Development of nanocomposite lead-free electronic solders

Andre Lee, K. N. Subramanian, Jong Gi Lee

    Research output: ResearchConference contribution

    • 5 Citations

    Abstract

    Inert, hybrid inorganic/organic, nano-structured chemicals, can be incorporated into low melting metallic materials, such as lead-free electronic solders to achieve desired level of performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nano-reinforcements and the metallic matrix. The microstructures of lead-free solder with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSScontaining lead-free solders to copper substrate was also examined. Steady-state defromation of solder joints made of eutectic Sn-Ag solder with varying weight fraction of POSS of different chemical moieties were evaluated at a range of temperatures (25°C, 100°C, and 150°C) using a Rheometric Solids Analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature were reported. The service reliability of joints made with these newly formulated nanocomposite solders was evaluated using a realistic thermomechanical fatigue (TMF) profile. Evolution of microstructures and residual mechanical property at different extend of TMF cycles were compared with joints made of standard, unreinforced eutectic Sn-Ag solder.

    LanguageEnglish (US)
    Title of host publicationProceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
    Pages276-281
    Number of pages6
    Volume2005
    DOIs
    StatePublished - 2005
    Event2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Irvine, CA, United States
    Duration: Mar 16 2005Mar 18 2005

    Other

    Other2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
    CountryUnited States
    CityIrvine, CA
    Period3/16/053/18/05

    Profile

    Soldering alloys
    Nanocomposites
    Lead
    Shear strain
    Eutectics
    Shear stress
    Fatigue of materials
    Mechanical properties
    Microstructure
    Temperature
    Lead-free solders
    Nanostructured materials
    Wetting
    Copper
    Reinforcement
    Melting
    Scanning electron microscopy
    Testing
    Substrates
    silanol

    ASJC Scopus subject areas

    • Engineering(all)
    • Materials Science(all)

    Cite this

    Lee, A., Subramanian, K. N., & Lee, J. G. (2005). Development of nanocomposite lead-free electronic solders. In Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces (Vol. 2005, pp. 276-281). [1432089] DOI: 10.1109/ISAPM.2005.1432089

    Development of nanocomposite lead-free electronic solders. / Lee, Andre; Subramanian, K. N.; Lee, Jong Gi.

    Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. Vol. 2005 2005. p. 276-281 1432089.

    Research output: ResearchConference contribution

    Lee, A, Subramanian, KN & Lee, JG 2005, Development of nanocomposite lead-free electronic solders. in Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. vol. 2005, 1432089, pp. 276-281, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, United States, 3/16/05. DOI: 10.1109/ISAPM.2005.1432089
    Lee A, Subramanian KN, Lee JG. Development of nanocomposite lead-free electronic solders. In Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. Vol. 2005. 2005. p. 276-281. 1432089. Available from, DOI: 10.1109/ISAPM.2005.1432089
    Lee, Andre ; Subramanian, K. N. ; Lee, Jong Gi. / Development of nanocomposite lead-free electronic solders. Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. Vol. 2005 2005. pp. 276-281
    @inbook{7ad5f5307488441792f223534866015a,
    title = "Development of nanocomposite lead-free electronic solders",
    abstract = "Inert, hybrid inorganic/organic, nano-structured chemicals, can be incorporated into low melting metallic materials, such as lead-free electronic solders to achieve desired level of performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nano-reinforcements and the metallic matrix. The microstructures of lead-free solder with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSScontaining lead-free solders to copper substrate was also examined. Steady-state defromation of solder joints made of eutectic Sn-Ag solder with varying weight fraction of POSS of different chemical moieties were evaluated at a range of temperatures (25°C, 100°C, and 150°C) using a Rheometric Solids Analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature were reported. The service reliability of joints made with these newly formulated nanocomposite solders was evaluated using a realistic thermomechanical fatigue (TMF) profile. Evolution of microstructures and residual mechanical property at different extend of TMF cycles were compared with joints made of standard, unreinforced eutectic Sn-Ag solder.",
    author = "Andre Lee and Subramanian, {K. N.} and Lee, {Jong Gi}",
    year = "2005",
    doi = "10.1109/ISAPM.2005.1432089",
    isbn = "0780390857",
    volume = "2005",
    pages = "276--281",
    booktitle = "Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces",

    }

    TY - CHAP

    T1 - Development of nanocomposite lead-free electronic solders

    AU - Lee,Andre

    AU - Subramanian,K. N.

    AU - Lee,Jong Gi

    PY - 2005

    Y1 - 2005

    N2 - Inert, hybrid inorganic/organic, nano-structured chemicals, can be incorporated into low melting metallic materials, such as lead-free electronic solders to achieve desired level of performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nano-reinforcements and the metallic matrix. The microstructures of lead-free solder with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSScontaining lead-free solders to copper substrate was also examined. Steady-state defromation of solder joints made of eutectic Sn-Ag solder with varying weight fraction of POSS of different chemical moieties were evaluated at a range of temperatures (25°C, 100°C, and 150°C) using a Rheometric Solids Analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature were reported. The service reliability of joints made with these newly formulated nanocomposite solders was evaluated using a realistic thermomechanical fatigue (TMF) profile. Evolution of microstructures and residual mechanical property at different extend of TMF cycles were compared with joints made of standard, unreinforced eutectic Sn-Ag solder.

    AB - Inert, hybrid inorganic/organic, nano-structured chemicals, can be incorporated into low melting metallic materials, such as lead-free electronic solders to achieve desired level of performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nano-reinforcements and the metallic matrix. The microstructures of lead-free solder with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSScontaining lead-free solders to copper substrate was also examined. Steady-state defromation of solder joints made of eutectic Sn-Ag solder with varying weight fraction of POSS of different chemical moieties were evaluated at a range of temperatures (25°C, 100°C, and 150°C) using a Rheometric Solids Analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature were reported. The service reliability of joints made with these newly formulated nanocomposite solders was evaluated using a realistic thermomechanical fatigue (TMF) profile. Evolution of microstructures and residual mechanical property at different extend of TMF cycles were compared with joints made of standard, unreinforced eutectic Sn-Ag solder.

    UR - http://www.scopus.com/inward/record.url?scp=33746499058&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=33746499058&partnerID=8YFLogxK

    U2 - 10.1109/ISAPM.2005.1432089

    DO - 10.1109/ISAPM.2005.1432089

    M3 - Conference contribution

    SN - 0780390857

    SN - 9780780390850

    VL - 2005

    SP - 276

    EP - 281

    BT - Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

    ER -