Analysis of crystallographic slip and grain boundary sliding in a Ti-45Al-2Nb-2Mn (at%)-0.8vol%TiB2 alloy by high temperature in situ mechanical testing

R. Muñoz-Moreno, E. M. Ruiz-Navas, C. J. Boehlert, J. Llorca, J. M. Torralba, M. T. Pérez-Prado

    Research output: Contribution to journalArticle

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    Abstract

    This work aims to contribute to a further understanding of the fundamentals of crystallographic slip and grain boundary sliding in the γ-TiAl Ti-45Al-2Nb-2Mn (at%)-0.8vol%TiB2 intermetallic alloy, by means of in situ high-temperature tensile testing combined with electron backscatter diffraction (EBSD). Several microstructures, containing different fractions and sizes of lamellar colonies and equiaxed γ-grains, were fabricated by either centrifugal casting or powder metallurgy, followed by heat treatment at 1300°C and furnace cooling. in situ tensile and tensile-creep experiments were performed in a scanning electron microscope (SEM) at temperatures ranging from 580°C to 700°C. EBSD was carried out in selected regions before and after straining. Our results suggest that, during constant strain rate tests, true twin γ/γ interfaces are the weakest barriers to dislocations and, thus, that the relevant length scale might be influenced by the distance between non-true twin boundaries. Under creep conditions both grain/colony boundary sliding (G/CBS) and crystallographic slip are observed to contribute to deformation. The incidence of boundary sliding is particularly high in γ grains of duplex microstructures. The slip activity during creep deformation in different microstructures was evaluated by trace analysis. Special emphasis was placed in distinguishing the compliance of different slip events with the Schmid law with respect to the applied stress.

    Original languageEnglish (US)
    Pages (from-to)276-289
    Number of pages14
    JournalMaterials Science and Engineering A
    Volume606
    DOIs
    StatePublished - Jun 12 2014

    Profile

    Creep
    Microstructure
    slip
    sliding
    Acetanilides
    Carbamyl Phosphate
    Grain boundary sliding
    Electron diffraction
    Temperature
    microstructure
    grain boundaries
    diffraction
    electrons
    Common Bile Duct Diseases
    alpha-Crystallin A Chain
    Carbocysteine
    Round Ligament
    Haiti
    Dinitrophenols
    Addison Disease

    Keywords

    • Crystallographic slip
    • EBSD
    • Grain boundary sliding
    • In situ testing
    • Schmid law
    • TiAl

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanical Engineering
    • Mechanics of Materials

    Cite this

    Analysis of crystallographic slip and grain boundary sliding in a Ti-45Al-2Nb-2Mn (at%)-0.8vol%TiB2 alloy by high temperature in situ mechanical testing. / Muñoz-Moreno, R.; Ruiz-Navas, E. M.; Boehlert, C. J.; Llorca, J.; Torralba, J. M.; Pérez-Prado, M. T.

    In: Materials Science and Engineering A, Vol. 606, 12.06.2014, p. 276-289.

    Research output: Contribution to journalArticle

    Muñoz-Moreno, R.; Ruiz-Navas, E. M.; Boehlert, C. J.; Llorca, J.; Torralba, J. M.; Pérez-Prado, M. T. / Analysis of crystallographic slip and grain boundary sliding in a Ti-45Al-2Nb-2Mn (at%)-0.8vol%TiB2 alloy by high temperature in situ mechanical testing.

    In: Materials Science and Engineering A, Vol. 606, 12.06.2014, p. 276-289.

    Research output: Contribution to journalArticle

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    abstract = "This work aims to contribute to a further understanding of the fundamentals of crystallographic slip and grain boundary sliding in the γ-TiAl Ti-45Al-2Nb-2Mn (at%)-0.8vol%TiB2 intermetallic alloy, by means of in situ high-temperature tensile testing combined with electron backscatter diffraction (EBSD). Several microstructures, containing different fractions and sizes of lamellar colonies and equiaxed γ-grains, were fabricated by either centrifugal casting or powder metallurgy, followed by heat treatment at 1300°C and furnace cooling. in situ tensile and tensile-creep experiments were performed in a scanning electron microscope (SEM) at temperatures ranging from 580°C to 700°C. EBSD was carried out in selected regions before and after straining. Our results suggest that, during constant strain rate tests, true twin γ/γ interfaces are the weakest barriers to dislocations and, thus, that the relevant length scale might be influenced by the distance between non-true twin boundaries. Under creep conditions both grain/colony boundary sliding (G/CBS) and crystallographic slip are observed to contribute to deformation. The incidence of boundary sliding is particularly high in γ grains of duplex microstructures. The slip activity during creep deformation in different microstructures was evaluated by trace analysis. Special emphasis was placed in distinguishing the compliance of different slip events with the Schmid law with respect to the applied stress.",
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    AU - Ruiz-Navas,E. M.

    AU - Boehlert,C. J.

    AU - Llorca,J.

    AU - Torralba,J. M.

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    AB - This work aims to contribute to a further understanding of the fundamentals of crystallographic slip and grain boundary sliding in the γ-TiAl Ti-45Al-2Nb-2Mn (at%)-0.8vol%TiB2 intermetallic alloy, by means of in situ high-temperature tensile testing combined with electron backscatter diffraction (EBSD). Several microstructures, containing different fractions and sizes of lamellar colonies and equiaxed γ-grains, were fabricated by either centrifugal casting or powder metallurgy, followed by heat treatment at 1300°C and furnace cooling. in situ tensile and tensile-creep experiments were performed in a scanning electron microscope (SEM) at temperatures ranging from 580°C to 700°C. EBSD was carried out in selected regions before and after straining. Our results suggest that, during constant strain rate tests, true twin γ/γ interfaces are the weakest barriers to dislocations and, thus, that the relevant length scale might be influenced by the distance between non-true twin boundaries. Under creep conditions both grain/colony boundary sliding (G/CBS) and crystallographic slip are observed to contribute to deformation. The incidence of boundary sliding is particularly high in γ grains of duplex microstructures. The slip activity during creep deformation in different microstructures was evaluated by trace analysis. Special emphasis was placed in distinguishing the compliance of different slip events with the Schmid law with respect to the applied stress.

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