3-D Printed Air Substrates for the Design and Fabrication of RF Components

Mohd Ifwat Mohd Ghazali, Saranraj Karuppuswami, Amanpreet Kaur, Premjeet Chahal

Research output: Contribution to journalArticle

  • 1 Citations

Abstract

This paper presents the fabrication and characterization of radio frequency (RF) and microwave passive structures on an air substrate using additive manufacturing (3-D printing). The air substrate is realized by 3-D printing RF structures in two separate pieces and snapped together face to face using a LEGO-like process. Spacers printed on the periphery provide the desired air substrate thickness. Metal patterning on nonplanar printed plastic structures is carried out using a damascene-like process. Various RF structures such as low dispersion transmission line, T-line resonator, high-gain patch antenna, slot antenna, and cavity resonator are demonstrated using this process. Good performance is achieved; for example, measured 50-$\Omega $ transmission line shows low loss of 0.17 dB/cm at 4 GHz, and a patch antenna (center frequency of 4.5 GHz) shows gain and bandwidth of 7.6 dB and 0.2 GHz, respectively. Details of both measured and simulation results are presented.

LanguageEnglish (US)
Article number7898849
Pages982-989
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume7
Issue number6
DOIs
StatePublished - Jun 1 2017

Profile

Microstrip antennas
Fabrication
Printing
Electric lines
Substrates
3D printers
Air
Slot antennas
Cavity resonators
Resonators
Metals
Microwaves
Plastics
Bandwidth

Keywords

  • Additive manufacturing (AM)
  • air substrate
  • damascene process
  • lightweight
  • low loss
  • radio frequency (RF) components

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

3-D Printed Air Substrates for the Design and Fabrication of RF Components. / Ghazali, Mohd Ifwat Mohd; Karuppuswami, Saranraj; Kaur, Amanpreet; Chahal, Premjeet.

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, No. 6, 7898849, 01.06.2017, p. 982-989.

Research output: Contribution to journalArticle

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