Dielectric studies of three epoxy resin systems during microwave cure

Research output: Contribution to journalArticle

  • 18 Citations

Abstract

Dielectric properties of three curing epoxy resin systems at an industrial microwave frequency, 2.45 GHz, were measured over a temperature range lower than the cure temperature. Extent of cure, which is determined by DSC, is used to describe the progress of the polymerization. It has been found that, normally, the real and the imaginary part of the complex dielectric constant increased with temperature and decreased during microwave cure. The changes of the dielectric properties during the reaction are related to the decreasing number of the dipolar groups in the reactants and the increasing viscosity. The Davidson-Cole model can be used to describe the experimental data. The Zong model is applicable to polymeric materials at high microwave frequencies and can be used to calculate the parameters of the Davidson-Cole model. The epoxy resins exhibit one γ relaxation, which can be described by the Arrhenius rate law. The evolutions of the parameters in the models are discussed.

LanguageEnglish (US)
Pages2638-2645
Number of pages8
JournalPolymer
Volume46
Issue number8
DOIs
StatePublished - Mar 24 2005

Profile

Epoxy Resins
Epoxy resins
Microwaves
Microwave frequencies
Dielectric properties
Temperature
Curing
Permittivity
Polymerization
Viscosity
Polymers

Keywords

  • Dielectric properties
  • Epoxy resin
  • Microwave processing

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics

Cite this

Dielectric studies of three epoxy resin systems during microwave cure. / Zong, Liming; Kempel, Leo C.; Hawley, Martin C.

In: Polymer, Vol. 46, No. 8, 24.03.2005, p. 2638-2645.

Research output: Contribution to journalArticle

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AU - Hawley,Martin C.

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