Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints

Yong Zuo, Limin Ma, Fu Guo, Lei Qiao, Yutian Shu, Andree Lee, K. N. Subramanian

Research output: Contribution to journalArticle

  • 8 Citations

Abstract

Electromigration (EM), creep, and thermal fatigue (TF) are the most important aspects of the reliability of electronic solder joints, the failure mechanisms of which used to be investigated separately. However, current, mechanical loading, and temperature fluctuation usually co-exist under real service conditions, especially as the magnitude of current density is increasing with joint miniaturization. The importance of EM can no longer be simply ignored when analyzing the creep and TF behavior of a solder joint. The published literature reports that current density substantially changes creep rate, but the intrinsic mechanism is still unclear. Hence, the purpose of this study was to investigate the effects of EM on the creep and TF behavior of Sn58Bi solder joints by analyzing the evolution of electrical resistance and microstructure. The results indicated that EM shortens the lifetime of creep or TF of Sn58Bi solder joints. During creep, EM delays or suppresses the cracking and deforming process, so fracture occurs at the cathode interface. During TF, EM suppresses the cracking process and changes the interfacial structure.

LanguageEnglish (US)
Pages4395-4405
Number of pages11
JournalJournal of Electronic Materials
Volume43
Issue number12
DOIs
StatePublished - 2014

Profile

thermal fatigue
Thermal fatigue
Electromigration
electromigration
solders
Soldering alloys
Creep
Current density
current density
Acoustic impedance
miniaturization
electrical resistance
Cathodes
cathodes
life (durability)
microstructure
Microstructure
electronics

Keywords

  • creep
  • electrical resistance
  • electromigration
  • Sn58Bi
  • thermal fatigue

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints. / Zuo, Yong; Ma, Limin; Guo, Fu; Qiao, Lei; Shu, Yutian; Lee, Andree; Subramanian, K. N.

In: Journal of Electronic Materials, Vol. 43, No. 12, 2014, p. 4395-4405.

Research output: Contribution to journalArticle

Zuo, Yong ; Ma, Limin ; Guo, Fu ; Qiao, Lei ; Shu, Yutian ; Lee, Andree ; Subramanian, K. N./ Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints. In: Journal of Electronic Materials. 2014 ; Vol. 43, No. 12. pp. 4395-4405
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