3D Printed Out-of-Plane Antennas for Use on High Density Boards

Mohd Ifwat Mohd Ghazali, Jennifer A. Byford, Saranraj Karuppuswami, Amanpreet Kaur, James Lennon, Premjeet Chahal

Research output: ResearchConference contribution

Abstract

This paper presents out-of-plane antenna designs for use on high density boards. These antennas are fabricated using 3D plastic printing (additive manufacturing) and subsequent metallization. Various out-of-plane microwave structures including a transmission line, vertical mount microstrip patch antenna, elevated patch antenna, air-lifted patch antenna, and a monopole antenna are demonstrated. These antennas can be integrated directly on packaged chips or mounted vertically on high density electrical boards. Metal patterning on these non-planar structures is carried out using a damascene like process. Details of simulation, fabrication, and measurements are presented.

LanguageEnglish (US)
Title of host publicationProceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1835-1842
Number of pages8
ISBN (Electronic)9781509043323
DOIs
StatePublished - Aug 1 2017
Event67th IEEE Electronic Components and Technology Conference, ECTC 2017 - Lake Buena Vista, United States
Duration: May 30 2017Jun 2 2017

Other

Other67th IEEE Electronic Components and Technology Conference, ECTC 2017
CountryUnited States
CityLake Buena Vista
Period5/30/176/2/17

Profile

Microstrip antennas
Antennas
3D printers
Monopole antennas
Metallizing
Printing
Electric lines
Metals
Microwaves
Plastics
Fabrication
Air

Keywords

  • Addivitve Manufacturing
  • High Density Integration
  • Non-planar antennas
  • RF components

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Ghazali, M. I. M., Byford, J. A., Karuppuswami, S., Kaur, A., Lennon, J., & Chahal, P. (2017). 3D Printed Out-of-Plane Antennas for Use on High Density Boards. In Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017 (pp. 1835-1842). [7999931] Institute of Electrical and Electronics Engineers Inc.. DOI: 10.1109/ECTC.2017.275

3D Printed Out-of-Plane Antennas for Use on High Density Boards. / Ghazali, Mohd Ifwat Mohd; Byford, Jennifer A.; Karuppuswami, Saranraj; Kaur, Amanpreet; Lennon, James; Chahal, Premjeet.

Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1835-1842 7999931.

Research output: ResearchConference contribution

Ghazali, MIM, Byford, JA, Karuppuswami, S, Kaur, A, Lennon, J & Chahal, P 2017, 3D Printed Out-of-Plane Antennas for Use on High Density Boards. in Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017., 7999931, Institute of Electrical and Electronics Engineers Inc., pp. 1835-1842, 67th IEEE Electronic Components and Technology Conference, ECTC 2017, Lake Buena Vista, United States, 5/30/17. DOI: 10.1109/ECTC.2017.275
Ghazali MIM, Byford JA, Karuppuswami S, Kaur A, Lennon J, Chahal P. 3D Printed Out-of-Plane Antennas for Use on High Density Boards. In Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc.2017. p. 1835-1842. 7999931. Available from, DOI: 10.1109/ECTC.2017.275
Ghazali, Mohd Ifwat Mohd ; Byford, Jennifer A. ; Karuppuswami, Saranraj ; Kaur, Amanpreet ; Lennon, James ; Chahal, Premjeet. / 3D Printed Out-of-Plane Antennas for Use on High Density Boards. Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1835-1842
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