Publications 1981 2018

2012
15 Citations
slip
ledges
grain boundaries
scanning electron microscopy
misalignment
31 Citations
Trace analysis
Burgers vector
slip
microstructure
Microstructure

Analysis of the tension and creep behavior of Ti-5Al-2. 5Sn(wt. %) using in-situ SEM experiments

Li, H., Boehlert, C. J., Bieler, T. R. & Crimp, M. A. 2012 Ti 2011 - Proceedings of the 12th World Conference on Titanium. Vol. 2, p. 937-941 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Creep
Electron microscopes
Scanning
Grain boundaries
Experiments
2 Citations
Electron diffraction
slip
titanium
Titanium
Imaging techniques
3 Citations

Foreword: Deformation and transitions at grain boundaries

Bieler, T. R., Barabash, R., Spearot, D., Luo, J. & Dillon, S. Oct 2012 In : Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 43, 10, p. 3515-3516 2 p.

Research output: Contribution to journalArticle

Grain boundaries
grain boundaries

Grain boundary strain transfer and anisotropic polycrystalline deformation in commercial purity titanium

Crimp, M. A., Yang, Y., Wang, L., Eisenlohr, P. & Bieler, T. R. 2012 Ti 2011 - Proceedings of the 12th World Conference on Titanium. Vol. 2, p. 1061-1065 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Titanium
Grain boundaries
Prisms
Chemical activation
Trace analysis
12 Citations
Chip scale packages
Soldering alloys
Aging of materials
Thermal aging
Microstructural evolution
15 Citations
mechanical shock
crack propagation
solders
Soldering alloys
Crack propagation
7 Citations

In situ synchrotron characterization of melting, dissolution, and resolidification in lead-free solders

Zhou, B., Bieler, T. R., Wu, G., Zaefferer, S., Lee, T. K. & Liu, K. C. Feb 2012 In : Journal of Electronic Materials. 41, 2, p. 262-272 11 p.

Research output: Contribution to journalArticle

solders
Synchrotrons
solidification
Solidification
dissolving
54 Citations

Orientation informed nanoindentation of α-titanium: Indentation pileup in hexagonal metals deforming by prismatic slip

Zambaldi, C., Yang, Y., Bieler, T. R. & Raabe, D. Jan 14 2012 In : Journal of Materials Research. 27, 1, p. 356-367 12 p.

Research output: Contribution to journalArticle

Nanoindentation
nanoindentation
Titanium
indentation
Indentation

Phonon scattering in the thermal conductivity of large-grain superconducting niobium as a function of heat treatment temperature

Chandrasekaran, S. K., Bieler, T. R., Compton, C. & Wright, N. T. 2012 AIP Conference Proceedings. 57 ed. Vol. 1434, p. 976-982 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

niobium
heat treatment
thermal conductivity
scattering
temperature
45 Citations

The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints

Bieler, T. R., Zhou, B., Blair, L., Zamiri, A., Darbandi, P., Pourboghrat, F., Lee, T. K. & Liu, K. C. Feb 2012 In : Journal of Electronic Materials. 41, 2, p. 283-301 19 p.

Research output: Contribution to journalArticle

plastic anisotropy
elastic anisotropy
Microstructural evolution
Thermal cycling
solders
2011
22 Citations

Characterization and modeling of heterogeneous deformation in commercial purity titanium

Yang, Y., Wang, L., Zambaldi, C., Eisenlohr, P., Barabash, R., Liu, W., Stoudt, M. R., Crimp, M. A. & Bieler, T. R. Sep 2011 In : JOM. 63, 9, p. 66-73 8 p.

Research output: Contribution to journalArticle

Confocal microscopy
Nanoindentation
Titanium
Constitutive models
Plasticity
6 Citations

Characterization of large grain Nb ingot microstructure using EBSP mapping and Laue camera methods

Kang, D., Baars, D. C., Bieler, T. R. & Compton, C. C. 2011 AIP Conference Proceedings. Vol. 1352, p. 90-99 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

ingots
cameras
microstructure
Laue method
electrons
4 Citations

Comparison of the role of moderate heat treatment temperatures on the thermal conductivity of ingot niobium

Chandrasekaran, S. K., Bieler, T. R., Compton, C., Hartung, W. & Wright, N. T. 2011 AIP Conference Proceedings. Vol. 1352, p. 131-141 11 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

ingots
niobium
heat treatment
thermal conductivity
histories
12 Citations

Correlation between Sn grain orientation and corrosion in Sn-Ag-Cu solder interconnects

Lee, T. K., Liu, B., Zhou, B., Bieler, T. & Liu, K. C. Sep 2011 In : Journal of Electronic Materials. 40, 9, p. 1895-1902 8 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
corrosion
Corrosion
sprayers
57 Citations
plastic properties
Trace analysis
Plasticity
slip
Crystals
Grain boundaries
grain boundaries
15 Citations

Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: Die size effects

Lee, T. K., Xie, W., Zhou, B., Bieler, T. & Liu, K. C. Sep 2011 In : Journal of Electronic Materials. 40, 9, p. 1967-1976 10 p.

Research output: Contribution to journalArticle

Ball grid arrays
solders
Soldering alloys
balls
Aging of materials

Modulus enhancement and orientation in die-drawn PP-talc composites

Rane, R. H., Jayaraman, K., Bieler, T. R. & Nichols, K. L. 2011 AIChE Annual Meeting, Conference Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Brain mapping
Talc
Composite materials
25 Citations
Titanium
plastic properties
Plasticity
Atomic force microscopy
purity

Responses of carbon onions to high energy heavy ion irradiation

Alduhaileb, R. A., Xie, K., Myers, J. C., Ayres, V. M., Jacobs, B. W., McElroy, K., Bieler, T., Crimp, M., Fan, X., Ronningen, R. M., Zeller, A. F., Baumann, T. & Hirata, A. 2011 Materials Research Society Symposium Proceedings. Vol. 1298, p. 251-256 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heavy Ions
Graphite
Ion bombardment
ion irradiation
Heavy ions
4 Citations

The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints

Bieler, T. R., Zhou, B., Blair, L., Zamiri, A., Darbandi, P., Pourboghrat, F., Lee, T. K. & Liu, K. C. 2011 IEEE International Reliability Physics Symposium Proceedings. 5784538

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microstructural evolution
Anisotropy
Nucleation
Plastics
Cracks
2010

Catalyst-free GaN nanowire nucleation: Correlation of temperature-dependent nanowire orientation and growth matrix changes

McElroy, K., Ayres, V. M., Bieler, T. R., Jacobs, B. W. & Crimp, M. A. 2010 Materials Research Society Symposium Proceedings. Vol. 1206, p. 71-76 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanowires
nanowires
Nucleation
nucleation
catalysts
14 Citations
cavity resonators
niobium
radio frequencies
microscopy
electron diffraction
44 Citations
Ball grid arrays
balls
plastics
cracks
grids
73 Citations

Crystal Plasticity Finite Element Methods: In Materials Science and Engineering

Roters, F., Eisenlohr, P., Bieler, T. R. & Raabe, D. Nov 8 2010 Wiley-VCH.

Research output: Book/ReportBook

Materials science
Plasticity
Finite element method
Crystals
Elasticity
86 Citations

Cyclic twin nucleation in tin-based solder alloys

Lehman, L. P., Xing, Y., Bieler, T. R. & Cotts, E. J. Jun 2010 In : Acta Materialia. 58, 10, p. 3546-3556 11 p.

Research output: Contribution to journalArticle

Tin
Soldering alloys
Nucleation
Twinning
Microstructure
1 Citations

Development of a cryogenic mechanical property testing station for superconducting RF cavity material

Compton, C., Chandrasekaran, S. K., Baars, D., Bieler, T., Darbandi, P. & Wright, N. 2010 AIP Conference Proceedings. Vol. 1218, p. 587-594 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

cryogenic temperature
cryogenics
pressure vessels
stations
mechanical properties

Erratum: Cyclic twin nucleation in tin based solder alloys (Acta Materialia (2010) 58 (3546-3556))

Lehman, L. P., Xing, Y., Bieler, T. R. & Cotts, E. J. Oct 2010 In : Acta Materialia. 58, 18

Research output: Contribution to journalArticle

Xerogels
Soldering alloys
Tin
Nucleation
2 Citations

Foreword: Pb-free solders and emerging interconnect and packaging technologies

Lin, K. L., Kang, S. K., Duh, J. G., Lee, A., Bieler, T., Turbini, L., Sidhu, R., Guo, F. & Anderson, I. Dec 2010 In : Journal of Electronic Materials. 39, 12, p. 2503 1 p.

Research output: Contribution to journalArticle

Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects

Lee, T. K., Xie, W., Bieler, T. R., Liu, K. C. & Xue, J. 2010 43rd International Symposium on Microelectronics 2010, IMAPS 2010. p. 298-305 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ball grid arrays
Soldering alloys
Aging of materials
Thermal cycling
Microstructure

Microstructure of expanded PP-talc composites from solid-phase die drawing

Rane, R. K., Jayaraman, K., Bieler, T. R., Nichols, K. L. & Mazor, M. H. 2010 Annual Technical Conference - ANTEC, Conference Proceedings. Vol. 3, p. 1932-1937 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Drawing dies
Talc
Polypropylenes
Microstructure
Composite materials
77 Citations

Nucleation of paired twins at grain boundaries in titanium

Wang, L., Eisenlohr, P., Yang, Y., Bieler, T. R. & Crimp, M. A. Oct 2010 In : Scripta Materialia. 63, 8, p. 827-830 4 p.

Research output: Contribution to journalArticle

Titanium
Grain boundaries
Nucleation
grain boundaries
titanium
628 Citations

Overview of constitutive laws, kinematics, homogenization and multiscale methods in crystal plasticity finite-element modeling: Theory, experiments, applications

Roters, F., Eisenlohr, P., Hantcherli, L., Tjahjanto, D. D., Bieler, T. R. & Raabe, D. Feb 2010 In : Acta Materialia. 58, 4, p. 1152-1211 60 p.

Research output: Contribution to journalArticle

Plasticity
Kinematics
Crystals
Experiments
Bicrystals
3 Citations

Parameter estimation of the thermal conductivity of superconducting niobium

Chandrasekaran, S. K., Beck, J. V., Bieler, T. R., Compton, C. C. & Wright, N. T. 2010 Proceedings of the 30th International Thermal Conductivity Conference and the 18th International Thermal Expansion Symposium, Thermal Conductivity 30/Thermal Expansion 18. p. 742-749 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

niobium
thermal conductivity
Niobium
Parameter estimation
Thermal conductivity
27 Citations

Physical and mechanical metallurgy of high purity Nb for accelerator cavities

Bieler, T. R., Wright, N. T., Pourboghrat, F., Compton, C., Hartwig, K. T., Baars, D., Zamiri, A., Chandrasekaran, S., Darbandi, P., Jiang, H., Skoug, E., Balachandran, S., Ice, G. E. & Liu, W. Mar 15 2010 In : Physical Review Special Topics - Accelerators and Beams. 13, 3, 031002

Research output: Contribution to journalArticle

metallurgy
purity
accelerators
cavities
substructures
46 Citations

Sn-Ag-Cu Solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy

Lee, T. K., Zhou, B., Blair, L., Liu, K. C. & Bieler, T. R. Dec 2010 In : Journal of Electronic Materials. 39, 12, p. 2588-2597 10 p.

Research output: Contribution to journalArticle

Ball grid arrays
Thermal cycling
solders
Soldering alloys
balls

The 11th MPMD global innovations symposium: Global innovations in manufacturing of aerospace materials

Whitis, D. D., Bieler, T. R. & Miles, M. P. May 2010 In : JOM. 62, 5, p. 28-29 2 p.

Research output: Contribution to journalArticle

Innovation
Casting
Photopolymerization
Materials science
Processing
2 Citations

The interaction between grain orientation evolution and thermal cycling as a function of position in ball grid arrays using Orientation Image Microscopy

Lee, T. K., Zhou, B., Blair, L., Liu, K. C., Xue, J. & Bieler, T. R. 2010 Proceedings - Electronic Components and Technology Conference. p. 1591-1595 5 p. 5490774

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ball grid arrays
Thermal cycling
Microscopic examination
Soldering alloys
Imaging techniques
107 Citations
Twinning
Titanium
purity
Grain boundaries
slip
2009
24 Citations

Analysis of slip behavior in a single shear lap lead-free solder joint during simple shear at 25°C and 0.1/s

Bieler, T. R. & Telang, A. U. Dec 2009 In : Journal of Electronic Materials. 38, 12, p. 2694-2701 8 p.

Research output: Contribution to journalArticle

solders
Shear deformation
slip
shear
Ball grid arrays
23 Citations
solders
plastic properties
Crystal orientation
Soldering alloys
Plasticity
4 Citations

Characterization of SAC solder microstructure evolution during thermal cycling with statistical and in-situ methods

Zhou, B., Bieler, T. R., Wu, G., Zaefferer, S., Lee, T. K. & Liu, K. C. 2009 Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009. p. 158-165 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal cycling
Soldering alloys
Diffraction patterns
Microstructure
Light polarization
5 Citations

Fabrication of tantalum sheet for superconductor diffusion barriers

Balachandran, S., Hartwig, K. T., Baars, D. C., Mathaudhu, S. N., Bieler, T. R., Pyon, T. & Barber, R. E. Jun 2009 In : IEEE Transactions on Applied Superconductivity. 19, 3, p. 2606-2609 4 p., 5153239

Research output: Contribution to journalArticle

Tantalum
Diffusion barriers
tantalum
Superconducting materials
Plastic deformation
7 Citations

Grain orientation and microstructure evolution in Sn-Ag-Cu solder joints as a function of position in ball grid array packages

Lee, T. K., Zhou, B., Blair, L., Liu, K. C. & Bieler, T. R. 2009 Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009. p. 142-149 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ball grid arrays
Soldering alloys
Microstructure
Thermal cycling
Thermal aging
35 Citations

Methodology for analyzing slip behavior in ball grid array lead-free solder joints after simple shear

Zhou, B., Bieler, T. R., Lee, T. K. & Liu, K. C. Dec 2009 In : Journal of Electronic Materials. 38, 12, p. 2702-2711 10 p.

Research output: Contribution to journalArticle

Ball grid arrays
solders
balls
slip
grids
15 Citations
solders
Synchrotron radiation
synchrotron radiation
methodology
Thermal cycling
35 Citations

Microstructure and orientation evolution of the Sn phase as a function of position in ball grid arrays in Sn-Ag-Cu solder joints

Lee, T. K., Liu, K. C. & Bieler, T. R. Dec 2009 In : Journal of Electronic Materials. 38, 12, p. 2685-2693 9 p.

Research output: Contribution to journalArticle

Ball grid arrays
solders
Soldering alloys
balls
grids

Polymer orientation in polypropylene-talc composites stretched below the melting temperature

Rane, R. H., Jayaraman, K., Bieler, T. R., Nichols, K. L. & Mazor, M. H. 2009 Annual Technical Conference - ANTEC, Conference Proceedings. Vol. 3, p. 1499-1503 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Talc
Polypropylenes
Melting point
Polymers
Composite materials