Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c

C. E. Ho, A. Lee, K. N. Subramanian, W. Liu

Research output: Contribution to journalArticle

  • 11 Citations

Abstract

X-ray fluorescence spectroscopy was used to study movements of Sn and Pb in the eutectic SnPb solder joint undergoing electromigration with a current density of 104 A cm2 at 150 °C. During early stages of current stressing, Sn moves toward the anode faster than Pb. However, on continued application of current stressing, both Sn and Pb will continue to accumulate at the anode. Such accumulation of conductive species facilitates the formation of hillock with associated valley near the cathode.

LanguageEnglish (US)
Article number021906
JournalApplied Physics Letters
Volume91
Issue number2
DOIs
StatePublished - 2007

Profile

solders
eutectics
anodes
electromigration
valleys
cathodes
current density
fluorescence
spectroscopy
x rays

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c. / Ho, C. E.; Lee, A.; Subramanian, K. N.; Liu, W.

In: Applied Physics Letters, Vol. 91, No. 2, 021906, 2007.

Research output: Contribution to journalArticle

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