Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

A. Lee, C. E. Ho, K. N. Subramanian

    Research output: Contribution to journalArticle

    • 13 Citations

    Abstract

    Simultaneous direct current stressing with thermal aging accelerates the migration of conducting species resulting in significant microstructural coarsening. Because of the synergistic fields influence, such coarsening begins from the anode and propagates toward the cathode. Prolonged current stressing with 104 A/cM2 at 150 °C causes the inter-lamellar eutectic SnPb to become a two-layer structure, with a Pb-rich layer adjacent to the anode and an Sn-rich layer adjacent to the cathode. This mass movement causes hillock/valley formation, and the extents of such surface undulations increase with increases in the time duration of current stressing as well as with the joint thickness. In thinner solder joints these events occur sooner, although the extents of surface undulations depend on the thickness of joints. In addition, Cu present in the substrate and in the intermetallic layer at the cathode migrates to form Cu6Sn5 within the Sn-rich layer, in a region close to the Pb-rich layer.

    Original languageEnglish (US)
    Pages (from-to)3265-3272
    Number of pages8
    JournalJournal of Materials Research
    Volume22
    Issue number11
    DOIs
    StatePublished - Nov 2007

    Profile

    Coumestrol
    Cathodes
    Cardanolides
    Employee Grievances
    Edema Disease of Swine
    Dermatoglyphics
    Autopsy
    Coarsening
    Soldering alloys
    Eutectics
    Anodes
    cathodes
    Rift Valley Fever
    Fetal Macrosomia
    Haiti
    Microstructure
    Substrates
    Thermal aging
    Electromigration
    Intermetallics

    ASJC Scopus subject areas

    • Materials Science(all)

    Cite this

    Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints. / Lee, A.; Ho, C. E.; Subramanian, K. N.

    In: Journal of Materials Research, Vol. 22, No. 11, 11.2007, p. 3265-3272.

    Research output: Contribution to journalArticle

    Lee, A.; Ho, C. E.; Subramanian, K. N. / Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints.

    In: Journal of Materials Research, Vol. 22, No. 11, 11.2007, p. 3265-3272.

    Research output: Contribution to journalArticle

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    abstract = "Simultaneous direct current stressing with thermal aging accelerates the migration of conducting species resulting in significant microstructural coarsening. Because of the synergistic fields influence, such coarsening begins from the anode and propagates toward the cathode. Prolonged current stressing with 104 A/cM2 at 150 °C causes the inter-lamellar eutectic SnPb to become a two-layer structure, with a Pb-rich layer adjacent to the anode and an Sn-rich layer adjacent to the cathode. This mass movement causes hillock/valley formation, and the extents of such surface undulations increase with increases in the time duration of current stressing as well as with the joint thickness. In thinner solder joints these events occur sooner, although the extents of surface undulations depend on the thickness of joints. In addition, Cu present in the substrate and in the intermetallic layer at the cathode migrates to form Cu6Sn5 within the Sn-rich layer, in a region close to the Pb-rich layer.",
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