Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang Lung Lin, Sung K. Kang, Jenq Gong Duh, Andre Lee, Thomas Bieler, Laura Turbini, Rajen Sidhu, Fu Guo, Iver Anderson

    Research output: Research - peer-reviewArticle

    • 2 Citations
    LanguageEnglish (US)
    Pages2503
    Number of pages1
    JournalJournal of Electronic Materials
    Volume39
    Issue number12
    DOIs
    StatePublished - Dec 2010

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Materials Chemistry

    Cite this

    Foreword : Pb-free solders and emerging interconnect and packaging technologies. / Lin, Kwang Lung; Kang, Sung K.; Duh, Jenq Gong; Lee, Andre; Bieler, Thomas; Turbini, Laura; Sidhu, Rajen; Guo, Fu; Anderson, Iver.

    In: Journal of Electronic Materials, Vol. 39, No. 12, 12.2010, p. 2503.

    Research output: Research - peer-reviewArticle

    Lin, KL, Kang, SK, Duh, JG, Lee, A, Bieler, T, Turbini, L, Sidhu, R, Guo, F & Anderson, I 2010, 'Foreword: Pb-free solders and emerging interconnect and packaging technologies' Journal of Electronic Materials, vol 39, no. 12, pp. 2503. DOI: 10.1007/s11664-010-1389-8
    Lin, Kwang Lung ; Kang, Sung K. ; Duh, Jenq Gong ; Lee, Andre ; Bieler, Thomas ; Turbini, Laura ; Sidhu, Rajen ; Guo, Fu ; Anderson, Iver. / Foreword : Pb-free solders and emerging interconnect and packaging technologies. In: Journal of Electronic Materials. 2010 ; Vol. 39, No. 12. pp. 2503
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