Publications 1981 2018

2008
2 Citations

Applying evolutionary yield function to predicting the deformation of microstructure-sensitive high-RRR niobium

Zamiri, A., Jiang, H., Bieler, T. R. & Pourboghrat, F. Jul 2008 In : JOM. 60, 7, p. 70-75 6 p.

Research output: Research - peer-reviewArticle

niobium
microstructure
texture
material
Niobium
5 Citations
plastic properties
surface roughness
textures
plastic deformation
electrons
22 Citations

Effect of thermomechanical processing on the creep behaviour of Udimet alloy 188

Boehlert, C. J., Longanbach, S. C. & Bieler, T. R. Feb 2008 In : Philosophical Magazine. 88, 5, p. 641-664 24 p.

Research output: Research - peer-reviewArticle

Udimet alloys
grain boundaries
Creep
cracks
Crack
4 Citations

Effects of elastic modulus on deformation and recrystallization of high purity Nb

Baars, D., Jiang, H., Bieler, T. R., Zamiri, A., Pourboghrat, F. & Compton, C. 2008 Ceramic Transactions. Vol. 201, p. 391-398 8 p. (Ceramic Transactions; vol. 201)

Research output: ResearchConference contribution

Elastic moduli
Textures
Metals
Steel
Direction compound
115 Citations

Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints

Bieler, T. R., Jiang, H., Lehman, L. P., Kirkpatrick, T., Cotts, E. J. & Nandagopal, B. 2008 In : IEEE Transactions on Components and Packaging Technologies. 31, 2 SPEC. ISS., p. 370-381 12 p.

Research output: Research - peer-reviewArticle

Soldering alloys
Lead-free solders
Thermal expansion
Substrates
Tensile stress
9 Citations

On predicting nucleation of microcracks due to slip-twin interactions at grain boundaries in duplex near γ-TiAl

Kumar, D., Bieler, T. R., Eisenlohr, P., Mason, D. E., Crimp, M. A., Roters, F. & Raabe, D. Apr 2008 In : Journal of Engineering Materials and Technology, Transactions of the ASME. 130, 2, p. 210121-2101212 1891092 p.

Research output: Research - peer-reviewArticle

microcracks
slip
grain boundaries
nucleation
interactions
2007
28 Citations

Crack opening due to deformation twin shear at grain boundaries in near-γ TiAl

Simkin, B. A., Ng, B. C., Crimp, M. A. & Bieler, T. R. Jan 2007 In : Intermetallics. 15, 1, p. 55-60 6 p.

Research output: Research - peer-reviewArticle

Microcracks
Shear deformation
Grain boundaries
Cracks
Crystallography
3 Citations

Crystal orientations near welds in high RRR niobium with very large grains

Baars, D., Jiang, H., Bieler, T., Compton, C., Bauer, P. & Grimm, T. Jun 2007 In : IEEE Transactions on Applied Superconductivity. 17, 2, p. 1295-1298 4 p.

Research output: Research - peer-reviewArticle

Niobium
Crystal orientation
Welds
niobium
crystals
74 Citations

Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint

Telang, A. U., Bieler, T. R., Zamiri, A. & Pourboghrat, F. Apr 2007 In : Acta Materialia. 55, 7, p. 2265-2277 13 p.

Research output: Research - peer-reviewArticle

Strain energy
Grain growth
Soldering alloys
Lead-free solders
Tin
5 Citations

Mechanical properties of high RRR niobium with different texture

Jiang, H., Baars, D., Zamiri, A., Antonie, C., Bauer, P., Bieler, T. R., Pourboghrat, F., Compton, C. & Grimm, T. L. Jun 2007 In : IEEE Transactions on Applied Superconductivity. 17, 2, p. 1291-1294 4 p.

Research output: Research - peer-reviewArticle

niobium
textures
mechanical properties
Niobium
Textures
7 Citations

Microstructural refinement of niobium for superconducting RF cavities

Hartwig, K. T., Wang, J., Baars, D. C., Bieler, T. R., Mathaudhu, S. N. & Barber, R. E. Jun 2007 In : IEEE Transactions on Applied Superconductivity. 17, 2, p. 1305-1309 5 p.

Research output: Research - peer-reviewArticle

Niobium
Extrusion
niobium
cavities
Plastic deformation
40 Citations

Pb-free solder: New materials considerations for microelectronics processing

Borgesen, P., Bieler, T., Lehman, L. P. & Cotts, E. J. Apr 2007 In : MRS Bulletin. 32, 4, p. 360-365 6 p.

Research output: Research - peer-reviewArticle

Microelectronic processing
Soldering alloys
Lead-free solders
solders
microelectronics

Preface

Schneider, J., Mishra, R. S., Bieler, T. R., Zhu, Y. T., Morsi, K. B., Acoff, V. L., Taleff, E. M. & Valiev, R. Aug 15 2007 In : Materials Science and Engineering A. 463, 1-2, p. 1 1 p.

Research output: Research - peer-reviewArticle

1 Citations

Processing strategies for niobium sheet used in advanced superconducting particle accelerator cavities

Baars, D., Bieler, T. R., Hartwig, K. T., Jiang, H., Compton, C. & Grimm, T. L. Jun 2007 In : JOM. 59, 6, p. 50-55 6 p.

Research output: Research - peer-reviewArticle

niobium
cavity
particle
Niobium
Particle accelerators
1 Citations

Single crystal and large grain niobium research at Michigan State University

Compton, C., Aizaz, A., Baars, D., Bieler, T., Bierwagen, J., Bricker, S., Grimm, T., Hartung, W., Jiang, H., Johnson, M., Popielarski, J., Saxton, L., Antoine, C., Wagner, B. & Kneisel, P. 2007 AIP Conference Proceedings. Vol. 927, p. 98-105 8 p.

Research output: ResearchConference contribution

niobium
single crystals
accelerators
cavities
radio frequencies
17 Citations

The effects of HIP pore closure and age hardening on primary creep and tensile property variations in a TiAl XD™ alloy with 0.1 wt.% carbon

Simpkins, R. J., Rourke, M. P., Bieler, T. R. & McQuay, P. A. Aug 15 2007 In : Materials Science and Engineering A. 463, 1-2, p. 208-215 8 p.

Research output: Research - peer-reviewArticle

Age hardening
Hot isostatic pressing
Tensile properties
Creep
Carbon
2006
9 Citations

Cold rolling evolution in high purity niobium using a tapered wedge specimen

Jiang, H., Bieler, T. R., Compton, C. & Grimm, T. L. Jul 15 2006 In : Physica C: Superconductivity and its Applications. 441, 1-2, p. 118-121 4 p.

Research output: Research - peer-reviewArticle

cold rolling
niobium
wedges
purity
textures

Creep and dimensional stability of high purity niobium electron-beam welds

Jiang, H., Bieler, T. R., Compton, C. & Grimm, T. L. Jul 15 2006 In : Physica C: Superconductivity and its Applications. 441, 1-2, p. 122-125 4 p.

Research output: Research - peer-reviewArticle

dimensional stability
niobium
purity
electron beams
Niobium
29 Citations
Grain boundary sliding
Copper
Substrates
Lead-free solders
solders
78 Citations

Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints

Bieler, T. R., Jiang, H., Lehman, L. P., Kirkpatrick, T. & Cotts, E. J. 2006 Proceedings - Electronic Components and Technology Conference. Vol. 2006, p. 1462-1467 6 p. 1645849

Research output: ResearchConference contribution

Soldering alloys
Lead-free solders
Thermal expansion
Substrates
Tensile stress
12 Citations

On mechanical properties of the superconducting niobium

Zamiri, A., Pourboghrat, F., Jiang, H., Bieler, T. R., Barlat, F., Brem, J., Compton, C. & Grimm, T. L. Nov 5 2006 In : Materials Science and Engineering A. 435-436, p. 658-665 8 p.

Research output: Research - peer-reviewArticle

niobium
purity
mechanical properties
Niobium
Mechanical properties
17 Citations
Microcracks
Grain boundaries
Nucleation
microcracks
grain boundaries
2005
27 Citations
hot working
cavitation flow
misalignment
cavities
Hot working
24 Citations

Anisotropic plasticity and cavity growth during upset forging of Ti-6Al-4V

Bieler, T., Goetz, R. L. & Semiatin, S. L. Sep 25 2005 In : Materials Science and Engineering A. 405, 1-2, p. 201-213 13 p.

Research output: Research - peer-reviewArticle

Forging
Plasticity
Nucleation
forging
plastic properties
53 Citations

Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn-3.5Ag solder joint specimens

Telang, A. U. & Bieler, T. R. May 2005 In : Scripta Materialia. 52, 10, p. 1027-1031 5 p.

Research output: Research - peer-reviewArticle

solders
tin
shear
microstructure
crystals
7 Citations
solders
sliding
slip
grain boundaries
shear
107 Citations
Microstructural evolution
Textures
Aging of materials
Heat treatment
Wire
30 Citations

Fracture initiation/propagation parameters for duplex TiAl grain boundaries based on twinning, slip, crystal orientation, and boundary misorientation

Bieler, T. R., Fallahi, A., Ng, B. C., Kumar, D., Crimp, M. A., Simkin, B. A., Zamiri, A., Pourboghrat, F. & Mason, D. E. Sep 2005 In : Intermetallics. 13, 9, p. 979-984 6 p.

Research output: Research - peer-reviewArticle

Twinning
Microcracks
Crystal orientation
Grain boundaries
Cracks

Microstructural, mechanical and crystallographic texture evolutions in TI-6AL-4V

Zeng, L. & Bieler, T. R. 2005 MPMD Sixth Global Innovations Proceedings - Trends in Materials and Manufacturing Technologies for Transportation Industries and Powder Metall. Research and Development in the Transportation Industry. Bieler, T. R., Carsley, J. E., Fraser, H. L., Sears, J. W. & Smugeresky, J. E. (eds.). p. 261-266 6 p.

Research output: ResearchConference contribution

Textures
Wire
Fibers
Quenching
Mechanical properties
4 Citations

Prediction of crack paths based upon detailed microstructure characterization in a neair-γ TiAl Alloy

Ng, B. C., Bieler, T. R., Crimp, M. A. & Mason, D. E. 2005 Materials Damage Prognosis - Proceedings of a Symposium of the Materials Science and Technology 2004 Conference. Larsen, J. M., Christodoulou, L., Calcaterra, J. R., Dent, M. L., Derriso, M. M., Hardman, W. J., Wayne Jones, J. & Rusa, S. M. (eds.). p. 307-314 8 p.

Research output: ResearchConference contribution

Cracks
Microstructure
Crack propagation
Twinning
Microcracks
67 Citations

The orientation imaging microscopy of lead-free Sn-Ag solder joints

Telang, A. U. & Bieler, T. R. Jun 2005 In : JOM. 57, 6, p. 44-49 6 p.

Research output: Research - peer-reviewArticle

Grain boundary sliding
Tin
Nickel
Silver
Strain hardening
4 Citations

The role of special boundaries during solidification and microstructure evolution in lead free solder joints

Telang, A. U. & Bieler, T. R. 2005 Materials Science Forum. PART 2 ed. Vol. 495-497, p. 1419-1424 6 p. (Materials Science Forum; vol. 495-497, no. PART 2)

Research output: ResearchConference contribution

Grain boundary sliding
Tin
Shear bands
Fatigue damage
Thermal cycling
2004
87 Citations

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Telang, A. U., Bieler, T. R., Lucas, J. P., Subramanian, K. N., Lehman, L. P., Xing, Y. & Cotts, E. J. Dec 2004 In : Journal of Electronic Materials. 33, 12, p. 1412-1423 12 p.

Research output: Research - peer-reviewArticle

Tin
Grain growth
Soldering alloys
Grain boundaries
Lead-free solders
28 Citations

The role of mechanical twinning on microcrack nucleation and crack propagation in a near-γ TiAl alloy

Ng, B. C., Simkin, B. A., Crimp, M. A. & Bieler, T. R. Dec 2004 In : Intermetallics. 12, 12, p. 1317-1323 7 p.

Research output: Research - peer-reviewArticle

Twinning
Microcracks
Crack propagation
Nucleation
Cracks
2003
29 Citations

A factor to predict microcrack nucleation at γ-γ grain boundaries in TiAl

Simkin, B. A., Crimp, M. A. & Bieler, T. R. Jul 2003 In : Scripta Materialia. 49, 2, p. 149-154 6 p.

Research output: Research - peer-reviewArticle

Microcracks
Grain boundaries
Nucleation
microcracks
grain boundaries
49 Citations

A method to determine the orientation of the high-temperature beta phse from measured EBSD data for the low-temperature alpha phase in Ti-6Al-4V

Glavicic, M. G., Kobryn, P. A., Bieler, T. R. & Semiatin, S. L. Apr 15 2003 In : Materials Science and Engineering A. 346, 1-2, p. 50-59 10 p.

Research output: Research - peer-reviewArticle

phase transformations
textures
diffraction
electrons
Electron diffraction
46 Citations

An automated method to determine the orientation of the high-temperature beta phase from measured EBSD data for the low-temperature alpha-phase in Ti-6Al-4V

Glavicic, M. G., Kobryn, P. A., Bieler, T. R. & Semiatin, S. L. Jun 25 2003 In : Materials Science and Engineering A. 351, 1-2, p. 258-264 7 p.

Research output: Research - peer-reviewArticle

Electron diffraction
Temperature
diffraction
electrons
Grain boundaries
27 Citations
solders
eutectics
slip
shear
crystals
70 Citations

Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions

Guo, F., Choi, S., Subramanian, K. N., Bieler, T. R., Lucas, J. P., Achari, A. & Paruchuri, M. Jun 25 2003 In : Materials Science and Engineering A. 351, 1-2, p. 190-199 10 p.

Research output: Research - peer-reviewArticle

solders
eutectics
evaluation
Soldering alloys
Eutectics
8 Citations

Mechanical properties, microstructure, and texture of electron beam butt welds in high purity niobium

Jiang, H., Bieler, T. R., Compton, C. & Grimm, T. L. 2003 Proceedings of the IEEE Particle Accelerator Conference. Chew, J., Lucas, P. & Webber, S. (eds.). Vol. 2, p. 1359-1361 3 p.

Research output: ResearchConference contribution

Niobium
Electron beams
Welds
Textures
Mechanical properties
2 Citations

Microcrack Nucleation and Crack Propagation in Equiaxed γ TiAl

Crimp, M. A., Ng, B. C., Simkin, B. A. & Bieler, T. R. 2003 Materials Research Society Symposium - Proceedings. George, E. P., Inui, H., Mills, M. J. & Eggeler, G. (eds.). Vol. 753, p. 143-148 6 p.

Research output: ResearchConference contribution

Microcracks
Crack propagation
Nucleation
Electrons
Imaging techniques
1 Citations

Microscale characterization of deformation defects in bulk intermetallics alloys using electron channeling contrast imaging

Crimp, M. A., Simkin, B. A., Ng, B. C., Mason, D. E. & Bieler, T. R. 2003 In : Materials Science Forum. 426-432, 3, p. 1885-1890 6 p.

Research output: Research - peer-reviewArticle

Intermetallics
Imaging techniques
Defects
Electrons
microbalances
31 Citations

Orientation determination and defect analysis in the near-cubic intermetallic γ-TiAl using SACP, ECCI, and EBSD

Simkin, B. A., Ng, B. C., Bieler, T. R., Crimp, M. A. & Mason, D. E. Mar 2003 In : Intermetallics. 11, 3, p. 215-223 9 p.

Research output: Research - peer-reviewArticle

Electron diffraction
Crystal orientation
Intermetallics
Imaging techniques
Defects
3 Citations

Studies of twin activity at crack tips in near-gamma TiAL using electron channeling contrast imaging

Ng, B. C., Crimp, M. A., Bieler, T. R. & Mason, D. E. 2003 Gamma Titanium Aluminides 2003. Kim, Y. W., Clemens, H. & Rosenberger, A. H. (eds.). p. 503-508 6 p.

Research output: ResearchConference contribution

Crack tips
Cracks
Imaging techniques
Electrons
Toughness

TMS Annual Meeting: Preface

Jin, Z., Beaudoin, A., Bieler, T. R. & Radakrishnan, B. 2003 TMS Annual Meeting. Jin, Z., Beaudoin, A., Bieler, T. A. & Radhakrishnan, B. (eds.).

Research output: ResearchConference contribution

2002
44 Citations

Microstructural characterization of damage in thermomechanically fatigued Sn-Ag based solder joints

Choi, S., Lee, J. G., Subramanian, K. N., Lucas, J. P. & Bieler, T. R. Apr 2002 In : Journal of Electronic Materials. 31, 4, p. 292-297 6 p.

Research output: Research - peer-reviewArticle

solders
damage
Soldering alloys
Temperature
ramps
52 Citations

Modeling thermomechanical fatigue behavior of Sn-Ag solder joints

Lee, J. G., Telang, A., Subramanian, K. N. & Bieler, T. R. Nov 2002 In : Journal of Electronic Materials. 31, 11, p. 1152-1159 8 p.

Research output: Research - peer-reviewArticle

Soldering alloys
Fatigue of materials
solders
Temperature
damage
74 Citations

Orientation imaging studies of Sn-based electronic solder joints

Telang, A. U., Bieler, T. R., Choi, S. & Subramanian, K. N. Sep 2002 In : Journal of Materials Research. 17, 9, p. 2294-2306 13 p.

Research output: Research - peer-reviewArticle

Crystal orientation
Soldering alloys
Imaging techniques
solders
electronics
43 Citations

Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints

Lee, J. G., Guo, F., Choi, S., Subramanian, K. N., Bieler, T. R. & Lucas, J. P. Sep 2002 In : Journal of Electronic Materials. 31, 9, p. 946-952 7 p.

Research output: Research - peer-reviewArticle

Soldering alloys
solders
Fatigue of materials
cycles
Alloying elements