Characterization of the microstructure, tensile and creep behavior of powder metallurgy processed and rolled Ti-6Al-4V-1B alloy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2 Citations

Abstract

This work investigated the microstructure and elevated-temperature (400-475°C) tensile and tensile-creep deformation behavior of a powder metallurgy (PM) rolled Ti-6Al-4V-1B(wt.%) alloy. The PM rolled Ti-6Al-4V-1B alloy exhibited a duplex microstructure, and it did not exhibit a strong α-phase texture compared with the PM extruded Ti-6Al-4V-1B alloy. The PM rolled Ti-6Al-4V-1B alloy exhibited greater creep resistance than the PM extruded Ti-6Al-4V-1B alloy as well as the as-cast Ti-6Al-4V-1B alloy.

LanguageEnglish (US)
Title of host publicationKey Engineering Materials
Pages195-203
Number of pages9
Volume436
DOIs
StatePublished - 2010
EventTMS 2010 Spring Symposium on Cost-Affordable Titanium III - Seattle, WA, United States
Duration: Feb 14 2010Feb 18 2010

Publication series

NameKey Engineering Materials
Volume436
ISSN (Print)10139826

Other

OtherTMS 2010 Spring Symposium on Cost-Affordable Titanium III
CountryUnited States
CitySeattle, WA
Period2/14/102/18/10

Profile

Powder metallurgy
Creep
Microstructure
Creep resistance
Textures

Keywords

  • Boron
  • Creep
  • Microstructure
  • Tension
  • Titanium

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Characterization of the microstructure, tensile and creep behavior of powder metallurgy processed and rolled Ti-6Al-4V-1B alloy. / Chen, Wei; Boehlert, Carl J.

Key Engineering Materials. Vol. 436 2010. p. 195-203 (Key Engineering Materials; Vol. 436).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chen, W & Boehlert, CJ 2010, Characterization of the microstructure, tensile and creep behavior of powder metallurgy processed and rolled Ti-6Al-4V-1B alloy. in Key Engineering Materials. vol. 436, Key Engineering Materials, vol. 436, pp. 195-203, TMS 2010 Spring Symposium on Cost-Affordable Titanium III, Seattle, WA, United States, 2/14/10. DOI: 10.4028/www.scientific.net/KEM.436.195
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