Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

A. Lee, C. E. Ho, K. N. Subramanian

Research output: Contribution to journalArticle

  • 13 Citations

Abstract

Simultaneous direct current stressing with thermal aging accelerates the migration of conducting species resulting in significant microstructural coarsening. Because of the synergistic fields influence, such coarsening begins from the anode and propagates toward the cathode. Prolonged current stressing with 104 A/cM2 at 150 °C causes the inter-lamellar eutectic SnPb to become a two-layer structure, with a Pb-rich layer adjacent to the anode and an Sn-rich layer adjacent to the cathode. This mass movement causes hillock/valley formation, and the extents of such surface undulations increase with increases in the time duration of current stressing as well as with the joint thickness. In thinner solder joints these events occur sooner, although the extents of surface undulations depend on the thickness of joints. In addition, Cu present in the substrate and in the intermetallic layer at the cathode migrates to form Cu6Sn5 within the Sn-rich layer, in a region close to the Pb-rich layer.

LanguageEnglish (US)
Pages3265-3272
Number of pages8
JournalJournal of Materials Research
Volume22
Issue number11
DOIs
StatePublished - Nov 2007

Profile

Electromigration
electromigration
solders
eutectics
Soldering alloys
Eutectics
Cathodes
Coarsening
microstructure
Microstructure
Anodes
Thermal aging
cathodes
Intermetallics
anodes
causes
Substrates
intermetallics
valleys
direct current

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints. / Lee, A.; Ho, C. E.; Subramanian, K. N.

In: Journal of Materials Research, Vol. 22, No. 11, 11.2007, p. 3265-3272.

Research output: Contribution to journalArticle

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