Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c

C. E. Ho, A. Lee, K. N. Subramanian, W. Liu

    Research output: Contribution to journalArticle

    • 11 Citations

    Abstract

    X-ray fluorescence spectroscopy was used to study movements of Sn and Pb in the eutectic SnPb solder joint undergoing electromigration with a current density of 104 A cm2 at 150 °C. During early stages of current stressing, Sn moves toward the anode faster than Pb. However, on continued application of current stressing, both Sn and Pb will continue to accumulate at the anode. Such accumulation of conductive species facilitates the formation of hillock with associated valley near the cathode.

    Original languageEnglish (US)
    Article number021906
    JournalApplied Physics Letters
    Volume91
    Issue number2
    DOIs
    StatePublished - 2007

    Profile

    solders
    eutectics
    anodes
    electromigration
    valleys
    cathodes
    current density
    fluorescence
    spectroscopy

    ASJC Scopus subject areas

    • Physics and Astronomy (miscellaneous)

    Cite this

    Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c. / Ho, C. E.; Lee, A.; Subramanian, K. N.; Liu, W.

    In: Applied Physics Letters, Vol. 91, No. 2, 021906, 2007.

    Research output: Contribution to journalArticle

    Ho, C. E.; Lee, A.; Subramanian, K. N.; Liu, W. / Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c.

    In: Applied Physics Letters, Vol. 91, No. 2, 021906, 2007.

    Research output: Contribution to journalArticle

    @article{985130f4726047d7a3ca787a639d7c3f,
    title = "Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c",
    abstract = "X-ray fluorescence spectroscopy was used to study movements of Sn and Pb in the eutectic SnPb solder joint undergoing electromigration with a current density of 104 A cm2 at 150 °C. During early stages of current stressing, Sn moves toward the anode faster than Pb. However, on continued application of current stressing, both Sn and Pb will continue to accumulate at the anode. Such accumulation of conductive species facilitates the formation of hillock with associated valley near the cathode.",
    author = "Ho, {C. E.} and A. Lee and Subramanian, {K. N.} and W. Liu",
    year = "2007",
    doi = "10.1063/1.2756292",
    volume = "91",
    journal = "Applied Physics Letters",
    issn = "0003-6951",
    publisher = "American Institute of Physics Publising LLC",
    number = "2",

    }

    TY - JOUR

    T1 - Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °c

    AU - Ho,C. E.

    AU - Lee,A.

    AU - Subramanian,K. N.

    AU - Liu,W.

    PY - 2007

    Y1 - 2007

    N2 - X-ray fluorescence spectroscopy was used to study movements of Sn and Pb in the eutectic SnPb solder joint undergoing electromigration with a current density of 104 A cm2 at 150 °C. During early stages of current stressing, Sn moves toward the anode faster than Pb. However, on continued application of current stressing, both Sn and Pb will continue to accumulate at the anode. Such accumulation of conductive species facilitates the formation of hillock with associated valley near the cathode.

    AB - X-ray fluorescence spectroscopy was used to study movements of Sn and Pb in the eutectic SnPb solder joint undergoing electromigration with a current density of 104 A cm2 at 150 °C. During early stages of current stressing, Sn moves toward the anode faster than Pb. However, on continued application of current stressing, both Sn and Pb will continue to accumulate at the anode. Such accumulation of conductive species facilitates the formation of hillock with associated valley near the cathode.

    UR - http://www.scopus.com/inward/record.url?scp=34547143685&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=34547143685&partnerID=8YFLogxK

    U2 - 10.1063/1.2756292

    DO - 10.1063/1.2756292

    M3 - Article

    VL - 91

    JO - Applied Physics Letters

    T2 - Applied Physics Letters

    JF - Applied Physics Letters

    SN - 0003-6951

    IS - 2

    M1 - 021906

    ER -