A versatile approach to selective and inexpensive copper patterns using polyelectrolyte multilayer coatings

Troy R. Hendricks, Ilsoon Lee

Research output: Contribution to journalArticle

  • 21 Citations

Abstract

Versatile, highly selective, and inexpensive metal patterning techniques on various substrates are demanded for current research in microelectronic device fabrications. We present a new process for creating highly selective and cost-effective copper patterns that can be plated on virtually any substrate including plastics by combining polyelectrolyte multilayer (PEM) coatings, microcontact printing, and electroless deposition. Optical microscope, atomic force microscopy and energy dispersive X-ray spectroscopy were used to show the resulting copper structures exclusively plated where the patterned catalyst was electrostatically bound to the PEM coated surfaces. The copper plating rate was measured using a quartz crystal microbalance. The unpatterned polyelectrolyte surfaces are still active and can be used with additional processing to create complicated three dimensional metal architectures or even bimetallic patterns.

LanguageEnglish (US)
Pages2347-2352
Number of pages6
JournalThin Solid Films
Volume515
Issue number4
DOIs
StatePublished - Dec 5 2006

Profile

Polyelectrolytes
Copper
Multilayers
coatings
copper
Coatings
Metals
Copper plating
electroless deposition
Electroless plating
Quartz crystal microbalances
Substrates
quartz crystals
optical microscopes
plating
microelectronics
Microelectronics
printing
microbalances
metals

Keywords

  • Metallization
  • Microcontact printing
  • Multilayers
  • Polyelectrolyte

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

A versatile approach to selective and inexpensive copper patterns using polyelectrolyte multilayer coatings. / Hendricks, Troy R.; Lee, Ilsoon.

In: Thin Solid Films, Vol. 515, No. 4, 05.12.2006, p. 2347-2352.

Research output: Contribution to journalArticle

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