In situ study of microstructure and strength of severely predeformed pure Cu in deformation at 573 K

Wolfgang Blum, J. Dvořák, P. Král, M. Petrenec, P. Eisenlohr, V. Sklenička

    Research output: Research - peer-reviewArticle

    • 7 Citations

    Abstract

    The influence of grain refinement on the strength of pure Cu at the elevated temperature of 573 K was studied in situ in a SEM. Thermomechanical processing by eight passes of equal channel angular pressing at ambient temperature and annealing at test temperature generates grains of size. During deformation in the SEM at a relative elongation rate of further grain coarsening occurs by discontinuous recrystallization in subsequent waves causing oscillations of flow stress. Cracks start to form at the boundaries, but partly become intragranular when boundaries move away. The relaxation of flow stress in the periods where the imposed elongation was interrupted yields information about the deformation kinetics. Two mechanisms are identified. One is thermally activated glide related with defect generation. The second one accompanies the processes of microstructure restoration. Under the present deformation conditions, the grain coarsening by DRX does not soften the material but leads to slight hardening as high-Angle boundaries are exchanged for low-Angle boundaries. This is discussed in terms of boundary-mediated processes.

    LanguageEnglish (US)
    Pages3696-3711
    Number of pages16
    JournalPhilosophical Magazine
    Volume95
    Issue number33
    DOIs
    StatePublished - Nov 22 2015

    Profile

    microstructure
    elongation
    scanning electron microscopy
    temperature
    pressing
    hardening
    restoration
    ambient temperature
    cracks
    oscillations
    annealing
    defects
    kinetics

    Keywords

    • dynamic recovery
    • dynamic recrystallization
    • ECAP
    • grains
    • in situ observation
    • static recrystallization
    • strength
    • stress relaxation

    ASJC Scopus subject areas

    • Condensed Matter Physics

    Cite this

    In situ study of microstructure and strength of severely predeformed pure Cu in deformation at 573 K. / Blum, Wolfgang; Dvořák, J.; Král, P.; Petrenec, M.; Eisenlohr, P.; Sklenička, V.

    In: Philosophical Magazine, Vol. 95, No. 33, 22.11.2015, p. 3696-3711.

    Research output: Research - peer-reviewArticle

    Blum W, Dvořák J, Král P, Petrenec M, Eisenlohr P, Sklenička V. In situ study of microstructure and strength of severely predeformed pure Cu in deformation at 573 K. Philosophical Magazine. 2015 Nov 22;95(33):3696-3711. Available from, DOI: 10.1080/14786435.2015.1096025
    Blum, Wolfgang ; Dvořák, J. ; Král, P. ; Petrenec, M. ; Eisenlohr, P. ; Sklenička, V./ In situ study of microstructure and strength of severely predeformed pure Cu in deformation at 573 K. In: Philosophical Magazine. 2015 ; Vol. 95, No. 33. pp. 3696-3711
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    AU - Eisenlohr,P.

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