Development of nano-composite lead-free electronic solders

Andre Lee, K. N. Subramanian

    Research output: Research - peer-reviewArticle

    • 52 Citations

    Abstract

    Inert, hybrid inorganic/organic, nano-structured chemicals can be incorporated into low melting metallic materials, such as lead-free electronic solders, to achieve desired levels of service performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nanoreinforcements and the metallic matrix. The microstructures of lead-free solder reinforced with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSS-containing lead-free solders to copper substrate was also examined. Steady-state deformation of solder joints made of eutectic Sn-Ag solder containing varying weight fractions of POSS of different chemical moieties were evaluated at different temperatures (25°C, 100°C, and 150°C) using a rheometric solids analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear strain, and testing temperature for such nano-composite Solders are reported. The service reliability of joints made with these newly formulated nano-composite solders was evaluated using a realistic thermomechanical (TMF) test profile. Evolution of microstructures and residual mechanical property after different extents of TMF cycles were evaluated and compared with joints made of standard, unreinforced eutectie Sn-Ag Solder.

    LanguageEnglish (US)
    Pages1399-1407
    Number of pages9
    JournalJournal of Electronic Materials
    Volume34
    Issue number11
    StatePublished - Nov 2005

    Profile

    Soldering alloys
    Composite materials
    Lead
    solders
    composite materials
    electronics
    Shear strain
    Shear stress
    Mechanical properties
    Microstructure
    Temperature
    Lead-free solders
    shear strain
    shear stress
    mechanical properties
    microstructure
    temperature
    Nanostructured materials
    Eutectics
    Wetting

    Keywords

    • Lead-free electronic solders
    • Nano-technology
    • Polyhedral oligomeric silsesquioxanes (POSS) Service reliability

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Materials Science(all)
    • Physics and Astronomy (miscellaneous)

    Cite this

    Development of nano-composite lead-free electronic solders. / Lee, Andre; Subramanian, K. N.

    In: Journal of Electronic Materials, Vol. 34, No. 11, 11.2005, p. 1399-1407.

    Research output: Research - peer-reviewArticle

    Lee, Andre ; Subramanian, K. N./ Development of nano-composite lead-free electronic solders. In: Journal of Electronic Materials. 2005 ; Vol. 34, No. 11. pp. 1399-1407
    @article{bc920c963689468695b5bcefd4099286,
    title = "Development of nano-composite lead-free electronic solders",
    abstract = "Inert, hybrid inorganic/organic, nano-structured chemicals can be incorporated into low melting metallic materials, such as lead-free electronic solders, to achieve desired levels of service performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nanoreinforcements and the metallic matrix. The microstructures of lead-free solder reinforced with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSS-containing lead-free solders to copper substrate was also examined. Steady-state deformation of solder joints made of eutectic Sn-Ag solder containing varying weight fractions of POSS of different chemical moieties were evaluated at different temperatures (25°C, 100°C, and 150°C) using a rheometric solids analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear strain, and testing temperature for such nano-composite Solders are reported. The service reliability of joints made with these newly formulated nano-composite solders was evaluated using a realistic thermomechanical (TMF) test profile. Evolution of microstructures and residual mechanical property after different extents of TMF cycles were evaluated and compared with joints made of standard, unreinforced eutectie Sn-Ag Solder.",
    keywords = "Lead-free electronic solders, Nano-technology, Polyhedral oligomeric silsesquioxanes (POSS) Service reliability",
    author = "Andre Lee and Subramanian, {K. N.}",
    year = "2005",
    month = "11",
    volume = "34",
    pages = "1399--1407",
    journal = "Journal of Electronic Materials",
    issn = "0361-5235",
    publisher = "Springer New York",
    number = "11",

    }

    TY - JOUR

    T1 - Development of nano-composite lead-free electronic solders

    AU - Lee,Andre

    AU - Subramanian,K. N.

    PY - 2005/11

    Y1 - 2005/11

    N2 - Inert, hybrid inorganic/organic, nano-structured chemicals can be incorporated into low melting metallic materials, such as lead-free electronic solders, to achieve desired levels of service performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nanoreinforcements and the metallic matrix. The microstructures of lead-free solder reinforced with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSS-containing lead-free solders to copper substrate was also examined. Steady-state deformation of solder joints made of eutectic Sn-Ag solder containing varying weight fractions of POSS of different chemical moieties were evaluated at different temperatures (25°C, 100°C, and 150°C) using a rheometric solids analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear strain, and testing temperature for such nano-composite Solders are reported. The service reliability of joints made with these newly formulated nano-composite solders was evaluated using a realistic thermomechanical (TMF) test profile. Evolution of microstructures and residual mechanical property after different extents of TMF cycles were evaluated and compared with joints made of standard, unreinforced eutectie Sn-Ag Solder.

    AB - Inert, hybrid inorganic/organic, nano-structured chemicals can be incorporated into low melting metallic materials, such as lead-free electronic solders, to achieve desired levels of service performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nanoreinforcements and the metallic matrix. The microstructures of lead-free solder reinforced with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSS-containing lead-free solders to copper substrate was also examined. Steady-state deformation of solder joints made of eutectic Sn-Ag solder containing varying weight fractions of POSS of different chemical moieties were evaluated at different temperatures (25°C, 100°C, and 150°C) using a rheometric solids analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear strain, and testing temperature for such nano-composite Solders are reported. The service reliability of joints made with these newly formulated nano-composite solders was evaluated using a realistic thermomechanical (TMF) test profile. Evolution of microstructures and residual mechanical property after different extents of TMF cycles were evaluated and compared with joints made of standard, unreinforced eutectie Sn-Ag Solder.

    KW - Lead-free electronic solders

    KW - Nano-technology

    KW - Polyhedral oligomeric silsesquioxanes (POSS) Service reliability

    UR - http://www.scopus.com/inward/record.url?scp=28044453784&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=28044453784&partnerID=8YFLogxK

    M3 - Article

    VL - 34

    SP - 1399

    EP - 1407

    JO - Journal of Electronic Materials

    T2 - Journal of Electronic Materials

    JF - Journal of Electronic Materials

    SN - 0361-5235

    IS - 11

    ER -