Design of solder joints for fundamental studies on the effects of electromigration

C. E. Ho, A. Lee, K. N. Subramanian

    Research output: Research - peer-reviewArticle

    • 19 Citations

    Abstract

    The continuous miniaturization of high performance electronic devices has reached a level at which current densities are large enough to make electromigration (EM) a significant issue affecting the electrical and mechanical reliability of solder joints. A new design of solder joints that controls the extent of regions experiencing relatively uniform current density, as well as regions with large current density gradient was developed. Current density distribution of this newly designed solder joint was calculated using finite element analysis (FEA), which was used to guide the characterization of EM of real solder joints. As a part of the effort in evaluating the suitability of the new joint configuration for evaluating the fundamental issues in EM, eutectic PbSn solder joints were fabricated using this design. EM effects due to applied current, current density distribution, and joint thickness of eutectic PbSn solder joints present in this joint configuration were investigated. Findings based on this new design can facilitate fundamental studies of EM issues that affect the reliability of solder joints.

    LanguageEnglish (US)
    Pages569-574
    Number of pages6
    JournalJournal of Materials Science: Materials in Electronics
    Volume18
    Issue number6
    DOIs
    StatePublished - Jun 2007

    Profile

    electromigration
    solders
    Electromigration
    Soldering alloys
    Joints
    current density
    Current density
    eutectics
    density distribution
    configurations
    Eutectics
    miniaturization
    gradients
    electronics
    Finite element method
    Miniaturization
    Finite Element Analysis
    Equipment and Supplies

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Materials Science(all)
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics

    Cite this

    Design of solder joints for fundamental studies on the effects of electromigration. / Ho, C. E.; Lee, A.; Subramanian, K. N.

    In: Journal of Materials Science: Materials in Electronics, Vol. 18, No. 6, 06.2007, p. 569-574.

    Research output: Research - peer-reviewArticle

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