Profile The profile is based on mining the text of the experts' scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 4 Similar Profiles
Soldering alloys Engineering & Materials Science
solders Physics & Astronomy
Microstructure Engineering & Materials Science
Grain boundaries Engineering & Materials Science
Creep Engineering & Materials Science
Crystal orientation Engineering & Materials Science
Twinning Engineering & Materials Science
Textures Engineering & Materials Science

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Grants 1991 2018

Publications 1981 2018

Comparison of dislocation content measured with transmission electron microscopy and micro-Laue diffraction based streak analysis

Zhang, C., Balachandran, S., Eisenlohr, P., Crimp, M. A., Boehlert, C., Xu, R. & Bieler, T. R. Feb 1 2018 In : Scripta Materialia. 144, p. 74-77 4 p.

Research output: Contribution to journalArticle

Transmission electron microscopy
transmission electron microscopy
Burgers vector
1 Citations

Transient porous nickel interlayers for improved silver-based Solid Oxide Fuel Cell brazes

Zhou, Q., Bieler, T. R. & Nicholas, J. D. Apr 15 2018 In : Acta Materialia. 148, p. 156-162 7 p.

Research output: Contribution to journalArticle

Yttria stabilized zirconia
Solid oxide fuel cells (SOFC)

Development of low angle grain boundaries in lightly deformed superconducting niobium and their influence on hydride distribution and flux perturbation

Sung, Z. H., Wang, M., Polyanskii, A. A., Santosh, C., Balachandran, S., Compton, C., Larbalestier, D. C., Bieler, T. R. & Lee, P. J. May 21 2017 In : Journal of Applied Physics. 121, 19, 193903

Research output: Contribution to journalArticle

grain boundaries
radio frequencies
4 Citations

Direct measurement of critical resolved shear stress of prismatic and basal slip in polycrystalline Ti using high energy X-ray diffraction microscopy

Wang, L., Zheng, Z., Phukan, H., Kenesei, P., Park, J. S., Lind, J., Suter, R. M. & Bieler, T. R. Jun 15 2017 In : Acta Materialia. 132, p. 598-610 13 p.

Research output: Contribution to journalArticle

Shear stress
Microscopic examination
X ray diffraction
Plastic deformation

Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints

Zuo, Y., Bieler, T. R., Zhou, Q., Ma, L. & Guo, F. Dec 6 2017 (Accepted/In press) In : Journal of Electronic Materials. p. 1-15 15 p.

Research output: Contribution to journalArticle

Silver alloys
tin alloys
Tin alloys
silver alloys
Neutron activation analysis