Effect of strain on whisker growth in matte tin

A. R. Southworth, C. E. Ho, A. Lee, K. N. Subramanian

    Research output: Research - peer-reviewArticle

    • 4 Citations

    Abstract

    Purpose - To evaluate the role of imposed strain on whisker growth in matte tin, and to identify the appropriate deformation states and environments that will facilitate the development of a reliable, accelerated test methodology to provide results representative of whisker growth under long-term service conditions. Design/methodology/approach - Whisker growth in matte tin coated strips and wires of copper subjected to various outer fibre strains was characterized at three different temperatures under different humidity conditions. Findings - This study presents findings of the influence of imposed strain and temperature on whisker growth in a matte tin layers present on a copper substrate. A decrease in incubation time and accelerated growth of whiskers occur with critical imposed strain and specific environmental temperature. Originality/value - Whisker growth in tin coatings is becoming a major reliability concern in modern microelectronics. Immersion coating that produces a matte tin layer is being used extensively in electronic applications. The findings of this study facilitate the development of accelerated tests which represent events that occur over long periods of time during service so that suitable mitigation strategies can be evaluated in a reasonable time period.

    LanguageEnglish (US)
    Pages4-7
    Number of pages4
    JournalSoldering and Surface Mount Technology
    Volume20
    Issue number1
    DOIs
    StatePublished - 2008

    Profile

    tin
    Tin
    Temperature
    methodology
    coatings
    copper
    temperature
    Copper
    Coatings
    microelectronics
    submerging
    ambient temperature
    humidity
    strip
    wire
    fibers
    electronics
    Microelectronics
    Atmospheric humidity
    Wire

    Keywords

    • Coatings
    • Electronic engineering
    • Strain measurement

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering
    • Materials Science(all)
    • Metals and Alloys

    Cite this

    Southworth, A. R., Ho, C. E., Lee, A., & Subramanian, K. N. (2008). Effect of strain on whisker growth in matte tin. Soldering and Surface Mount Technology, 20(1), 4-7. DOI: 10.1108/09540910810861422

    Effect of strain on whisker growth in matte tin. / Southworth, A. R.; Ho, C. E.; Lee, A.; Subramanian, K. N.

    In: Soldering and Surface Mount Technology, Vol. 20, No. 1, 2008, p. 4-7.

    Research output: Research - peer-reviewArticle

    Southworth, AR, Ho, CE, Lee, A & Subramanian, KN 2008, 'Effect of strain on whisker growth in matte tin' Soldering and Surface Mount Technology, vol 20, no. 1, pp. 4-7. DOI: 10.1108/09540910810861422
    Southworth AR, Ho CE, Lee A, Subramanian KN. Effect of strain on whisker growth in matte tin. Soldering and Surface Mount Technology. 2008;20(1):4-7. Available from, DOI: 10.1108/09540910810861422
    Southworth, A. R. ; Ho, C. E. ; Lee, A. ; Subramanian, K. N./ Effect of strain on whisker growth in matte tin. In: Soldering and Surface Mount Technology. 2008 ; Vol. 20, No. 1. pp. 4-7
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