Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Tae Kyu Lee, Zhiqiang Chen, Greg Baty, Thomas R. Bieler, Choong Un Kim

Research output: Contribution to journalArticle

Abstract

The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

LanguageEnglish (US)
Pages1-7
Number of pages7
JournalJournal of Electronic Materials
DOIs
StateAccepted/In press - Sep 6 2016

Profile

mechanical shock
masks
shock
shock tests
Masks
Temperature
Shock testing
temperature
printed circuits
circuit boards
crack propagation
room temperature
Electric heating elements
solders
Ball grid arrays
Mechanical stability
balls
Silver
Printed circuit boards
Soldering alloys

Keywords

  • high-G
  • high-temperature shock
  • Interconnect
  • lead-free solder
  • mechanical shock

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance. / Lee, Tae Kyu; Chen, Zhiqiang; Baty, Greg; Bieler, Thomas R.; Kim, Choong Un.

In: Journal of Electronic Materials, 06.09.2016, p. 1-7.

Research output: Contribution to journalArticle

@article{3dd11ccc75a54b60b6efc6b0951fb13e,
title = "Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance",
abstract = "The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.",
keywords = "high-G, high-temperature shock, Interconnect, lead-free solder, mechanical shock",
author = "Lee, {Tae Kyu} and Zhiqiang Chen and Greg Baty and Bieler, {Thomas R.} and Kim, {Choong Un}",
year = "2016",
month = "9",
day = "6",
doi = "10.1007/s11664-016-4902-x",
language = "English (US)",
pages = "1--7",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",

}

TY - JOUR

T1 - Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

AU - Lee,Tae Kyu

AU - Chen,Zhiqiang

AU - Baty,Greg

AU - Bieler,Thomas R.

AU - Kim,Choong Un

PY - 2016/9/6

Y1 - 2016/9/6

N2 - The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

AB - The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

KW - high-G

KW - high-temperature shock

KW - Interconnect

KW - lead-free solder

KW - mechanical shock

UR - http://www.scopus.com/inward/record.url?scp=84986255598&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84986255598&partnerID=8YFLogxK

U2 - 10.1007/s11664-016-4902-x

DO - 10.1007/s11664-016-4902-x

M3 - Article

SP - 1

EP - 7

JO - Journal of Electronic Materials

T2 - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

ER -