Profile Fingerprint is based on mining the text of the experts' scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

Engineering & Materials Science

Grain boundaries
Crystal orientation
Imaging techniques
Electrons
Interfacial energy
Cracks
Microcracks
Defects
Crystals
Geometry
Intermetallics
Continuum mechanics
Microstructure
Nucleation
Twinning
Electron diffraction
Trace analysis
Anisotropy
Crack propagation
Strain energy
Crack tips
Magnesia
Scanning electron microscopy
Lattice mismatch
Defect structures
Phase boundaries
Engineering education
Soldering alloys
Eutectics
Shear stress
Creep
Innovation
Students
Toughness
Dislocations (crystals)
Burgers vector
Tensile stress
Crystal defects
Civil engineering
Microscopic examination
Microcracking
Elastic deformation
Dihedral angle
Coercive force
Diffraction patterns
Tensors
Electron microscopy
Polycrystalline materials

Chemical Compounds

Grain boundaries
Crystal orientation
Interfacial energy
Imaging techniques
Electrons
Microcracks
Defects
Geometry
Intermetallics
Nucleation
Electron diffraction
Twinning
Anisotropy
Crystals
Trace analysis
Magnesium Oxide
Cracks
Continuum mechanics
Phase boundaries
Soldering alloys
Eutectics
Shear stress
Creep
Temperature
Scanning electron microscopy
Crack propagation
Burgers vector
Tensile stress
Crystal defects
Dislocations (crystals)
Microcracking
Dihedral angle
Diffraction patterns
Electron microscopy
Microstructure
Polycrystalline materials
Copper
Microscopic examination

Physics & Astronomy

General

grain boundaries
slip
geometry
defects
crystals
microcracks
energy
incoherence
solders
eutectics
microbalances
shear
microstructure
scanning electron microscopy
dihedral angle

Chemistry and Materials

surface energy
intermetallics
titanium
copper
twinning

Engineering

nucleation
grooves

Physics

electrons
flux density
cycles