Effect of strain on whisker growth in matte tin

A. R. Southworth, C. E. Ho, A. Lee, K. N. Subramanian

Research output: Contribution to journalArticle

  • 4 Citations

Abstract

Purpose - To evaluate the role of imposed strain on whisker growth in matte tin, and to identify the appropriate deformation states and environments that will facilitate the development of a reliable, accelerated test methodology to provide results representative of whisker growth under long-term service conditions. Design/methodology/approach - Whisker growth in matte tin coated strips and wires of copper subjected to various outer fibre strains was characterized at three different temperatures under different humidity conditions. Findings - This study presents findings of the influence of imposed strain and temperature on whisker growth in a matte tin layers present on a copper substrate. A decrease in incubation time and accelerated growth of whiskers occur with critical imposed strain and specific environmental temperature. Originality/value - Whisker growth in tin coatings is becoming a major reliability concern in modern microelectronics. Immersion coating that produces a matte tin layer is being used extensively in electronic applications. The findings of this study facilitate the development of accelerated tests which represent events that occur over long periods of time during service so that suitable mitigation strategies can be evaluated in a reasonable time period.

LanguageEnglish (US)
Pages4-7
Number of pages4
JournalSoldering and Surface Mount Technology
Volume20
Issue number1
DOIs
StatePublished - 2008

Profile

Tin
tin
Copper
methodology
coatings
copper
Coatings
microelectronics
Microelectronics
Temperature
submerging
ambient temperature
humidity
strip
Atmospheric humidity
wire
Wire
fibers
temperature
Fibers

Keywords

  • Coatings
  • Electronic engineering
  • Strain measurement

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)
  • Metals and Alloys

Cite this

Southworth, A. R., Ho, C. E., Lee, A., & Subramanian, K. N. (2008). Effect of strain on whisker growth in matte tin. Soldering and Surface Mount Technology, 20(1), 4-7. DOI: 10.1108/09540910810861422

Effect of strain on whisker growth in matte tin. / Southworth, A. R.; Ho, C. E.; Lee, A.; Subramanian, K. N.

In: Soldering and Surface Mount Technology, Vol. 20, No. 1, 2008, p. 4-7.

Research output: Contribution to journalArticle

Southworth, AR, Ho, CE, Lee, A & Subramanian, KN 2008, 'Effect of strain on whisker growth in matte tin' Soldering and Surface Mount Technology, vol 20, no. 1, pp. 4-7. DOI: 10.1108/09540910810861422
Southworth AR, Ho CE, Lee A, Subramanian KN. Effect of strain on whisker growth in matte tin. Soldering and Surface Mount Technology. 2008;20(1):4-7. Available from, DOI: 10.1108/09540910810861422
Southworth, A. R. ; Ho, C. E. ; Lee, A. ; Subramanian, K. N./ Effect of strain on whisker growth in matte tin. In: Soldering and Surface Mount Technology. 2008 ; Vol. 20, No. 1. pp. 4-7
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