscopy studies on electromigration of a two-phase material

Lee, A., Liu, W., Ho, C. E. & Subramanian, K. N. 2007 In : Journal of Applied Physics. 102, 5, 053507

Research output: Research - peer-reviewArticle

electromigration
synchrotrons
microscopy
x rays
crowding
2006
45 Citations

Chemical substituent effects on morphological transitions in styrene-butadiene-styrene triblock copolymer grafted with polyhedral oligomeric silsesquioxanes

Drazkowski, D. B., Lee, A., Haddad, T. S. & Cookson, D. J. Mar 7 2006 In : Macromolecules. 39, 5, p. 1854-1863 10 p.

Research output: Research - peer-reviewArticle

Butadiene
Block copolymers
Styrene
Polystyrenes
styrene-butadiene-styrene triblock copolymer
2005
52 Citations

Development of nano-composite lead-free electronic solders

Lee, A. & Subramanian, K. N. Nov 2005 In : Journal of Electronic Materials. 34, 11, p. 1399-1407 9 p.

Research output: Research - peer-reviewArticle

Soldering alloys
Composite materials
Lead
solders
composite materials
47 Citations

New approach in the synthesis of hybrid polymers grafted with polyhedral oligomeric silsesquioxane and their physical and viscoelastic properties

Lee, A., Xiao, J. & Feher, F. J. Jan 25 2005 In : Macromolecules. 38, 2, p. 438-444 7 p.

Research output: Research - peer-reviewArticle

Polymers
Copolymers
Temperature
Oxides
phosphine
9 Citations

Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints

Rhee, H., Subramanian, K. N. & Lee, A. Mar 2005 In : Journal of Materials Science: Materials in Electronics. 16, 3, p. 169-176 8 p.

Research output: Research - peer-reviewArticle

stress relaxation
solders
eutectics
Stress relaxation
Soldering alloys
2004
8 Citations

Characterization of Polymeric Composites with Low CTE Ceramic Particulate Fillers

Sonje, P. U., Subramanian, K. N. & Lee, A. Jan 2004 In : Journal of Advanced Materials. 36, 1, p. 22-29 8 p.

Research output: Research - peer-reviewArticle

Thermal expansion
Fillers
Composite materials
Epoxy Resins
Epoxy resins
2 Citations

Flammability and thermophysical characterization of thermoplastic elastomer nanocomposites

Marchant, D., Koo, J. H., Blanski, R. L., Weber, E. H., Ruth, P. N., Lee, A. & Schlaefer, C. 2004 In : Unknown Journal. 228, 2

Research output: Research - peer-reviewArticle

Thermoplastic elastomers
Flammability
Thermal expansion
Thermal conductivity
Nanocomposites
109 Citations

Styrene-butadiene-styrene triblock copolymers modified with polyhedral oligomeric silsesquioxanes

Fu, B. X., Lee, A. & Haddad, T. S. Jul 13 2004 In : Macromolecules. 37, 14, p. 5211-5218 8 p.

Research output: Research - peer-reviewArticle

Butadiene
Block copolymers
Styrene
Polystyrenes
styrene-butadiene-styrene triblock copolymer
2003
20 Citations

Caractérisation mécanique des joints de brasage Sn-3,5Ag à diverses températures

Rhee, H., Subramanian, K. N., Lee, A. & Lee, J. G. 2003 In : Soldering and Surface Mount Technology. 15, 3, p. 4-5+21

Research output: Research - peer-reviewArticle

Soldering alloys
Temperature
solders
temperature
Shear strain
116 Citations

Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses

Fu, B. X., Namani, M. & Lee, A. Nov 14 2003 In : Polymer. 44, 25, p. 7739-7747 9 p.

Research output: Research - peer-reviewArticle

Amines
Glass
Diamines
Curing
silanol
19 Citations

Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

Rhee, H., Subramanian, K. N., Lee, A. & Lee, J. G. Dec 1 2003 In : Soldering and Surface Mount Technology. 15, 3, p. 21-26 6 p.

Research output: Research - peer-reviewArticle

Soldering alloys
Temperature
solders
temperature
Shear strain
2001
16 Citations

Material issues in electronic interconnects and packaging

Subramanian, K. N., Lee, A., Choi, S. & Sonje, P. Apr 2001 In : Journal of Electronic Materials. 30, 4, p. 372-378 7 p.

Research output: Research - peer-reviewArticle

packaging
thermal expansion
coefficients
electronics
Thermal expansion
2000
4 Citations

New insight into the structure-property relationships of hybrid (inorganic/organic) POSS™ thermoplastics

Phillips, S. H., Blanski, R. L., Svejda, S. A., Haddad, T. S., Lee, A., Lichtenhan, J. D., Feher, F. J., Mather, P. T. & Hsiao, B. S. 2000 In : Materials Research Society Symposium - Proceedings. 628, p. CC4.6.1-CC4.6.10

Research output: Research - peer-reviewArticle

Thermoplastics
Polymers
polymers
Organic polymers
Polymer matrix
38 Citations

New method to reduce cure-induced stresses in thermoset polymer composites, Part III: correlating stress history to viscosity, degree of cure, and cure shrinkage

Russell, J. D., Madhukar, M. S., Genidy, M. S. & Lee, A. Y. 2000 In : Journal of Composite Materials. 34, 22, p. 1926-1947 22 p.

Research output: Research - peer-reviewArticle

Thermosets
Polymers
Viscosity
Composite materials
Fibers
5 Citations

Silica coatings on bismaleimide (BMI) polymeric substrates

Mukherjee, C., Case, E. D. & Lee, A. 2000 In : Journal of Materials Science. 35, 6, p. 1389-1396 8 p.

Research output: Research - peer-reviewArticle

Ceramic coatings
Indentation
Silicon Dioxide
Polymers
Coatings
1999
193 Citations

Thermal and Viscoelastic Property of Epoxy-Clay and Hybrid Inorganic-Organic Epoxy Nanocomposites

Lee, A. & Lichtenhan, J. D. Sep 6 1999 In : Journal of Applied Polymer Science. 73, 10, p. 1993-2001 9 p.

Research output: Research - peer-reviewArticle

Nanocomposites
Reinforcement
clay
Hot Temperature
Clay
1998
334 Citations

Viscoelastic responses of polyhedral oligosilsesquioxane reinforced epoxy systems

Lee, A. & Lichtenhan, J. D. Jul 28 1998 In : Macromolecules. 31, 15, p. 4970-4974 5 p.

Research output: Research - peer-reviewArticle

Nanocomposites
Aging of materials
Bearings (structural)
Epoxy Resins
Epoxy Compounds
1997
23 Citations
Rubber
Stress relaxation
Creep
Aging of materials
binary systems (materials)
12 Citations

Fracture of an epoxy polymer containing recycled elastomeric particles

Boynton, M. J. & Lee, A. Oct 10 1997 In : Journal of Applied Polymer Science. 66, 2, p. 271-277 7 p.

Research output: Research - peer-reviewArticle

Rubber
Polymers
elastomeric
Liquids
Fracture toughness
39 Citations

Isochoric and isobaric glass formation: Similarities and differences

Colucci, D. M., Mckenna, G. B., Filliben, J. J., Lee, A., Curliss, D. B., Bowman, K. B. & Russell, J. D. 1997 In : Journal of Polymer Science, Part B: Polymer Physics. 35, 10, p. 1561-1573 13 p.

Research output: Research - peer-reviewArticle

Glass transition
Glass
glass
Free volume
Temperature
1996
2 Citations

Kinetics of network re-formation in hydrolytic degraded AFR700B polyimide resin

Lee, A. Dec 1996 In : High Performance Polymers. 8, 4, p. 475-489 15 p.

Research output: Research - peer-reviewArticle

Polyimides
Curing
Resins
Kinetics
polyimide resin
1991
20 Citations

Aging in glasses subjected to large stresses and deformations

McKenna, G. B., Santore, M. M., Lee, A. & Duran, R. S. Jun 11 1991 In : Journal of Non-Crystalline Solids. 131-133, PART 1, p. 497-504 8 p.

Research output: Research - peer-reviewArticle

Aging of materials
Glass
glass
Recovery
Experiments
1990
91 Citations

The physical ageing response of an epoxy glass subjected to large stresses

Lee, A. & McKenna, G. B. 1990 In : Polymer. 31, 3, p. 423-430 8 p.

Research output: Research - peer-reviewArticle

Aging of materials
Glass
Creep
Temperature
Quenching
29 Citations

Viscoelastic response of epoxy glasses subjected to different thermal treatments

Lee, A. & McKenna, G. B. Apr 1990 In : Polymer Engineering and Science. 30, 7, p. 431-435 5 p.

Research output: Research - peer-reviewArticle

Aging of materials
Heat treatment
Glass
Experiments
Glass transition temperature
1988
119 Citations

Effect of crosslink density on physical ageing of epoxy networks

Lee, A. & McKenna, G. B. 1988 In : Polymer. 29, 10, p. 1812-1817 6 p.

Research output: Research - peer-reviewArticle

Aging of materials
Temperature
Stress relaxation
Polypropylene oxides
Calorimeters
1987
21 Citations

Relaxation mechanism of polymer melts

Lee, A. & Wool, R. P. 1987 In : Macromolecules. 20, 8, p. 1924-1927 4 p.

Research output: Research - peer-reviewArticle

Polymer melts
Dichroism
Polystyrenes
Infrared radiation
1986
2 Citations

ADHESION AND THE SURFACE BEHAVIOR OF THE SILICONE ELASTOMER RTV-142.

Bretzlaff, R. S., Freitag, T. A. & Lee, A. Jul 1986 In : Polymer Engineering and Science. 26, 13, p. 931-939 9 p.

Research output: Research - peer-reviewArticle

Elastomers
Silicones
Adhesion
Polymers
Silicone Elastomers
2 Citations

Concentration dependence of the initial decay rate of the polymer dynamical scattering factor

Baldwin, P. R. & Lee, A. Feb 10 1986 In : Physics Letters A. 114, 3, p. 153-158 6 p.

Research output: Research - peer-reviewArticle

scattering functions
decay rates
expansion
polymers
scattering
4 Citations

Effect of an external electric field on liquid crystalline polymers

Lee, A. Jan 6 1986 In : Physics Letters A. 113, 7, p. 391-394 4 p.

Research output: Research - peer-reviewArticle

transition temperature
electric fields
polymers
liquids
electric moments
33 Citations

FT-IR study of orientation relaxation in uniaxially oriented monodisperse atactic polystyrenes

Lee, A. & Wool, R. P. 1986 In : Macromolecules. 19, 4, p. 1063-1068 6 p.

Research output: Research - peer-reviewArticle

Polystyrenes
Fourier transforms
Molecular weight
Infrared radiation
Molecular orientation
1984
31 Citations

Initial decay rate of the dynamical-scattering factor for dilute polymer solutions

Lee, A., Baldwin, P. R. & Oono, Y. 1984 In : Physical Review A. 30, 2, p. 968-978 11 p.

Research output: Research - peer-reviewArticle

decay rates
polymers
scattering
group theory
kinetic equations