Impact behavior of thermomechanically fatigued Sn-based solder joints

Takayuki Kobayashi, Andre Lee, K. N. Subramanian

    Research output: Contribution to journalArticle

    • 6 Citations

    Abstract

    Impact behavior of Sn-3 wt.%Ag-0.5 wt.%Cu (SAC 305) solder joints subjected to thermomechanical fatigue in different temperature regimes was investigated. This study was aimed at understanding the roles of distributed cracks that develop near the solder/substrate interface region during early stages of thermal excursions. Two specimen geometries were employed to evaluate mode I and mode II types of fracture under impact in solder joints several hundred microns thick. The peak stress that could be withstood in mode I fracture under impact decreased with increasing number of thermomechanical fatigue cycles, while mode II fracture was insensitive to the same. No observable influence on the impact strength due to the temperature regimes was noted. However, the fracture surfaces of specimens subjected to thermal excursions at the lower-temperature regime were predominantly along the Cu 6Sn 5/solder interface, while specimens subjected to the higher-temperature regime predominantly fractured along the Sn-Sn grain boundaries. These observations are consistent with the findings of prior studies dealing with damage accumulation in the early stages of thermal excursions in these temperature regimes.

    Original languageEnglish (US)
    Pages (from-to)2659-2667
    Number of pages9
    JournalJournal of Electronic Materials
    Volume38
    Issue number12
    DOIs
    StatePublished - Dec 2009

    Profile

    Employee Grievances
    Acetanilides
    Soldering alloys
    Temperature
    solders
    Cimetidine
    Hot Temperature
    temperature
    Endometrial Hyperplasia
    Fatigue of materials
    Edema Disease of Swine
    Levocardia
    Addison Disease
    Grain boundaries
    Geometry
    Substrates
    Enzymes
    Impact strength
    Cracks
    specimen geometry

    Keywords

    • Fracture modes
    • Impact
    • Pb-free solders
    • Thermomechanical fatigue

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Materials Chemistry

    Cite this

    Impact behavior of thermomechanically fatigued Sn-based solder joints. / Kobayashi, Takayuki; Lee, Andre; Subramanian, K. N.

    In: Journal of Electronic Materials, Vol. 38, No. 12, 12.2009, p. 2659-2667.

    Research output: Contribution to journalArticle

    Kobayashi, Takayuki; Lee, Andre; Subramanian, K. N. / Impact behavior of thermomechanically fatigued Sn-based solder joints.

    In: Journal of Electronic Materials, Vol. 38, No. 12, 12.2009, p. 2659-2667.

    Research output: Contribution to journalArticle

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    abstract = "Impact behavior of Sn-3 wt.%Ag-0.5 wt.%Cu (SAC 305) solder joints subjected to thermomechanical fatigue in different temperature regimes was investigated. This study was aimed at understanding the roles of distributed cracks that develop near the solder/substrate interface region during early stages of thermal excursions. Two specimen geometries were employed to evaluate mode I and mode II types of fracture under impact in solder joints several hundred microns thick. The peak stress that could be withstood in mode I fracture under impact decreased with increasing number of thermomechanical fatigue cycles, while mode II fracture was insensitive to the same. No observable influence on the impact strength due to the temperature regimes was noted. However, the fracture surfaces of specimens subjected to thermal excursions at the lower-temperature regime were predominantly along the Cu 6Sn 5/solder interface, while specimens subjected to the higher-temperature regime predominantly fractured along the Sn-Sn grain boundaries. These observations are consistent with the findings of prior studies dealing with damage accumulation in the early stages of thermal excursions in these temperature regimes.",
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