Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Tae Kyu Lee, Zhiqiang Chen, Greg Baty, Thomas R. Bieler, Choong Un Kim

    Research output: Contribution to journalArticle

    Abstract

    The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

    Original languageEnglish (US)
    Pages (from-to)1-7
    Number of pages7
    JournalJournal of Electronic Materials
    DOIs
    StateAccepted/In press - Sep 6 2016

    Profile

    temperature
    Acetanilides
    Temperature
    mechanical shock
    masks
    shock
    Alcoholic Cardiomyopathy
    Masks
    shock tests
    printed circuits
    circuit boards
    crack propagation
    solders
    rooms
    balls
    grids
    silver
    degradation
    heating
    room temperature

    Keywords

    • high-G
    • high-temperature shock
    • Interconnect
    • lead-free solder
    • mechanical shock

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering
    • Materials Chemistry

    Cite this

    Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance. / Lee, Tae Kyu; Chen, Zhiqiang; Baty, Greg; Bieler, Thomas R.; Kim, Choong Un.

    In: Journal of Electronic Materials, 06.09.2016, p. 1-7.

    Research output: Contribution to journalArticle

    Lee, Tae Kyu; Chen, Zhiqiang; Baty, Greg; Bieler, Thomas R.; Kim, Choong Un / Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance.

    In: Journal of Electronic Materials, 06.09.2016, p. 1-7.

    Research output: Contribution to journalArticle

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