Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Tae Kyu Lee, Zhiqiang Chen, Greg Baty, Thomas R. Bieler, Choong Un Kim

    Research output: Research - peer-reviewArticle

    Abstract

    The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

    LanguageEnglish (US)
    Pages1-7
    Number of pages7
    JournalJournal of Electronic Materials
    DOIs
    StateAccepted/In press - Sep 6 2016

    Profile

    mechanical shock
    temperature
    Temperature
    masks
    shock
    room temperature
    Masks
    shock tests
    printed circuits
    circuit boards
    crack propagation
    solders
    balls
    grids
    silver
    degradation
    heating
    configurations
    Shock testing
    Electric heating elements

    Keywords

    • high-G
    • high-temperature shock
    • Interconnect
    • lead-free solder
    • mechanical shock

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering
    • Materials Chemistry

    Cite this

    Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance. / Lee, Tae Kyu; Chen, Zhiqiang; Baty, Greg; Bieler, Thomas R.; Kim, Choong Un.

    In: Journal of Electronic Materials, 06.09.2016, p. 1-7.

    Research output: Research - peer-reviewArticle

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