Dielectric relaxation of curing DGEBA/mPDA system at 2.45 GHz

Liming Zobg, Martin C. Hawley, Rensheng Sun, Leo C. Kempel

    Research output: Contribution to journalArticle

    Abstract

    The dielectric behavior of a curing system of diglycidyl ether of bisphenol A and m-phenylenediamine has been studied over the temperature range of 20-100°C under 2.45 GHz microwave radiation. The dielectric constant and the dielectric loss factor of the system increase as temperature increases while they decrease as the curing reaction progresses. The epoxy resins at different extents of cure exhibit the g relaxation, which can be described by the Arrhenius rate law. The relaxation is attributed to the motions of the dipolar groups associated with the crosslinking system. The Davidsong-Cole model is used to represent the temperature dependency of the dielectric properties.

    Original languageEnglish (US)
    Pages (from-to)249-257
    Number of pages9
    JournalJournal of Thermoplastic Composite Materials
    Volume22
    Issue number3
    DOIs
    StatePublished - May 2009

    Profile

    curing
    temperature
    Curing
    Temperature
    Acetanilides
    Aldrin
    bisphenols
    epoxy resins
    crosslinking
    dielectric loss
    dielectric properties
    ethers
    permittivity
    microwaves
    Dielectric relaxation
    Dielectric losses
    Epoxy resins
    Crosslinking
    Dielectric properties
    Ethers

    Keywords

    • Cure
    • Dielectric properties
    • Epoxy resin
    • Microwave.

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Ceramics and Composites

    Cite this

    Dielectric relaxation of curing DGEBA/mPDA system at 2.45 GHz. / Zobg, Liming; Hawley, Martin C.; Sun, Rensheng; Kempel, Leo C.

    In: Journal of Thermoplastic Composite Materials, Vol. 22, No. 3, 05.2009, p. 249-257.

    Research output: Contribution to journalArticle

    Zobg, Liming; Hawley, Martin C.; Sun, Rensheng; Kempel, Leo C. / Dielectric relaxation of curing DGEBA/mPDA system at 2.45 GHz.

    In: Journal of Thermoplastic Composite Materials, Vol. 22, No. 3, 05.2009, p. 249-257.

    Research output: Contribution to journalArticle

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