Development of nano-composite lead-free electronic solders

Andre Lee, K. N. Subramanian

Research output: Contribution to journalArticle

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Abstract

Inert, hybrid inorganic/organic, nano-structured chemicals can be incorporated into low melting metallic materials, such as lead-free electronic solders, to achieve desired levels of service performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nanoreinforcements and the metallic matrix. The microstructures of lead-free solder reinforced with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSS-containing lead-free solders to copper substrate was also examined. Steady-state deformation of solder joints made of eutectic Sn-Ag solder containing varying weight fractions of POSS of different chemical moieties were evaluated at different temperatures (25°C, 100°C, and 150°C) using a rheometric solids analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear strain, and testing temperature for such nano-composite Solders are reported. The service reliability of joints made with these newly formulated nano-composite solders was evaluated using a realistic thermomechanical (TMF) test profile. Evolution of microstructures and residual mechanical property after different extents of TMF cycles were evaluated and compared with joints made of standard, unreinforced eutectie Sn-Ag Solder.

LanguageEnglish (US)
Pages1399-1407
Number of pages9
JournalJournal of Electronic Materials
Volume34
Issue number11
StatePublished - Nov 2005

Profile

solders
Soldering alloys
Lead
composite materials
Composite materials
electronics
Shear strain
Shear stress
shear strain
shear stress
Mechanical properties
Microstructure
mechanical properties
Nanostructured materials
Eutectics
microstructure
Wetting
Copper
Melting
wettability

Keywords

  • Lead-free electronic solders
  • Nano-technology
  • Polyhedral oligomeric silsesquioxanes (POSS) Service reliability

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Development of nano-composite lead-free electronic solders. / Lee, Andre; Subramanian, K. N.

In: Journal of Electronic Materials, Vol. 34, No. 11, 11.2005, p. 1399-1407.

Research output: Contribution to journalArticle

Lee, Andre ; Subramanian, K. N./ Development of nano-composite lead-free electronic solders. In: Journal of Electronic Materials. 2005 ; Vol. 34, No. 11. pp. 1399-1407
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