Development of nanocomposite lead-free electronic solders

Andre Lee, K. N. Subramanian, Jong Gi Lee

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    • 5 Citations

    Abstract

    Inert, hybrid inorganic/organic, nano-structured chemicals, can be incorporated into low melting metallic materials, such as lead-free electronic solders to achieve desired level of performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nano-reinforcements and the metallic matrix. The microstructures of lead-free solder with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSScontaining lead-free solders to copper substrate was also examined. Steady-state defromation of solder joints made of eutectic Sn-Ag solder with varying weight fraction of POSS of different chemical moieties were evaluated at a range of temperatures (25°C, 100°C, and 150°C) using a Rheometric Solids Analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature were reported. The service reliability of joints made with these newly formulated nanocomposite solders was evaluated using a realistic thermomechanical fatigue (TMF) profile. Evolution of microstructures and residual mechanical property at different extend of TMF cycles were compared with joints made of standard, unreinforced eutectic Sn-Ag solder.

    Original languageEnglish (US)
    Title of host publicationProceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
    Pages276-281
    Number of pages6
    Volume2005
    DOIs
    StatePublished - 2005
    Event2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Irvine, CA, United States

    Other

    Other2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
    CountryUnited States
    CityIrvine, CA
    Period3/16/053/18/05

    Profile

    Employee Grievances
    Soldering alloys
    Cardanolides
    Acetanilides
    Alcuronium
    Laryngeal Mucosa
    Protamine Kinase
    Endometrial Hyperplasia
    Abdominal Muscles
    Shear strain
    Thrombosis
    Microstructure
    Eutectics
    Shear stress
    Nanocomposites
    Fatigue of materials
    Mechanical properties
    Temperature
    Lead-free solders
    Enzyme Reactivators

    ASJC Scopus subject areas

    • Engineering(all)
    • Materials Science(all)

    Cite this

    Lee, A., Subramanian, K. N., & Lee, J. G. (2005). Development of nanocomposite lead-free electronic solders. In Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces (Vol. 2005, pp. 276-281). [1432089] DOI: 10.1109/ISAPM.2005.1432089

    Development of nanocomposite lead-free electronic solders. / Lee, Andre; Subramanian, K. N.; Lee, Jong Gi.

    Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. Vol. 2005 2005. p. 276-281 1432089.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Lee, A, Subramanian, KN & Lee, JG 2005, Development of nanocomposite lead-free electronic solders. in Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. vol. 2005, 1432089, pp. 276-281, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, United States, 16-18 March. DOI: 10.1109/ISAPM.2005.1432089
    Lee A, Subramanian KN, Lee JG. Development of nanocomposite lead-free electronic solders. In Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. Vol. 2005. 2005. p. 276-281. 1432089. Available from, DOI: 10.1109/ISAPM.2005.1432089

    Lee, Andre; Subramanian, K. N.; Lee, Jong Gi / Development of nanocomposite lead-free electronic solders.

    Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. Vol. 2005 2005. p. 276-281 1432089.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

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