Fundamentals of lead-free solder interconnect technology: From microstructures to reliability

Tae Kyu Lee, Thomas R. Bieler, Choong Un Kim, Hongtao Ma

Research output: Book/ReportBook

  • 13 Citations

Abstract

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

LanguageEnglish (US)
PublisherSpringer US
Number of pages253
ISBN (Print)9781461492665, 9781461492658
DOIs
StatePublished - Jan 1 2015

Profile

Lead
Soldering
Microstructure
Tin
Electromigration
Soldering alloys
Electronic equipment
Physical properties
Mechanical properties
Lead-free solders

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

Cite this

Fundamentals of lead-free solder interconnect technology : From microstructures to reliability. / Lee, Tae Kyu; Bieler, Thomas R.; Kim, Choong Un; Ma, Hongtao.

Springer US, 2015. 253 p.

Research output: Book/ReportBook

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