Impact behavior of thermomechanically fatigued Sn-based solder joints

Takayuki Kobayashi, Andre Lee, K. N. Subramanian

Research output: Contribution to journalArticle

  • 6 Citations

Abstract

Impact behavior of Sn-3 wt.%Ag-0.5 wt.%Cu (SAC 305) solder joints subjected to thermomechanical fatigue in different temperature regimes was investigated. This study was aimed at understanding the roles of distributed cracks that develop near the solder/substrate interface region during early stages of thermal excursions. Two specimen geometries were employed to evaluate mode I and mode II types of fracture under impact in solder joints several hundred microns thick. The peak stress that could be withstood in mode I fracture under impact decreased with increasing number of thermomechanical fatigue cycles, while mode II fracture was insensitive to the same. No observable influence on the impact strength due to the temperature regimes was noted. However, the fracture surfaces of specimens subjected to thermal excursions at the lower-temperature regime were predominantly along the Cu 6Sn 5/solder interface, while specimens subjected to the higher-temperature regime predominantly fractured along the Sn-Sn grain boundaries. These observations are consistent with the findings of prior studies dealing with damage accumulation in the early stages of thermal excursions in these temperature regimes.

LanguageEnglish (US)
Pages2659-2667
Number of pages9
JournalJournal of Electronic Materials
Volume38
Issue number12
DOIs
StatePublished - Dec 2009

Profile

solders
Soldering alloys
specimen geometry
impact strength
Temperature
Fatigue of materials
temperature
Impact strength
cracks
grain boundaries
damage
Grain boundaries
cycles
Cracks
Geometry
Substrates
Hot Temperature

Keywords

  • Fracture modes
  • Impact
  • Pb-free solders
  • Thermomechanical fatigue

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Impact behavior of thermomechanically fatigued Sn-based solder joints. / Kobayashi, Takayuki; Lee, Andre; Subramanian, K. N.

In: Journal of Electronic Materials, Vol. 38, No. 12, 12.2009, p. 2659-2667.

Research output: Contribution to journalArticle

Kobayashi, Takayuki ; Lee, Andre ; Subramanian, K. N./ Impact behavior of thermomechanically fatigued Sn-based solder joints. In: Journal of Electronic Materials. 2009 ; Vol. 38, No. 12. pp. 2659-2667
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