Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang Lung Lin, Sung K. Kang, Jenq Gong Duh, Andre Lee, Thomas Bieler, Laura Turbini, Rajen Sidhu, Fu Guo, Iver Anderson

Research output: Contribution to journalArticle

  • 2 Citations
LanguageEnglish (US)
Pages2503
Number of pages1
JournalJournal of Electronic Materials
Volume39
Issue number12
DOIs
StatePublished - Dec 2010

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Foreword : Pb-free solders and emerging interconnect and packaging technologies. / Lin, Kwang Lung; Kang, Sung K.; Duh, Jenq Gong; Lee, Andre; Bieler, Thomas; Turbini, Laura; Sidhu, Rajen; Guo, Fu; Anderson, Iver.

In: Journal of Electronic Materials, Vol. 39, No. 12, 12.2010, p. 2503.

Research output: Contribution to journalArticle

Lin, KL, Kang, SK, Duh, JG, Lee, A, Bieler, T, Turbini, L, Sidhu, R, Guo, F & Anderson, I 2010, 'Foreword: Pb-free solders and emerging interconnect and packaging technologies' Journal of Electronic Materials, vol. 39, no. 12, pp. 2503. DOI: 10.1007/s11664-010-1389-8
Lin, Kwang Lung ; Kang, Sung K. ; Duh, Jenq Gong ; Lee, Andre ; Bieler, Thomas ; Turbini, Laura ; Sidhu, Rajen ; Guo, Fu ; Anderson, Iver. / Foreword : Pb-free solders and emerging interconnect and packaging technologies. In: Journal of Electronic Materials. 2010 ; Vol. 39, No. 12. pp. 2503
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