Effect of thermal processing on the microstructure and composition of Cu-Sb-Se compounds

P. W. Majsztrik, M. Kirkham, V. Garcia-Negron, Edgar Lara-Curzio, E. J. Skoug, D. T. Morelli

    Research output: Research - peer-reviewArticle

    Abstract

    We report on the effects of thermal processing on the microstructure and composition of a system with overall stoichiometry of 3Cu:1Sb:3Se with the aim of producing single-phase Cu 3SbSe 3. It was found that slow cooling from the melt produced a multiphase material consisting of Cu 2Se and CuSbSe 2, but devoid of Cu 3SbSe 3. Cooling rapidly from the melt resulted in three-phase microstructures consisting of Cu 2Se, CuSbSe 2, and Cu 3SbSe 3. Subsequent annealing of the three-phase material between 325 and 400 °C shifted the composition toward nearly pure Cu 3SbSe 3-the target compound of this work. The kinetics of the transformation into Cu 3SbSe 3 was successfully described using a modified Avrami model which suggests that diffusion is the rate-controlling step. Values of Young's modulus and hardness, obtained by nanoindentation, are reported for Cu 2Se, CuSbSe 2, and Cu 3SbSe 3.

    LanguageEnglish (US)
    Pages1-11
    Number of pages11
    JournalJournal of Materials Science
    DOIs
    StateAccepted/In press - 2012

    Profile

    Cooling
    Microstructure
    Chemical analysis
    Nanoindentation
    Stoichiometry
    Elastic moduli
    Hardness
    Annealing
    Kinetics

    ASJC Scopus subject areas

    • Materials Science(all)
    • Mechanics of Materials
    • Mechanical Engineering

    Cite this

    Effect of thermal processing on the microstructure and composition of Cu-Sb-Se compounds. / Majsztrik, P. W.; Kirkham, M.; Garcia-Negron, V.; Lara-Curzio, Edgar; Skoug, E. J.; Morelli, D. T.

    In: Journal of Materials Science, 2012, p. 1-11.

    Research output: Research - peer-reviewArticle

    Majsztrik PW, Kirkham M, Garcia-Negron V, Lara-Curzio E, Skoug EJ, Morelli DT. Effect of thermal processing on the microstructure and composition of Cu-Sb-Se compounds. Journal of Materials Science. 2012;1-11. Available from, DOI: 10.1007/s10853-012-6994-x
    Majsztrik, P. W. ; Kirkham, M. ; Garcia-Negron, V. ; Lara-Curzio, Edgar ; Skoug, E. J. ; Morelli, D. T./ Effect of thermal processing on the microstructure and composition of Cu-Sb-Se compounds. In: Journal of Materials Science. 2012 ; pp. 1-11
    @article{3bd029a4a7c24c4d9c2cf990c10165ac,
    title = "Effect of thermal processing on the microstructure and composition of Cu-Sb-Se compounds",
    abstract = "We report on the effects of thermal processing on the microstructure and composition of a system with overall stoichiometry of 3Cu:1Sb:3Se with the aim of producing single-phase Cu 3SbSe 3. It was found that slow cooling from the melt produced a multiphase material consisting of Cu 2Se and CuSbSe 2, but devoid of Cu 3SbSe 3. Cooling rapidly from the melt resulted in three-phase microstructures consisting of Cu 2Se, CuSbSe 2, and Cu 3SbSe 3. Subsequent annealing of the three-phase material between 325 and 400 °C shifted the composition toward nearly pure Cu 3SbSe 3-the target compound of this work. The kinetics of the transformation into Cu 3SbSe 3 was successfully described using a modified Avrami model which suggests that diffusion is the rate-controlling step. Values of Young's modulus and hardness, obtained by nanoindentation, are reported for Cu 2Se, CuSbSe 2, and Cu 3SbSe 3.",
    author = "Majsztrik, {P. W.} and M. Kirkham and V. Garcia-Negron and Edgar Lara-Curzio and Skoug, {E. J.} and Morelli, {D. T.}",
    year = "2012",
    doi = "10.1007/s10853-012-6994-x",
    pages = "1--11",
    journal = "Journal of Materials Science",
    issn = "0022-2461",
    publisher = "Springer Netherlands",

    }

    TY - JOUR

    T1 - Effect of thermal processing on the microstructure and composition of Cu-Sb-Se compounds

    AU - Majsztrik,P. W.

    AU - Kirkham,M.

    AU - Garcia-Negron,V.

    AU - Lara-Curzio,Edgar

    AU - Skoug,E. J.

    AU - Morelli,D. T.

    PY - 2012

    Y1 - 2012

    N2 - We report on the effects of thermal processing on the microstructure and composition of a system with overall stoichiometry of 3Cu:1Sb:3Se with the aim of producing single-phase Cu 3SbSe 3. It was found that slow cooling from the melt produced a multiphase material consisting of Cu 2Se and CuSbSe 2, but devoid of Cu 3SbSe 3. Cooling rapidly from the melt resulted in three-phase microstructures consisting of Cu 2Se, CuSbSe 2, and Cu 3SbSe 3. Subsequent annealing of the three-phase material between 325 and 400 °C shifted the composition toward nearly pure Cu 3SbSe 3-the target compound of this work. The kinetics of the transformation into Cu 3SbSe 3 was successfully described using a modified Avrami model which suggests that diffusion is the rate-controlling step. Values of Young's modulus and hardness, obtained by nanoindentation, are reported for Cu 2Se, CuSbSe 2, and Cu 3SbSe 3.

    AB - We report on the effects of thermal processing on the microstructure and composition of a system with overall stoichiometry of 3Cu:1Sb:3Se with the aim of producing single-phase Cu 3SbSe 3. It was found that slow cooling from the melt produced a multiphase material consisting of Cu 2Se and CuSbSe 2, but devoid of Cu 3SbSe 3. Cooling rapidly from the melt resulted in three-phase microstructures consisting of Cu 2Se, CuSbSe 2, and Cu 3SbSe 3. Subsequent annealing of the three-phase material between 325 and 400 °C shifted the composition toward nearly pure Cu 3SbSe 3-the target compound of this work. The kinetics of the transformation into Cu 3SbSe 3 was successfully described using a modified Avrami model which suggests that diffusion is the rate-controlling step. Values of Young's modulus and hardness, obtained by nanoindentation, are reported for Cu 2Se, CuSbSe 2, and Cu 3SbSe 3.

    UR - http://www.scopus.com/inward/record.url?scp=84869450426&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=84869450426&partnerID=8YFLogxK

    U2 - 10.1007/s10853-012-6994-x

    DO - 10.1007/s10853-012-6994-x

    M3 - Article

    SP - 1

    EP - 11

    JO - Journal of Materials Science

    T2 - Journal of Materials Science

    JF - Journal of Materials Science

    SN - 0022-2461

    ER -