Analysis of Slip Activity and Deformation Modes in Tension and Tension-Creep Tests of Cast Mg-10Gd-3Y-0.5Zr (Wt Pct) at Elevated Temperatures Using In Situ SEM Experiments

Huan Wang, Carl J. Boehlert, Qudong Wang, Dongdi Yin, Wenjiang Ding

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Abstract

The tension and tension-creep deformation behavior at elevated temperatures of a cast Mg-10Gd-3Y-0.5Zr (wt pct, GW103) alloy was investigated using in situ scanning electron microscopy. The tests were performed at temperatures ranging from 473 K to 598 K (200 °C to 325 °C). The active slip systems were identified using an EBSD-based slip trace analysis methodology. The results showed that for all of the tests, basal slip was the most likely system to be activated, and non-basal slip was activated to some extent depending on the temperature. No twinning was observed. For the tension tests, non-basal slip consisted of ~35 pct of the deformation modes at low temperatures (473 K and 523 K (200 °C and 250 °C)), while non-basal slip accounted for 12 and 7 pct of the deformation modes at high temperatures (573 K and 598 K (300 °C and 325 °C)), respectively. For the tension-creep tests, non-basal slip accounted for 31 pct of the total slip systems at low temperatures, while this value decreased to 10 to 16 pct at high temperatures. For a given temperature, the relative activity for prismatic slip in the tension-creep tests was slightly greater than that for the tension tests, while the activity for pyramidal slip was lower. Slip-transfer in neighboring grains was observed for the low-temperature tests. Intergranular cracking was the main cracking mode, while some intragranular cracks were observed for the tension-creep tests at high temperature and low stress. Grain boundary ledges were prevalently observed for both the tension and tension-creep tests at high temperatures, which suggests that besides dislocation slip, grain boundary sliding also contributed to the deformation.

LanguageEnglish (US)
Pages1-23
Number of pages23
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
DOIs
StateAccepted/In press - Mar 8 2016

Profile

creep tests
casts
Creep
slip
Scanning electron microscopy
scanning electron microscopy
Experiments
Temperature
temperature
low temperature tests
grain boundaries
Trace analysis
Grain boundary sliding
ledges
Twinning
twinning
Grain boundaries
sliding
Thermodynamic properties
cracks

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Metals and Alloys
  • Mechanics of Materials

Cite this

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title = "Analysis of Slip Activity and Deformation Modes in Tension and Tension-Creep Tests of Cast Mg-10Gd-3Y-0.5Zr (Wt Pct) at Elevated Temperatures Using In Situ SEM Experiments",
abstract = "The tension and tension-creep deformation behavior at elevated temperatures of a cast Mg-10Gd-3Y-0.5Zr (wt pct, GW103) alloy was investigated using in situ scanning electron microscopy. The tests were performed at temperatures ranging from 473 K to 598 K (200 °C to 325 °C). The active slip systems were identified using an EBSD-based slip trace analysis methodology. The results showed that for all of the tests, basal slip was the most likely system to be activated, and non-basal slip was activated to some extent depending on the temperature. No twinning was observed. For the tension tests, non-basal slip consisted of ~35 pct of the deformation modes at low temperatures (473 K and 523 K (200 °C and 250 °C)), while non-basal slip accounted for 12 and 7 pct of the deformation modes at high temperatures (573 K and 598 K (300 °C and 325 °C)), respectively. For the tension-creep tests, non-basal slip accounted for 31 pct of the total slip systems at low temperatures, while this value decreased to 10 to 16 pct at high temperatures. For a given temperature, the relative activity for prismatic slip in the tension-creep tests was slightly greater than that for the tension tests, while the activity for pyramidal slip was lower. Slip-transfer in neighboring grains was observed for the low-temperature tests. Intergranular cracking was the main cracking mode, while some intragranular cracks were observed for the tension-creep tests at high temperature and low stress. Grain boundary ledges were prevalently observed for both the tension and tension-creep tests at high temperatures, which suggests that besides dislocation slip, grain boundary sliding also contributed to the deformation.",
author = "Huan Wang and Boehlert, {Carl J.} and Qudong Wang and Dongdi Yin and Wenjiang Ding",
year = "2016",
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T1 - Analysis of Slip Activity and Deformation Modes in Tension and Tension-Creep Tests of Cast Mg-10Gd-3Y-0.5Zr (Wt Pct) at Elevated Temperatures Using In Situ SEM Experiments

AU - Wang,Huan

AU - Boehlert,Carl J.

AU - Wang,Qudong

AU - Yin,Dongdi

AU - Ding,Wenjiang

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N2 - The tension and tension-creep deformation behavior at elevated temperatures of a cast Mg-10Gd-3Y-0.5Zr (wt pct, GW103) alloy was investigated using in situ scanning electron microscopy. The tests were performed at temperatures ranging from 473 K to 598 K (200 °C to 325 °C). The active slip systems were identified using an EBSD-based slip trace analysis methodology. The results showed that for all of the tests, basal slip was the most likely system to be activated, and non-basal slip was activated to some extent depending on the temperature. No twinning was observed. For the tension tests, non-basal slip consisted of ~35 pct of the deformation modes at low temperatures (473 K and 523 K (200 °C and 250 °C)), while non-basal slip accounted for 12 and 7 pct of the deformation modes at high temperatures (573 K and 598 K (300 °C and 325 °C)), respectively. For the tension-creep tests, non-basal slip accounted for 31 pct of the total slip systems at low temperatures, while this value decreased to 10 to 16 pct at high temperatures. For a given temperature, the relative activity for prismatic slip in the tension-creep tests was slightly greater than that for the tension tests, while the activity for pyramidal slip was lower. Slip-transfer in neighboring grains was observed for the low-temperature tests. Intergranular cracking was the main cracking mode, while some intragranular cracks were observed for the tension-creep tests at high temperature and low stress. Grain boundary ledges were prevalently observed for both the tension and tension-creep tests at high temperatures, which suggests that besides dislocation slip, grain boundary sliding also contributed to the deformation.

AB - The tension and tension-creep deformation behavior at elevated temperatures of a cast Mg-10Gd-3Y-0.5Zr (wt pct, GW103) alloy was investigated using in situ scanning electron microscopy. The tests were performed at temperatures ranging from 473 K to 598 K (200 °C to 325 °C). The active slip systems were identified using an EBSD-based slip trace analysis methodology. The results showed that for all of the tests, basal slip was the most likely system to be activated, and non-basal slip was activated to some extent depending on the temperature. No twinning was observed. For the tension tests, non-basal slip consisted of ~35 pct of the deformation modes at low temperatures (473 K and 523 K (200 °C and 250 °C)), while non-basal slip accounted for 12 and 7 pct of the deformation modes at high temperatures (573 K and 598 K (300 °C and 325 °C)), respectively. For the tension-creep tests, non-basal slip accounted for 31 pct of the total slip systems at low temperatures, while this value decreased to 10 to 16 pct at high temperatures. For a given temperature, the relative activity for prismatic slip in the tension-creep tests was slightly greater than that for the tension tests, while the activity for pyramidal slip was lower. Slip-transfer in neighboring grains was observed for the low-temperature tests. Intergranular cracking was the main cracking mode, while some intragranular cracks were observed for the tension-creep tests at high temperature and low stress. Grain boundary ledges were prevalently observed for both the tension and tension-creep tests at high temperatures, which suggests that besides dislocation slip, grain boundary sliding also contributed to the deformation.

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