Dielectric relaxation of curing DGEBA/mPDA system at 2.45 GHz

Liming Zobg, Martin C. Hawley, Rensheng Sun, Leo C. Kempel

Research output: Contribution to journalArticle

  • 1 Citations

Abstract

The dielectric behavior of a curing system of diglycidyl ether of bisphenol A and m-phenylenediamine has been studied over the temperature range of 20-100°C under 2.45 GHz microwave radiation. The dielectric constant and the dielectric loss factor of the system increase as temperature increases while they decrease as the curing reaction progresses. The epoxy resins at different extents of cure exhibit the g relaxation, which can be described by the Arrhenius rate law. The relaxation is attributed to the motions of the dipolar groups associated with the crosslinking system. The Davidsong-Cole model is used to represent the temperature dependency of the dielectric properties.

LanguageEnglish (US)
Pages249-257
Number of pages9
JournalJournal of Thermoplastic Composite Materials
Volume22
Issue number3
DOIs
StatePublished - May 2009

Profile

Dielectric relaxation
curing
Curing
Epoxy Resins
bisphenols
epoxy resins
crosslinking
Dielectric losses
dielectric loss
Epoxy resins
Crosslinking
Dielectric properties
Temperature
temperature
dielectric properties
Ethers
ethers
Permittivity
Microwaves
permittivity

Keywords

  • Cure
  • Dielectric properties
  • Epoxy resin
  • Microwave.

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Ceramics and Composites

Cite this

Dielectric relaxation of curing DGEBA/mPDA system at 2.45 GHz. / Zobg, Liming; Hawley, Martin C.; Sun, Rensheng; Kempel, Leo C.

In: Journal of Thermoplastic Composite Materials, Vol. 22, No. 3, 05.2009, p. 249-257.

Research output: Contribution to journalArticle

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