Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints

Yong Zuo, Limin Ma, Fu Guo, Lei Qiao, Yutian Shu, Andree Lee, K. N. Subramanian

    Research output: Contribution to journalArticle

    • 8 Citations

    Abstract

    Electromigration (EM), creep, and thermal fatigue (TF) are the most important aspects of the reliability of electronic solder joints, the failure mechanisms of which used to be investigated separately. However, current, mechanical loading, and temperature fluctuation usually co-exist under real service conditions, especially as the magnitude of current density is increasing with joint miniaturization. The importance of EM can no longer be simply ignored when analyzing the creep and TF behavior of a solder joint. The published literature reports that current density substantially changes creep rate, but the intrinsic mechanism is still unclear. Hence, the purpose of this study was to investigate the effects of EM on the creep and TF behavior of Sn58Bi solder joints by analyzing the evolution of electrical resistance and microstructure. The results indicated that EM shortens the lifetime of creep or TF of Sn58Bi solder joints. During creep, EM delays or suppresses the cracking and deforming process, so fracture occurs at the cathode interface. During TF, EM suppresses the cracking process and changes the interfacial structure.

    Original languageEnglish (US)
    Pages (from-to)4395-4405
    Number of pages11
    JournalJournal of Electronic Materials
    Volume43
    Issue number12
    DOIs
    StatePublished - 2014

    Profile

    Fetal Macrosomia
    Creep
    Electromigration
    electromigration
    Riots
    Thermal fatigue
    thermal fatigue
    Employee Grievances
    Soldering alloys
    solders
    Contraceptives, Oral, Combined
    Current density
    current density
    Acetanilides
    Coumestrol
    Adenoids
    Cimetidine
    Microstructure
    Acoustic impedance
    Cathodes

    Keywords

    • creep
    • electrical resistance
    • electromigration
    • Sn58Bi
    • thermal fatigue

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Materials Chemistry

    Cite this

    Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints. / Zuo, Yong; Ma, Limin; Guo, Fu; Qiao, Lei; Shu, Yutian; Lee, Andree; Subramanian, K. N.

    In: Journal of Electronic Materials, Vol. 43, No. 12, 2014, p. 4395-4405.

    Research output: Contribution to journalArticle

    Zuo, Yong; Ma, Limin; Guo, Fu; Qiao, Lei; Shu, Yutian; Lee, Andree; Subramanian, K. N. / Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints.

    In: Journal of Electronic Materials, Vol. 43, No. 12, 2014, p. 4395-4405.

    Research output: Contribution to journalArticle

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    title = "Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints",
    abstract = "Electromigration (EM), creep, and thermal fatigue (TF) are the most important aspects of the reliability of electronic solder joints, the failure mechanisms of which used to be investigated separately. However, current, mechanical loading, and temperature fluctuation usually co-exist under real service conditions, especially as the magnitude of current density is increasing with joint miniaturization. The importance of EM can no longer be simply ignored when analyzing the creep and TF behavior of a solder joint. The published literature reports that current density substantially changes creep rate, but the intrinsic mechanism is still unclear. Hence, the purpose of this study was to investigate the effects of EM on the creep and TF behavior of Sn58Bi solder joints by analyzing the evolution of electrical resistance and microstructure. The results indicated that EM shortens the lifetime of creep or TF of Sn58Bi solder joints. During creep, EM delays or suppresses the cracking and deforming process, so fracture occurs at the cathode interface. During TF, EM suppresses the cracking process and changes the interfacial structure.",
    keywords = "creep, electrical resistance, electromigration, Sn58Bi, thermal fatigue",
    author = "Yong Zuo and Limin Ma and Fu Guo and Lei Qiao and Yutian Shu and Andree Lee and Subramanian, {K. N.}",
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    AU - Ma,Limin

    AU - Guo,Fu

    AU - Qiao,Lei

    AU - Shu,Yutian

    AU - Lee,Andree

    AU - Subramanian,K. N.

    PY - 2014

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    AB - Electromigration (EM), creep, and thermal fatigue (TF) are the most important aspects of the reliability of electronic solder joints, the failure mechanisms of which used to be investigated separately. However, current, mechanical loading, and temperature fluctuation usually co-exist under real service conditions, especially as the magnitude of current density is increasing with joint miniaturization. The importance of EM can no longer be simply ignored when analyzing the creep and TF behavior of a solder joint. The published literature reports that current density substantially changes creep rate, but the intrinsic mechanism is still unclear. Hence, the purpose of this study was to investigate the effects of EM on the creep and TF behavior of Sn58Bi solder joints by analyzing the evolution of electrical resistance and microstructure. The results indicated that EM shortens the lifetime of creep or TF of Sn58Bi solder joints. During creep, EM delays or suppresses the cracking and deforming process, so fracture occurs at the cathode interface. During TF, EM suppresses the cracking process and changes the interfacial structure.

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