Crystal plasticity finite-element analysis of deformation behavior in multiple-grained lead-free solder joints

P. Darbandi, T. R. Bieler, F. Pourboghrat, Tae Kyu Lee

    Research output: Contribution to journalArticle

    • 11 Citations

    Abstract

    The elastic and plastic anisotropy of the tin phase in a Pb-free tin-based solder joint has a very important effect on the reliability of solder joints. The crystal plasticity finite-element (CPFE) method takes into account the effect of anisotropy, and it can be used to solve crystal mechanical deformation problems under complicated external and internal boundary conditions imposed by inter- and intragrain micromechanical interactions. In this study, experimental lap-shear test results from the literature are used to calibrate the CPFE model. The spatial neighbor orientation relationships of the crystals were assessed by studying four different sets of orientations using a very simple model to establish a basis for further development of the model. Average shear strain and Schmid factor analyses were applied to study the activity of slip systems. Further optimization of model parameters using comparisons with experiments will be needed to identify more suitable rules for stress evolution among the 10 slip systems in Sn. By suppression of some of the slip systems the CPFE model is able to simulate heterogeneous deformation phenomena that are similar to those observed in experiments. This work establishes a basis for an incremental model development strategy based upon experiments, modeling, and comparative analysis to establish model parameters that could predict the slip processes that lead to damage evolution in lead-free solder joints.

    Original languageEnglish (US)
    Pages (from-to)201-214
    Number of pages14
    JournalJournal of Electronic Materials
    Volume42
    Issue number2
    DOIs
    StatePublished - 2013

    Profile

    Anthralin
    crystals
    Carcinoid Tumor
    Crystals
    solders
    plastic properties
    slip
    Cinanserin
    Plasticity
    Common Bile Duct Diseases
    Carbamyl Phosphate
    Experiments
    tin
    Employee Grievances
    Abdominal Injuries
    Automobiles
    Thrombosis
    Soldering alloys
    Tin
    Anisotropy

    Keywords

    • anisotropy
    • crystal plasticity finite element
    • Lead-free solder
    • model
    • slip systems
    • tin

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Materials Chemistry

    Cite this

    Crystal plasticity finite-element analysis of deformation behavior in multiple-grained lead-free solder joints. / Darbandi, P.; Bieler, T. R.; Pourboghrat, F.; Lee, Tae Kyu.

    In: Journal of Electronic Materials, Vol. 42, No. 2, 2013, p. 201-214.

    Research output: Contribution to journalArticle

    Darbandi, P.; Bieler, T. R.; Pourboghrat, F.; Lee, Tae Kyu / Crystal plasticity finite-element analysis of deformation behavior in multiple-grained lead-free solder joints.

    In: Journal of Electronic Materials, Vol. 42, No. 2, 2013, p. 201-214.

    Research output: Contribution to journalArticle

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    abstract = "The elastic and plastic anisotropy of the tin phase in a Pb-free tin-based solder joint has a very important effect on the reliability of solder joints. The crystal plasticity finite-element (CPFE) method takes into account the effect of anisotropy, and it can be used to solve crystal mechanical deformation problems under complicated external and internal boundary conditions imposed by inter- and intragrain micromechanical interactions. In this study, experimental lap-shear test results from the literature are used to calibrate the CPFE model. The spatial neighbor orientation relationships of the crystals were assessed by studying four different sets of orientations using a very simple model to establish a basis for further development of the model. Average shear strain and Schmid factor analyses were applied to study the activity of slip systems. Further optimization of model parameters using comparisons with experiments will be needed to identify more suitable rules for stress evolution among the 10 slip systems in Sn. By suppression of some of the slip systems the CPFE model is able to simulate heterogeneous deformation phenomena that are similar to those observed in experiments. This work establishes a basis for an incremental model development strategy based upon experiments, modeling, and comparative analysis to establish model parameters that could predict the slip processes that lead to damage evolution in lead-free solder joints.",
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