Fundamentals of electromigration in a multiphase material

Andre Lee, K. N. Subramanian, Cheng En Ho

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Original languageEnglish (US)
    Title of host publicationIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference
    Pages374-380
    Number of pages7
    StatePublished - 2008
    EventIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008 - Scottsdale, AZ, United States

    Other

    OtherIMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008
    CountryUnited States
    CityScottsdale, AZ
    Period3/17/083/17/08

    Profile

    Electromigration

    ASJC Scopus subject areas

    • Surfaces, Coatings and Films

    Cite this

    Lee, A., Subramanian, K. N., & Ho, C. E. (2008). Fundamentals of electromigration in a multiphase material. In IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference (pp. 374-380)

    Fundamentals of electromigration in a multiphase material. / Lee, Andre; Subramanian, K. N.; Ho, Cheng En.

    IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. p. 374-380.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Lee, A, Subramanian, KN & Ho, CE 2008, Fundamentals of electromigration in a multiphase material. in IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. pp. 374-380, IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Spring Conference on Global Business Council, GBC 2008, Scottsdale, AZ, United States, 17-17 March.
    Lee A, Subramanian KN, Ho CE. Fundamentals of electromigration in a multiphase material. In IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. p. 374-380.

    Lee, Andre; Subramanian, K. N.; Ho, Cheng En / Fundamentals of electromigration in a multiphase material.

    IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference. 2008. p. 374-380.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

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