Publications 1981 2018

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2018

Comparison of dislocation content measured with transmission electron microscopy and micro-Laue diffraction based streak analysis

Zhang, C., Balachandran, S., Eisenlohr, P., Crimp, M. A., Boehlert, C., Xu, R. & Bieler, T. R. Feb 1 2018 In : Scripta Materialia. 144, p. 74-77 4 p.

Research output: Contribution to journalArticle

Diffraction
Transmission electron microscopy
transmission electron microscopy
diffraction
Burgers vector
Tamper resistant packaging
Yttria stabilized zirconia
Wetting
Silver
Adhesion

Exploring the accuracy limits of lattice strain quantification with synthetic diffraction data

Zhang, C., Bieler, T. R. & Eisenlohr, P. Sep 1 2018 In : Scripta Materialia. 154, p. 127-130 4 p.

Research output: Contribution to journalArticle

Diffraction
Scattering
regression analysis
Synchrotrons
diffraction
1 Citations

Transient porous nickel interlayers for improved silver-based Solid Oxide Fuel Cell brazes

Zhou, Q., Bieler, T. R. & Nicholas, J. D. Apr 15 2018 In : Acta Materialia. 148, p. 156-162 7 p.

Research output: Contribution to journalArticle

Yttria stabilized zirconia
Solid oxide fuel cells (SOFC)
Nickel
Silver
Wetting
2017

Development of low angle grain boundaries in lightly deformed superconducting niobium and their influence on hydride distribution and flux perturbation

Sung, Z. H., Wang, M., Polyanskii, A. A., Santosh, C., Balachandran, S., Compton, C., Larbalestier, D. C., Bieler, T. R. & Lee, P. J. May 21 2017 In : Journal of Applied Physics. 121, 19, 193903

Research output: Contribution to journalArticle

niobium
hydrides
grain boundaries
perturbation
radio frequencies
5 Citations

Direct measurement of critical resolved shear stress of prismatic and basal slip in polycrystalline Ti using high energy X-ray diffraction microscopy

Wang, L., Zheng, Z., Phukan, H., Kenesei, P., Park, J. S., Lind, J., Suter, R. M. & Bieler, T. R. Jun 15 2017 In : Acta Materialia. 132, p. 598-610 13 p.

Research output: Contribution to journalArticle

Shear stress
Microscopic examination
X ray diffraction
Plastic deformation
Experiments

Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints

Zuo, Y., Bieler, T. R., Zhou, Q., Ma, L. & Guo, F. Dec 6 2017 (Accepted/In press) In : Journal of Electronic Materials. p. 1-15 15 p.

Research output: Contribution to journalArticle

Silver alloys
tin alloys
Tin alloys
silver alloys
Neutron activation analysis

Microstructural impact on flank wear during turning of various Ti-6Al-4V alloys

Nguyen, D., Kang, D., Bieler, T., Park, K. & Kwon, P. 2017 In : Wear. 384-385, p. 72-83 12 p.

Research output: Contribution to journalArticle

Wear of materials
microstructure
Microstructure
titanium alloys
inserts
1 Citations

Subsurface Grain Morphology Reconstruction by Differential Aperture X-ray Microscopy

Eisenlohr, P., Shanthraj, P., Vande Kieft, B. R., Bieler, T. R., Liu, W. & Xu, R. Jun 1 2017 In : JOM. 69, 6, p. 1100-1105 6 p.

Research output: Contribution to journalArticle

Microscopic examination
X rays
Surface reconstruction
Crystal microstructure
Crystal orientation
2016

Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Lee, T. K., Chen, Z., Baty, G., Bieler, T. R. & Kim, C. U. Sep 6 2016 (Accepted/In press) In : Journal of Electronic Materials. p. 1-7 7 p.

Research output: Contribution to journalArticle

mechanical shock
masks
shock
shock tests
Masks
9 Citations

Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

Zhou, Q., Zhou, B., Lee, T. K. & Bieler, T. Feb 2 2016 (Accepted/In press) In : Journal of Electronic Materials. p. 1-12 12 p.

Research output: Contribution to journalArticle

Microstructural evolution
Thermal cycling
solders
packaging
Soldering alloys
13 Citations

Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

Mukherjee, S., Zhou, B., Dasgupta, A. & Bieler, T. R. Mar 1 2016 In : International Journal of Plasticity. 78, p. 1-25 25 p.

Research output: Contribution to journalArticle

Soldering alloys
Creep
Single crystals
Eutectics
Dislocations (crystals)
7 Citations
Nanoindentation
Titanium
Indentation
Plasticity
Grain boundaries
1 Citations

The Origin of Flank Wear in Turning Ti-6Al-4V

Nguyen, T., Kwon, P., Kang, D. & Bieler, T. R. Dec 1 2016 In : Journal of Manufacturing Science and Engineering, Transactions of the ASME. 138, 12, 121013

Research output: Contribution to journalArticle

Titanium alloys
Titanium
Wear of materials
Machining
Crystals
2015
25 Citations
Plasticity
Finite element method
Crystals
Microstructure
Structural metals
1 Citations
substructures
niobium
histories
damage
cavities
10 Citations
tensile deformation
examination
slip
grain boundaries
tensile creep
8 Citations

Nanoscale nonlinear radio frequency properties of bulk Nb: Origins of extrinsic nonlinear effects

Tai, T., Ghamsari, B. G., Bieler, T. & Anlage, S. M. Oct 16 2015 In : Physical Review B - Condensed Matter and Materials Physics. 92, 13, 134513

Research output: Contribution to journalArticle

radio frequencies
Microscopes
microscopes
Microwaves
Niobium
16 Citations

Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages

Zhou, B., Zhou, Q., Bieler, T. R. & Lee, T. K. 2015 In : Journal of Electronic Materials. 44, 3, p. 895-908 14 p.

Research output: Contribution to journalArticle

Chip scale packages
Thermal cycling
Crystal orientation
slip
chips
6 Citations

The tensile and tensile-creep deformation behavior of Ti-8Al-1Mo-1V(wt%)

Dastidar, I. G., Khademi, V., Bieler, T. R., Pilchak, A. L., Crimp, M. A. & Boehlert, C. J. Jun 1 2015 In : Materials Science and Engineering A. 636, p. 289-300 12 p.

Research output: Contribution to journalArticle

tensile creep
Titanium
Creep
slip
titanium
2014
6 Citations
Twinning
Creep
slip
twinning
Scanning electron microscopy
9 Citations
Solder Joint
Crystal Plasticity
solders
plastic properties
Tin
2 Citations

Evolution of crystalline orientation and texture during solid phase die-drawing of PP-talc composites

Rane, R. H., Jayaraman, K., Nichols, K. L., Bieler, T. R. & Mazor, M. H. Dec 1 2014 In : Journal of Polymer Science, Part B: Polymer Physics. 52, 23, p. 1528-1538 11 p.

Research output: Contribution to journalArticle

Drawing dies
Talc
talc
Crystal orientation
solid phases
49 Citations

Grain boundaries and interfaces in slip transfer

Bieler, T. R., Eisenlohr, P., Zhang, C., Phukan, H. J. & Crimp, M. A. 2014 In : Current Opinion in Solid State and Materials Science. 18, 4, p. 212-226 15 p.

Research output: Contribution to journalArticle

Grain boundaries
Nucleation
Tantalum
Polycrystals
Microstructure
5 Citations

Grain boundary responses to heterogeneous deformation in tantalum polycrystals

Bieler, T. R., Sutton, S. C., Dunlap, B. E., Keith, Z. A., Eisenlohr, P., Crimp, M. A. & Boyce, B. L. Jan 2014 In : JOM. 66, 1, p. 121-128 8 p.

Research output: Contribution to journalArticle

Tantalum
Polycrystals
Grain boundaries
Dislocations (crystals)
Electrons
19 Citations

Influence of high-g mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects

Lee, T. K., Kim, C. U. & Bieler, T. R. Jan 2014 In : Journal of Electronic Materials. 43, 1, p. 69-79 11 p.

Research output: Contribution to journalArticle

mechanical shock
Crystal microstructure
Thermal cycling
solders
Soldering alloys
37 Citations

In situ characterization of twin nucleation in pure Ti using 3D-XRD

Bieler, T. R., Wang, L., Beaudoin, A. J., Kenesei, P. & Lienert, U. Jan 2014 In : Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 45, 1, p. 109-122 14 p.

Research output: Contribution to journalArticle

Nucleation
nucleation
Shear stress
slip
X ray diffraction
18 Citations

Mechanical twinning and detwinning in pure Ti during loading and unloading - An in situ high-energy X-ray diffraction microscopy study

Wang, L., Lind, J., Phukan, H., Kenesei, P., Park, J. S., Suter, R. M., Beaudoin, A. J. & Bieler, T. R. Dec 1 2014 In : Scripta Materialia. 92, p. 35-38 4 p.

Research output: Contribution to journalArticle

mechanical twinning
unloading
Twinning
Unloading
shear stress
16 Citations

Microstructure and sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications

Zhou, B., Muralidharan, G., Kurumadalli, K., Parish, C. M., Leslie, S. & Bieler, T. R. Jan 2014 In : Journal of Electronic Materials. 43, 1, p. 57-68 12 p.

Research output: Contribution to journalArticle

Thermal cycling
solders
packaging
Crystal orientation
Packaging
6 Citations

Multiscale modeling of the effect of micro-alloying Mn and Sb on the viscoplastic response of SAC105 solder

Mukherjee, S., Dasgupta, A., Zhou, B. & Bieler, T. R. 2014 In : Journal of Electronic Materials. 43, 4, p. 1119-1130 12 p.

Research output: Contribution to journalArticle

solders
Alloying
Soldering alloys
alloying
creep strength
6 Citations

Near-field microwave magnetic nanoscopy of superconducting radio frequency cavity materials

Tai, T., Ghamsari, B. G., Bieler, T. R., Tan, T., Xi, X. X. & Anlage, S. M. Jun 9 2014 In : Applied Physics Letters. 104, 23, 232603

Research output: Contribution to journalArticle

near fields
radio frequencies
microwaves
cavities
microwave probes
17 Citations
Carbides
Diamonds
Wear of materials
Phase transitions
Dissolution
15 Citations
drop tests
solders
Shock testing
misalignment
Soldering alloys
2013
17 Citations

Characterization of recrystallization and microstructure evolution in lead-free solder joints using EBSD and 3D-XRD

Zhou, B., Bieler, T. R., Lee, T. K. & Liu, W. 2013 In : Journal of Electronic Materials. 42, 2, p. 319-331 13 p.

Research output: Contribution to journalArticle

Thermal cycling
solders
Electron diffraction
Grain boundaries
Cracks
19 Citations

Comparison of the deformation behaviour of commercially pure titanium and Ti-5Al-2.5Sn(wt.%) at 296 and 728 K

Li, H., Mason, D. E., Yang, Y., Bieler, T. R., Crimp, M. A. & Boehlert, C. J. Jul 1 2013 In : Philosophical Magazine. 93, 21, p. 2875-2895 21 p.

Research output: Contribution to journalArticle

slip
titanium
tensile creep
twinning
creep tests
15 Citations

Crystal plasticity finite-element analysis of deformation behavior in multiple-grained lead-free solder joints

Darbandi, P., Bieler, T. R., Pourboghrat, F. & Lee, T. K. 2013 In : Journal of Electronic Materials. 42, 2, p. 201-214 14 p.

Research output: Contribution to journalArticle

solders
plastic properties
Plasticity
Finite element method
Crystals
44 Citations

Methodology for estimating the critical resolved shear stress ratios of α-phase Ti using EBSD-based trace analysis

Li, H., Mason, D. E., Bieler, T. R., Boehlert, C. J. & Crimp, M. A. Dec 2013 In : Acta Materialia. 61, 20, p. 7555-7567 13 p.

Research output: Contribution to journalArticle

Trace analysis
Shear stress
Alloying
Temperature
Testing
14 Citations

Microstructural characterization of polycrystalline materials by synchrotron X-rays

Wang, L., Li, M., Almer, J., Bieler, T. & Barabash, R. Jun 2013 In : Frontiers of Materials Science. 7, 2, p. 156-169 14 p.

Research output: Contribution to journalArticle

Polycrystalline materials
Synchrotrons
X rays
Microscopic examination
Crystal microstructure
2 Citations

Nb tubes for seamless SRF cavities

Balachandran, S., Elwell, R. C., Kang, D., Barber, R. E., Bieler, T. R. & Hartwig, K. T. 2013 In : IEEE Transactions on Applied Superconductivity. 23, 3, 6422352

Research output: Contribution to journalArticle

Niobium
hydroforming
niobium
tubes
cavities
26 Citations

Study of {112̄1} Twinning in α-Ti by EBSD and Laue Microdiffraction

Wang, L., Barabash, R., Bieler, T., Liu, W. & Eisenlohr, P. Aug 2013 In : Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 44, 8, p. 3664-3674 11 p.

Research output: Contribution to journalArticle

Twinning
twinning
Electron diffraction
electron diffraction
matrices
11 Citations

The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance

Lee, T. K., Zhou, B., Bieler, T. R., Tseng, C. F. & Duh, J. G. 2013 In : Journal of Electronic Materials. 42, 2, p. 215-223 9 p.

Research output: Contribution to journalArticle

mechanical shock
solders
Soldering alloys
shock
Masks
2012
15 Citations
slip
ledges
grain boundaries
scanning electron microscopy
misalignment
31 Citations
Trace analysis
Burgers vector
slip
microstructure
Microstructure
2 Citations
Electron diffraction
slip
titanium
Titanium
Imaging techniques
3 Citations

Foreword: Deformation and transitions at grain boundaries

Bieler, T. R., Barabash, R., Spearot, D., Luo, J. & Dillon, S. Oct 2012 In : Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 43, 10, p. 3515-3516 2 p.

Research output: Contribution to journalArticle

Grain boundaries
grain boundaries
12 Citations
Chip scale packages
Soldering alloys
Aging of materials
Thermal aging
Microstructural evolution
15 Citations
mechanical shock
crack propagation
solders
Soldering alloys
Crack propagation
7 Citations

In situ synchrotron characterization of melting, dissolution, and resolidification in lead-free solders

Zhou, B., Bieler, T. R., Wu, G., Zaefferer, S., Lee, T. K. & Liu, K. C. Feb 2012 In : Journal of Electronic Materials. 41, 2, p. 262-272 11 p.

Research output: Contribution to journalArticle

solders
Synchrotrons
solidification
Solidification
dissolving
54 Citations

Orientation informed nanoindentation of α-titanium: Indentation pileup in hexagonal metals deforming by prismatic slip

Zambaldi, C., Yang, Y., Bieler, T. R. & Raabe, D. Jan 14 2012 In : Journal of Materials Research. 27, 1, p. 356-367 12 p.

Research output: Contribution to journalArticle

Nanoindentation
nanoindentation
Titanium
indentation
Indentation
45 Citations

The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints

Bieler, T. R., Zhou, B., Blair, L., Zamiri, A., Darbandi, P., Pourboghrat, F., Lee, T. K. & Liu, K. C. Feb 2012 In : Journal of Electronic Materials. 41, 2, p. 283-301 19 p.

Research output: Contribution to journalArticle

plastic anisotropy
elastic anisotropy
Microstructural evolution
Thermal cycling
solders