Analysis of Slip Activity and Deformation Modes in Tension and Tension-Creep Tests of Cast Mg-10Gd-3Y-0.5Zr (Wt Pct) at Elevated Temperatures Using In Situ SEM Experiments

Huan Wang, Carl J. Boehlert, Qudong Wang, Dongdi Yin, Wenjiang Ding

    Research output: Research - peer-reviewArticle

    • 3 Citations

    Abstract

    The tension and tension-creep deformation behavior at elevated temperatures of a cast Mg-10Gd-3Y-0.5Zr (wt pct, GW103) alloy was investigated using in situ scanning electron microscopy. The tests were performed at temperatures ranging from 473 K to 598 K (200 °C to 325 °C). The active slip systems were identified using an EBSD-based slip trace analysis methodology. The results showed that for all of the tests, basal slip was the most likely system to be activated, and non-basal slip was activated to some extent depending on the temperature. No twinning was observed. For the tension tests, non-basal slip consisted of ~35 pct of the deformation modes at low temperatures (473 K and 523 K (200 °C and 250 °C)), while non-basal slip accounted for 12 and 7 pct of the deformation modes at high temperatures (573 K and 598 K (300 °C and 325 °C)), respectively. For the tension-creep tests, non-basal slip accounted for 31 pct of the total slip systems at low temperatures, while this value decreased to 10 to 16 pct at high temperatures. For a given temperature, the relative activity for prismatic slip in the tension-creep tests was slightly greater than that for the tension tests, while the activity for pyramidal slip was lower. Slip-transfer in neighboring grains was observed for the low-temperature tests. Intergranular cracking was the main cracking mode, while some intragranular cracks were observed for the tension-creep tests at high temperature and low stress. Grain boundary ledges were prevalently observed for both the tension and tension-creep tests at high temperatures, which suggests that besides dislocation slip, grain boundary sliding also contributed to the deformation.

    LanguageEnglish (US)
    Pages1-23
    Number of pages23
    JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
    DOIs
    StateAccepted/In press - Mar 8 2016

    Profile

    creep tests
    casts
    slip
    scanning electron microscopy
    temperature
    Creep
    Scanning electron microscopy
    Experiments
    Temperature
    grain boundaries
    Trace analysis
    Grain boundary sliding
    Twinning
    Grain boundaries
    Thermodynamic properties
    Cracks
    C 325
    low temperature tests
    ledges
    twinning

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Metals and Alloys
    • Mechanics of Materials

    Cite this

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    title = "Analysis of Slip Activity and Deformation Modes in Tension and Tension-Creep Tests of Cast Mg-10Gd-3Y-0.5Zr (Wt Pct) at Elevated Temperatures Using In Situ SEM Experiments",
    abstract = "The tension and tension-creep deformation behavior at elevated temperatures of a cast Mg-10Gd-3Y-0.5Zr (wt pct, GW103) alloy was investigated using in situ scanning electron microscopy. The tests were performed at temperatures ranging from 473 K to 598 K (200 °C to 325 °C). The active slip systems were identified using an EBSD-based slip trace analysis methodology. The results showed that for all of the tests, basal slip was the most likely system to be activated, and non-basal slip was activated to some extent depending on the temperature. No twinning was observed. For the tension tests, non-basal slip consisted of ~35 pct of the deformation modes at low temperatures (473 K and 523 K (200 °C and 250 °C)), while non-basal slip accounted for 12 and 7 pct of the deformation modes at high temperatures (573 K and 598 K (300 °C and 325 °C)), respectively. For the tension-creep tests, non-basal slip accounted for 31 pct of the total slip systems at low temperatures, while this value decreased to 10 to 16 pct at high temperatures. For a given temperature, the relative activity for prismatic slip in the tension-creep tests was slightly greater than that for the tension tests, while the activity for pyramidal slip was lower. Slip-transfer in neighboring grains was observed for the low-temperature tests. Intergranular cracking was the main cracking mode, while some intragranular cracks were observed for the tension-creep tests at high temperature and low stress. Grain boundary ledges were prevalently observed for both the tension and tension-creep tests at high temperatures, which suggests that besides dislocation slip, grain boundary sliding also contributed to the deformation.",
    author = "Huan Wang and Boehlert, {Carl J.} and Qudong Wang and Dongdi Yin and Wenjiang Ding",
    year = "2016",
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    AU - Wang,Huan

    AU - Boehlert,Carl J.

    AU - Wang,Qudong

    AU - Yin,Dongdi

    AU - Ding,Wenjiang

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