Fundamentals of electromigration in a multiphase material

Andre Lee, K. N. Subramanian, Cheng En Ho

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LanguageEnglish (US)
Title of host publicationIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference
Pages374-380
Number of pages7
StatePublished - 2008
EventIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008 - Scottsdale, AZ, United States
Duration: Mar 17 2008Mar 17 2008

Other

OtherIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008
CountryUnited States
CityScottsdale, AZ
Period3/17/083/17/08

Profile

Electromigration

ASJC Scopus subject areas

  • Surfaces, Coatings and Films

Cite this

Lee, A., Subramanian, K. N., & Ho, C. E. (2008). Fundamentals of electromigration in a multiphase material. In IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference (pp. 374-380)

Fundamentals of electromigration in a multiphase material. / Lee, Andre; Subramanian, K. N.; Ho, Cheng En.

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. p. 374-380.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lee, A, Subramanian, KN & Ho, CE 2008, Fundamentals of electromigration in a multiphase material. in IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. pp. 374-380, IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008, Scottsdale, AZ, United States, 3/17/08.
Lee A, Subramanian KN, Ho CE. Fundamentals of electromigration in a multiphase material. In IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. p. 374-380.
Lee, Andre ; Subramanian, K. N. ; Ho, Cheng En. / Fundamentals of electromigration in a multiphase material. IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. pp. 374-380
@inproceedings{ae41e8ccb9964e3b982010ad4e4a4114,
title = "Fundamentals of electromigration in a multiphase material",
author = "Andre Lee and Subramanian, {K. N.} and Ho, {Cheng En}",
year = "2008",
language = "English (US)",
pages = "374--380",
booktitle = "IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference",

}

TY - GEN

T1 - Fundamentals of electromigration in a multiphase material

AU - Lee,Andre

AU - Subramanian,K. N.

AU - Ho,Cheng En

PY - 2008

Y1 - 2008

UR - http://www.scopus.com/inward/record.url?scp=84877299643&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84877299643&partnerID=8YFLogxK

M3 - Conference contribution

SP - 374

EP - 380

BT - IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

ER -