Effect of grain refinement by ECAP on creep of pure Cu

Wolfgang Blum, J. Dvořák, P. Král, P. Eisenlohr, V. Sklenička

Research output: Research - peer-reviewArticle

  • 15 Citations

Abstract

The creep behavior of pure, initially coarse-grained Cu of 99.99% purity was investigated at a temperature of 473K in tension and compression in dependence on predeformation by ECAP (route BC) at ambient temperature. Static recrystallization during heating to test temperature generates a microcrystalline structure; its homogeneity increases with increasing ECAP-predeformation. The high-angle boundaries are sufficiently closely spaced to exert a significant influence on work hardening and quasi-stationary deformation where generation and loss of free dislocations are at approximate balance. This influence is quantitatively interpreted in terms of control of deformation resistance shifting from low- to high-angle boundaries as predeformation increases and creep stress decreases. The microcrystalline structure created by the thermomechanical treatment consisting of ECAP and static recrystallization leads to favorable combination of relatively high creep resistance and high ductility at 473K with fracture strains in the order of 0.5.

LanguageEnglish (US)
Pages423-432
Number of pages10
JournalMaterials Science and Engineering A
Volume590
DOIs
StatePublished - Jan 10 2014
Externally publishedYes

Profile

temperature
Grain refinement
Creep
Temperature
thermomechanical treatment
creep strength
work hardening
ductility
ambient temperature
homogeneity
purity
routes
heating
Thermomechanical treatment
Creep resistance
Strain hardening
Ductility
Heating

Keywords

  • Creep
  • Cu
  • Ductility
  • ECAP
  • High-angle boundaries
  • Static recrystallization

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Effect of grain refinement by ECAP on creep of pure Cu. / Blum, Wolfgang; Dvořák, J.; Král, P.; Eisenlohr, P.; Sklenička, V.

In: Materials Science and Engineering A, Vol. 590, 10.01.2014, p. 423-432.

Research output: Research - peer-reviewArticle

Blum W, Dvořák J, Král P, Eisenlohr P, Sklenička V. Effect of grain refinement by ECAP on creep of pure Cu. Materials Science and Engineering A. 2014 Jan 10;590:423-432. Available from, DOI: 10.1016/j.msea.2013.10.022
Blum, Wolfgang ; Dvořák, J. ; Král, P. ; Eisenlohr, P. ; Sklenička, V./ Effect of grain refinement by ECAP on creep of pure Cu. In: Materials Science and Engineering A. 2014 ; Vol. 590. pp. 423-432
@article{25a0a623281e40d78d57bb6124d52341,
title = "Effect of grain refinement by ECAP on creep of pure Cu",
abstract = "The creep behavior of pure, initially coarse-grained Cu of 99.99% purity was investigated at a temperature of 473K in tension and compression in dependence on predeformation by ECAP (route BC) at ambient temperature. Static recrystallization during heating to test temperature generates a microcrystalline structure; its homogeneity increases with increasing ECAP-predeformation. The high-angle boundaries are sufficiently closely spaced to exert a significant influence on work hardening and quasi-stationary deformation where generation and loss of free dislocations are at approximate balance. This influence is quantitatively interpreted in terms of control of deformation resistance shifting from low- to high-angle boundaries as predeformation increases and creep stress decreases. The microcrystalline structure created by the thermomechanical treatment consisting of ECAP and static recrystallization leads to favorable combination of relatively high creep resistance and high ductility at 473K with fracture strains in the order of 0.5.",
keywords = "Creep, Cu, Ductility, ECAP, High-angle boundaries, Static recrystallization",
author = "Wolfgang Blum and J. Dvořák and P. Král and P. Eisenlohr and V. Sklenička",
year = "2014",
month = "1",
doi = "10.1016/j.msea.2013.10.022",
volume = "590",
pages = "423--432",
journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",
issn = "0921-5093",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - Effect of grain refinement by ECAP on creep of pure Cu

AU - Blum,Wolfgang

AU - Dvořák,J.

AU - Král,P.

AU - Eisenlohr,P.

AU - Sklenička,V.

PY - 2014/1/10

Y1 - 2014/1/10

N2 - The creep behavior of pure, initially coarse-grained Cu of 99.99% purity was investigated at a temperature of 473K in tension and compression in dependence on predeformation by ECAP (route BC) at ambient temperature. Static recrystallization during heating to test temperature generates a microcrystalline structure; its homogeneity increases with increasing ECAP-predeformation. The high-angle boundaries are sufficiently closely spaced to exert a significant influence on work hardening and quasi-stationary deformation where generation and loss of free dislocations are at approximate balance. This influence is quantitatively interpreted in terms of control of deformation resistance shifting from low- to high-angle boundaries as predeformation increases and creep stress decreases. The microcrystalline structure created by the thermomechanical treatment consisting of ECAP and static recrystallization leads to favorable combination of relatively high creep resistance and high ductility at 473K with fracture strains in the order of 0.5.

AB - The creep behavior of pure, initially coarse-grained Cu of 99.99% purity was investigated at a temperature of 473K in tension and compression in dependence on predeformation by ECAP (route BC) at ambient temperature. Static recrystallization during heating to test temperature generates a microcrystalline structure; its homogeneity increases with increasing ECAP-predeformation. The high-angle boundaries are sufficiently closely spaced to exert a significant influence on work hardening and quasi-stationary deformation where generation and loss of free dislocations are at approximate balance. This influence is quantitatively interpreted in terms of control of deformation resistance shifting from low- to high-angle boundaries as predeformation increases and creep stress decreases. The microcrystalline structure created by the thermomechanical treatment consisting of ECAP and static recrystallization leads to favorable combination of relatively high creep resistance and high ductility at 473K with fracture strains in the order of 0.5.

KW - Creep

KW - Cu

KW - Ductility

KW - ECAP

KW - High-angle boundaries

KW - Static recrystallization

UR - http://www.scopus.com/inward/record.url?scp=84887272552&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84887272552&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2013.10.022

DO - 10.1016/j.msea.2013.10.022

M3 - Article

VL - 590

SP - 423

EP - 432

JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

T2 - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

ER -