Publications 1981 2018

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2018

Comparison of dislocation content measured with transmission electron microscopy and micro-Laue diffraction based streak analysis

Zhang, C., Balachandran, S., Eisenlohr, P., Crimp, M. A., Boehlert, C., Xu, R. & Bieler, T. R. Feb 1 2018 In : Scripta Materialia. 144, p. 74-77 4 p.

Research output: Research - peer-reviewArticle

Diffraction
Transmission electron microscopy
transmission electron microscopy
diffraction
Burgers vector
2017

Development of low angle grain boundaries in lightly deformed superconducting niobium and their influence on hydride distribution and flux perturbation

Sung, Z. H., Wang, M., Polyanskii, A. A., Santosh, C., Balachandran, S., Compton, C., Larbalestier, D. C., Bieler, T. R. & Lee, P. J. May 21 2017 In : Journal of Applied Physics. 121, 19, 193903

Research output: Research - peer-reviewArticle

niobium
hydrides
grain boundaries
perturbation
radio frequencies
2 Citations

Direct measurement of critical resolved shear stress of prismatic and basal slip in polycrystalline Ti using high energy X-ray diffraction microscopy

Wang, L., Zheng, Z., Phukan, H., Kenesei, P., Park, J. S., Lind, J., Suter, R. M. & Bieler, T. R. Jun 15 2017 In : Acta Materialia. 132, p. 598-610 13 p.

Research output: Research - peer-reviewArticle

Shear stress
Microscopic examination
X ray diffraction
Experiments
Plastic deformation

Microstructural impact on flank wear during turning of various Ti-6Al-4V alloys

Nguyen, D., Kang, D., Bieler, T., Park, K. & Kwon, P. 2017 In : Wear. 384-385, p. 72-83 12 p.

Research output: Research - peer-reviewArticle

Wear of materials
Microstructure
titanium alloy (TiAl6V4)
microstructure
Titanium alloys

Subsurface Grain Morphology Reconstruction by Differential Aperture X-ray Microscopy

Eisenlohr, P., Shanthraj, P., Vande Kieft, B. R., Bieler, T. R., Liu, W. & Xu, R. Jun 1 2017 In : JOM. 69, 6, p. 1100-1105 6 p.

Research output: Research - peer-reviewArticle

Microscopic examination
X rays
Surface reconstruction
Crystal microstructure
Crystal orientation
2016

Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Lee, T. K., Chen, Z., Baty, G., Bieler, T. R. & Kim, C. U. Sep 6 2016 (Accepted/In press) In : Journal of Electronic Materials. p. 1-7 7 p.

Research output: Research - peer-reviewArticle

mechanical shock
temperature
Temperature
masks
shock
5 Citations

Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

Zhou, Q., Zhou, B., Lee, T. K. & Bieler, T. Feb 2 2016 (Accepted/In press) In : Journal of Electronic Materials. p. 1-12 12 p.

Research output: Research - peer-reviewArticle

solders
packaging
chips
wafers
cycles
8 Citations

Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

Mukherjee, S., Zhou, B., Dasgupta, A. & Bieler, T. R. Mar 1 2016 In : International Journal of Plasticity. 78, p. 1-25 25 p.

Research output: Research - peer-reviewArticle

Soldering alloys
Creep
Single crystals
Eutectics
Direction compound
3 Citations
Nanoindentation
Titanium
Indentation
Plasticity
Grain boundaries

The Origin of Flank Wear in Turning Ti-6Al-4V

Nguyen, T., Kwon, P., Kang, D. & Bieler, T. R. Dec 1 2016 In : Journal of Manufacturing Science and Engineering, Transactions of the ASME. 138, 12, 121013

Research output: Research - peer-reviewArticle

Titanium
Wear of materials
Titanium alloys
Crystals
Machining
2015
18 Citations
Plasticity
Finite element method
Crystals
Microstructure
Structural metals
substructures
niobium
histories
damage
cavities
5 Citations
tensile deformation
examination
slip
grain boundaries
scanning electron microscopy

Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

Lee, T. K., Bieler, T. R. & Kim, C. U. Nov 20 2015 (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Research - peer-reviewArticle

mechanical shock
solders
cooling
cycles
Thermal cycling
4 Citations

Nanoscale nonlinear radio frequency properties of bulk Nb: Origins of extrinsic nonlinear effects

Tai, T., Ghamsari, B. G., Bieler, T. & Anlage, S. M. Oct 16 2015 In : Physical Review B - Condensed Matter and Materials Physics. 92, 13, 134513

Research output: Research - peer-reviewArticle

radio frequencies
microscopes
microwaves
cavities
defects
11 Citations

Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages

Zhou, B., Zhou, Q., Bieler, T. R. & Lee, T. K. 2015 In : Journal of Electronic Materials. 44, 3, p. 895-908 14 p.

Research output: Research - peer-reviewArticle

Chip scale packages
Thermal cycling
Crystal orientation
Microstructure
slip
5 Citations

The tensile and tensile-creep deformation behavior of Ti-8Al-1Mo-1V(wt%)

Dastidar, I. G., Khademi, V., Bieler, T. R., Pilchak, A. L., Crimp, M. A. & Boehlert, C. J. Jun 1 2015 In : Materials Science and Engineering A. 636, p. 289-300 12 p.

Research output: Research - peer-reviewArticle

Titanium
Creep
Temperature
tensile creep
slip
2014
6 Citations
Creep
Scanning electron microscopy
Experiments
slip
scanning electron microscopy
8 Citations
Plasticity
Crystals
Microstructure
Lead-free solders
Solder Joint
2 Citations

Evolution of crystalline orientation and texture during solid phase die-drawing of PP-talc composites

Rane, R. H., Jayaraman, K., Nichols, K. L., Bieler, T. R. & Mazor, M. H. Dec 1 2014 In : Journal of Polymer Science, Part B: Polymer Physics. 52, 23, p. 1528-1538 11 p.

Research output: Research - peer-reviewArticle

Drawing dies
Talc
Crystal orientation
Textures
Crystalline materials
42 Citations

Grain boundaries and interfaces in slip transfer

Bieler, T. R., Eisenlohr, P., Zhang, C., Phukan, H. J. & Crimp, M. A. 2014 In : Current Opinion in Solid State and Materials Science. 18, 4, p. 212-226 15 p.

Research output: Research - peer-reviewArticle

Grain boundaries
Nucleation
Tantalum
Polycrystals
Microstructure
5 Citations

Grain boundary responses to heterogeneous deformation in tantalum polycrystals

Bieler, T. R., Sutton, S. C., Dunlap, B. E., Keith, Z. A., Eisenlohr, P., Crimp, M. A. & Boyce, B. L. Jan 2014 In : JOM. 66, 1, p. 121-128 8 p.

Research output: Research - peer-reviewArticle

Tantalum
Polycrystals
Grain boundaries
Dislocations (crystals)
Electrons
17 Citations

Influence of high-g mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects

Lee, T. K., Kim, C. U. & Bieler, T. R. Jan 2014 In : Journal of Electronic Materials. 43, 1, p. 69-79 11 p.

Research output: Research - peer-reviewArticle

Crystal microstructure
Thermal cycling
Soldering alloys
Grain boundaries
mechanical shock
30 Citations

In situ characterization of twin nucleation in pure Ti using 3D-XRD

Bieler, T. R., Wang, L., Beaudoin, A. J., Kenesei, P. & Lienert, U. Jan 2014 In : Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 45, 1, p. 109-122 14 p.

Research output: Research - peer-reviewArticle

Nucleation
nucleation
Shear stress
X ray diffraction
slip
14 Citations

Mechanical twinning and detwinning in pure Ti during loading and unloading - An in situ high-energy X-ray diffraction microscopy study

Wang, L., Lind, J., Phukan, H., Kenesei, P., Park, J. S., Suter, R. M., Beaudoin, A. J. & Bieler, T. R. Dec 1 2014 In : Scripta Materialia. 92, p. 35-38 4 p.

Research output: Research - peer-reviewArticle

mechanical twinning
unloading
shear stress
microscopy
diffraction
12 Citations

Microstructure and sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications

Zhou, B., Muralidharan, G., Kurumadalli, K., Parish, C. M., Leslie, S. & Bieler, T. R. Jan 2014 In : Journal of Electronic Materials. 43, 1, p. 57-68 12 p.

Research output: Research - peer-reviewArticle

Thermal cycling
Crystal orientation
Packaging
Microstructure
Temperature
5 Citations

Multiscale modeling of the effect of micro-alloying Mn and Sb on the viscoplastic response of SAC105 solder

Mukherjee, S., Dasgupta, A., Zhou, B. & Bieler, T. R. 2014 In : Journal of Electronic Materials. 43, 4, p. 1119-1130 12 p.

Research output: Research - peer-reviewArticle

solders
alloying
Alloying
Soldering alloys
Creep
5 Citations

Near-field microwave magnetic nanoscopy of superconducting radio frequency cavity materials

Tai, T., Ghamsari, B. G., Bieler, T. R., Tan, T., Xi, X. X. & Anlage, S. M. Jun 9 2014 In : Applied Physics Letters. 104, 23, 232603

Research output: Research - peer-reviewArticle

near fields
radio frequencies
microwaves
cavities
harmonics
15 Citations
Carbides
Diamonds
Wear of materials
Phase transitions
Dissolution
10 Citations
drop tests
solders
misalignment
cooling
microstructure
2013
14 Citations

Characterization of recrystallization and microstructure evolution in lead-free solder joints using EBSD and 3D-XRD

Zhou, B., Bieler, T. R., Lee, T. K. & Liu, W. 2013 In : Journal of Electronic Materials. 42, 2, p. 319-331 13 p.

Research output: Research - peer-reviewArticle

Thermal cycling
Electron diffraction
Grain boundaries
Cracks
Microstructure
16 Citations
slip
titanium
tensile creep
twinning
temperature
12 Citations

Crystal plasticity finite-element analysis of deformation behavior in multiple-grained lead-free solder joints

Darbandi, P., Bieler, T. R., Pourboghrat, F. & Lee, T. K. 2013 In : Journal of Electronic Materials. 42, 2, p. 201-214 14 p.

Research output: Research - peer-reviewArticle

Plasticity
Finite element method
Crystals
Lead-free solders
solders
39 Citations
Trace analysis
Shear stress
Temperature
Alloying
Testing
12 Citations

Microstructural characterization of polycrystalline materials by synchrotron X-rays

Wang, L., Li, M., Almer, J., Bieler, T. & Barabash, R. Jun 2013 In : Frontiers of Materials Science. 7, 2, p. 156-169 14 p.

Research output: Research - peer-reviewArticle

Polycrystalline materials
Synchrotrons
X rays
Microscopic examination
Crystal microstructure
2 Citations

Nb tubes for seamless SRF cavities

Balachandran, S., Elwell, R. C., Kang, D., Barber, R. E., Bieler, T. R. & Hartwig, K. T. 2013 In : IEEE Transactions on Applied Superconductivity. 23, 3, 6422352

Research output: Research - peer-reviewArticle

niobium
tubes
cavities
Niobium
hydroforming
22 Citations

Study of {112̄1} Twinning in α-Ti by EBSD and Laue Microdiffraction

Wang, L., Barabash, R., Bieler, T., Liu, W. & Eisenlohr, P. Aug 2013 In : Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 44, 8, p. 3664-3674 11 p.

Research output: Research - peer-reviewArticle

twinning
electron diffraction
matrices
Twinning
Electron diffraction
11 Citations

The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance

Lee, T. K., Zhou, B., Bieler, T. R., Tseng, C. F. & Duh, J. G. 2013 In : Journal of Electronic Materials. 42, 2, p. 215-223 9 p.

Research output: Research - peer-reviewArticle

mechanical shock
solders
shock
Soldering alloys
Masks
2012
14 Citations
slip
scanning electron microscopy
grain boundaries
ledges
misalignment
26 Citations
Microstructure
slip
microstructure
Trace analysis
Burgers vector
3 Citations

Foreword: Deformation and transitions at grain boundaries

Bieler, T. R., Barabash, R., Spearot, D., Luo, J. & Dillon, S. Oct 2012 In : Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 43, 10, p. 3515-3516 2 p.

Research output: Research - peer-reviewArticle

11 Citations
Chip scale packages
Soldering alloys
Aging of materials
Thermal aging
Microstructural evolution
15 Citations
mechanical shock
crack propagation
solders
shock
microstructure
7 Citations

In situ synchrotron characterization of melting, dissolution, and resolidification in lead-free solders

Zhou, B., Bieler, T. R., Wu, G., Zaefferer, S., Lee, T. K. & Liu, K. C. Feb 2012 In : Journal of Electronic Materials. 41, 2, p. 262-272 11 p.

Research output: Research - peer-reviewArticle

solders
solidification
dissolving
synchrotrons
melting
51 Citations

Orientation informed nanoindentation of α-titanium: Indentation pileup in hexagonal metals deforming by prismatic slip

Zambaldi, C., Yang, Y., Bieler, T. R. & Raabe, D. Jan 14 2012 In : Journal of Materials Research. 27, 1, p. 356-367 12 p.

Research output: Research - peer-reviewArticle

nanoindentation
indentation
slip
titanium
metals
39 Citations

The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints

Bieler, T. R., Zhou, B., Blair, L., Zamiri, A., Darbandi, P., Pourboghrat, F., Lee, T. K. & Liu, K. C. Feb 2012 In : Journal of Electronic Materials. 41, 2, p. 283-301 19 p.

Research output: Research - peer-reviewArticle

Microstructural evolution
Thermal cycling
Soldering alloys
Anisotropy
Plastics
2011
20 Citations

Characterization and modeling of heterogeneous deformation in commercial purity titanium

Yang, Y., Wang, L., Zambaldi, C., Eisenlohr, P., Barabash, R., Liu, W., Stoudt, M. R., Crimp, M. A. & Bieler, T. R. Sep 2011 In : JOM. 63, 9, p. 66-73 8 p.

Research output: Research - peer-reviewArticle

Confocal microscopy
Nanoindentation
Titanium
Constitutive models
Plasticity
12 Citations

Correlation between Sn grain orientation and corrosion in Sn-Ag-Cu solder interconnects

Lee, T. K., Liu, B., Zhou, B., Bieler, T. & Liu, K. C. Sep 2011 In : Journal of Electronic Materials. 40, 9, p. 1895-1902 8 p.

Research output: Research - peer-reviewArticle

solders
corrosion
Soldering alloys
Corrosion
sprayers
52 Citations
Plasticity
Crystals
plastic properties
slip
crystals