Fundamentals of lead-free solder interconnect technology: From microstructures to reliability

Tae Kyu Lee, Thomas R. Bieler, Choong Un Kim, Hongtao Ma

    Research output: Book/ReportBook

    • 8 Citations

    Abstract

    This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

    Original languageEnglish (US)
    PublisherSpringer US
    Number of pages253
    ISBN (Print)9781461492665, 9781461492658
    DOIs
    StatePublished - Jan 1 2015

    Profile

    Acyclic Acids
    Chorda Tympani Nerve
    Thrombosis
    Soldering
    Lead-free solders
    Employee Grievances
    Caprylates
    Fetal Macrosomia
    Abducens Nerve
    Abdominal Muscles
    Ascorbic Acid
    Microstructure
    Electromigration
    Soldering alloys
    Tin
    Electronic equipment
    Physical properties
    Mechanical properties

    ASJC Scopus subject areas

    • Engineering(all)
    • Materials Science(all)

    Cite this

    Fundamentals of lead-free solder interconnect technology : From microstructures to reliability. / Lee, Tae Kyu; Bieler, Thomas R.; Kim, Choong Un; Ma, Hongtao.

    Springer US, 2015. 253 p.

    Research output: Book/ReportBook

    Lee, Tae Kyu; Bieler, Thomas R.; Kim, Choong Un; Ma, Hongtao / Fundamentals of lead-free solder interconnect technology : From microstructures to reliability.

    Springer US, 2015. 253 p.

    Research output: Book/ReportBook

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