Dielectric studies of three epoxy resin systems during microwave cure

    Research output: Contribution to journalArticle

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    Abstract

    Dielectric properties of three curing epoxy resin systems at an industrial microwave frequency, 2.45 GHz, were measured over a temperature range lower than the cure temperature. Extent of cure, which is determined by DSC, is used to describe the progress of the polymerization. It has been found that, normally, the real and the imaginary part of the complex dielectric constant increased with temperature and decreased during microwave cure. The changes of the dielectric properties during the reaction are related to the decreasing number of the dipolar groups in the reactants and the increasing viscosity. The Davidson-Cole model can be used to describe the experimental data. The Zong model is applicable to polymeric materials at high microwave frequencies and can be used to calculate the parameters of the Davidson-Cole model. The epoxy resins exhibit one γ relaxation, which can be described by the Arrhenius rate law. The evolutions of the parameters in the models are discussed.

    Original languageEnglish (US)
    Pages (from-to)2638-2645
    Number of pages8
    JournalPolymer
    Volume46
    Issue number8
    DOIs
    StatePublished - Mar 24 2005

    Profile

    Anthralin
    Acetanilides
    Epoxy resins
    Temperature
    N-Acetylmuramoyl-L-alanine Amidase
    Dielectric properties
    Microwaves
    Microwave frequencies
    Aldrin
    Artificial Heart
    Carotid Arteries
    Permittivity
    Polymerization
    Curing
    Viscosity
    Polymers

    Keywords

    • Dielectric properties
    • Epoxy resin
    • Microwave processing

    ASJC Scopus subject areas

    • Organic Chemistry
    • Polymers and Plastics

    Cite this

    Dielectric studies of three epoxy resin systems during microwave cure. / Zong, Liming; Kempel, Leo C.; Hawley, Martin C.

    In: Polymer, Vol. 46, No. 8, 24.03.2005, p. 2638-2645.

    Research output: Contribution to journalArticle

    Zong, Liming; Kempel, Leo C.; Hawley, Martin C. / Dielectric studies of three epoxy resin systems during microwave cure.

    In: Polymer, Vol. 46, No. 8, 24.03.2005, p. 2638-2645.

    Research output: Contribution to journalArticle

    @article{68a5a9ce07c24404b1257f6e4bd3dd9a,
    title = "Dielectric studies of three epoxy resin systems during microwave cure",
    abstract = "Dielectric properties of three curing epoxy resin systems at an industrial microwave frequency, 2.45 GHz, were measured over a temperature range lower than the cure temperature. Extent of cure, which is determined by DSC, is used to describe the progress of the polymerization. It has been found that, normally, the real and the imaginary part of the complex dielectric constant increased with temperature and decreased during microwave cure. The changes of the dielectric properties during the reaction are related to the decreasing number of the dipolar groups in the reactants and the increasing viscosity. The Davidson-Cole model can be used to describe the experimental data. The Zong model is applicable to polymeric materials at high microwave frequencies and can be used to calculate the parameters of the Davidson-Cole model. The epoxy resins exhibit one γ relaxation, which can be described by the Arrhenius rate law. The evolutions of the parameters in the models are discussed.",
    keywords = "Dielectric properties, Epoxy resin, Microwave processing",
    author = "Liming Zong and Kempel, {Leo C.} and Hawley, {Martin C.}",
    year = "2005",
    month = "3",
    doi = "10.1016/j.polymer.2005.01.083",
    volume = "46",
    pages = "2638--2645",
    journal = "Polymer (United Kingdom)",
    issn = "0032-3861",
    publisher = "Elsevier BV",
    number = "8",

    }

    TY - JOUR

    T1 - Dielectric studies of three epoxy resin systems during microwave cure

    AU - Zong,Liming

    AU - Kempel,Leo C.

    AU - Hawley,Martin C.

    PY - 2005/3/24

    Y1 - 2005/3/24

    N2 - Dielectric properties of three curing epoxy resin systems at an industrial microwave frequency, 2.45 GHz, were measured over a temperature range lower than the cure temperature. Extent of cure, which is determined by DSC, is used to describe the progress of the polymerization. It has been found that, normally, the real and the imaginary part of the complex dielectric constant increased with temperature and decreased during microwave cure. The changes of the dielectric properties during the reaction are related to the decreasing number of the dipolar groups in the reactants and the increasing viscosity. The Davidson-Cole model can be used to describe the experimental data. The Zong model is applicable to polymeric materials at high microwave frequencies and can be used to calculate the parameters of the Davidson-Cole model. The epoxy resins exhibit one γ relaxation, which can be described by the Arrhenius rate law. The evolutions of the parameters in the models are discussed.

    AB - Dielectric properties of three curing epoxy resin systems at an industrial microwave frequency, 2.45 GHz, were measured over a temperature range lower than the cure temperature. Extent of cure, which is determined by DSC, is used to describe the progress of the polymerization. It has been found that, normally, the real and the imaginary part of the complex dielectric constant increased with temperature and decreased during microwave cure. The changes of the dielectric properties during the reaction are related to the decreasing number of the dipolar groups in the reactants and the increasing viscosity. The Davidson-Cole model can be used to describe the experimental data. The Zong model is applicable to polymeric materials at high microwave frequencies and can be used to calculate the parameters of the Davidson-Cole model. The epoxy resins exhibit one γ relaxation, which can be described by the Arrhenius rate law. The evolutions of the parameters in the models are discussed.

    KW - Dielectric properties

    KW - Epoxy resin

    KW - Microwave processing

    UR - http://www.scopus.com/inward/record.url?scp=14844350038&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=14844350038&partnerID=8YFLogxK

    U2 - 10.1016/j.polymer.2005.01.083

    DO - 10.1016/j.polymer.2005.01.083

    M3 - Article

    VL - 46

    SP - 2638

    EP - 2645

    JO - Polymer (United Kingdom)

    T2 - Polymer (United Kingdom)

    JF - Polymer (United Kingdom)

    SN - 0032-3861

    IS - 8

    ER -