Effect of thermomechanical processing on the creep behaviour of Udimet alloy 188

C. J. Boehlert, S. C. Longanbach, T. R. Bieler

Research output: Contribution to journalArticle

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Abstract

Udimet alloy 188 was subjected to grain-boundary engineering involving thermomechanical processing in an attempt to improve the creep performance and determine the effects on creep deformation processes. The as-received sheet was cold-rolled to either 10, 25 or 35% reduction per pass followed by a solution treatment at 1191°C for 1 h plus air cooling. This sequence was repeated four times and the resultant microstructure and grain-boundary character distribution were described using electron backscatter diffraction. The fraction of general high-angle grain boundaries tended to increase with increased cold rolling. The 10 and 25% cold-rolled materials exhibited lower creep rates than the 35% cold-rolled material. The measured creep stress exponents and activation energies suggested that dislocation creep with lattice self-diffusion was dominant at 760°C for stresses ranging between 100 and 220 MPa. A transition in the creep exponent below the applied stresses of 100 MPa indicated that a different secondary creep mechanism was rate-controlling at low stresses. A significant amount of grain-boundary cracking was observed both on the surface and subsurface of deformed samples, but surface cracks were greater in number and size than those within the bulk. The cracking behaviour was similar in both vacuum and air environments, indicating that grain-boundary cracking was not caused by environment. To assess the mechanisms of crack nucleation, in situ scanning electron microscopy was performed during elevated-temperature (T ≤ 760°C) tensile-creep deformation. Sequential secondary electron imaging and electron backscatter diffraction orientation mapping were performed in situ to allow the evolution of crack nucleation and linkage to be followed. Cracking occurred preferentially along general high-angle grain boundaries and less than 15% of the cracks were found on low-angle grain boundaries and coincident site lattice boundaries. A fracture initiation parameter analysis was performed to identify the role of slip system interactions at the boundaries and their impact on crack nucleation. The parameter was successful in separating the population of intact and cracked general high-angle boundaries at lower levels of strain, but not after crack coalescence dominated the fracture process. The findings of this work have significant implications regarding grain-boundary engineering of this alloy and potentially for other alloy systems.

LanguageEnglish (US)
Pages641-664
Number of pages24
JournalPhilosophical Magazine
Volume88
Issue number5
DOIs
StatePublished - Feb 2008

Profile

Udimet alloys
grain boundaries
cracks
nucleation
tensile creep
exponents
engineering
air cooling
cold rolling
electrons
surface cracks
Creep
diffraction
linkages
coalescing
slip

Keywords

  • Creep
  • Electron backscatter diffraction
  • Microstructure

ASJC Scopus subject areas

  • Philosophy

Cite this

Effect of thermomechanical processing on the creep behaviour of Udimet alloy 188. / Boehlert, C. J.; Longanbach, S. C.; Bieler, T. R.

In: Philosophical Magazine, Vol. 88, No. 5, 02.2008, p. 641-664.

Research output: Contribution to journalArticle

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abstract = "Udimet alloy 188 was subjected to grain-boundary engineering involving thermomechanical processing in an attempt to improve the creep performance and determine the effects on creep deformation processes. The as-received sheet was cold-rolled to either 10, 25 or 35{\%} reduction per pass followed by a solution treatment at 1191°C for 1 h plus air cooling. This sequence was repeated four times and the resultant microstructure and grain-boundary character distribution were described using electron backscatter diffraction. The fraction of general high-angle grain boundaries tended to increase with increased cold rolling. The 10 and 25{\%} cold-rolled materials exhibited lower creep rates than the 35{\%} cold-rolled material. The measured creep stress exponents and activation energies suggested that dislocation creep with lattice self-diffusion was dominant at 760°C for stresses ranging between 100 and 220 MPa. A transition in the creep exponent below the applied stresses of 100 MPa indicated that a different secondary creep mechanism was rate-controlling at low stresses. A significant amount of grain-boundary cracking was observed both on the surface and subsurface of deformed samples, but surface cracks were greater in number and size than those within the bulk. The cracking behaviour was similar in both vacuum and air environments, indicating that grain-boundary cracking was not caused by environment. To assess the mechanisms of crack nucleation, in situ scanning electron microscopy was performed during elevated-temperature (T ≤ 760°C) tensile-creep deformation. Sequential secondary electron imaging and electron backscatter diffraction orientation mapping were performed in situ to allow the evolution of crack nucleation and linkage to be followed. Cracking occurred preferentially along general high-angle grain boundaries and less than 15{\%} of the cracks were found on low-angle grain boundaries and coincident site lattice boundaries. A fracture initiation parameter analysis was performed to identify the role of slip system interactions at the boundaries and their impact on crack nucleation. The parameter was successful in separating the population of intact and cracked general high-angle boundaries at lower levels of strain, but not after crack coalescence dominated the fracture process. The findings of this work have significant implications regarding grain-boundary engineering of this alloy and potentially for other alloy systems.",
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