Influence of high-g mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects

Tae Kyu Lee, Choong Un Kim, Thomas R. Bieler

Research output: Contribution to journalArticle

  • 21 Citations

Abstract

The impact of isothermal aging and recrystallized grain structure distribution on mechanical shock and thermal cycling performance of solder joints with 1% and 3% silver content Sn-Ag-Cu interconnects were investigated. Localized recrystallized grain structure distributions were analyzed to identify correlations between the microstructure evolution and shock performance. The results reveal that the shock tolerance depends on the amount of shock energy that can be absorbed during each shock cycle, which depends on microstructural features. Based on the recrystallized grain distribution, additional isothermal aging in 1% silver Sn-Ag-Cu interconnects shows improved shock performance, whereas degraded shock performance was observed in 3% Sn-Ag-Cu interconnects. Using the same grain boundary distribution analysis on thermally cycled samples, relationships between the particle size distribution, localized recrystallized grain structure development, shock, and thermomechanical performance were identified: finer particle spacing is beneficial for thermal cycling as it resists grain boundary generation, while conversely, wider particle spacing facilitates recrystallization and grain boundary mobility that allows Sn to absorb shock energy.

LanguageEnglish (US)
Pages69-79
Number of pages11
JournalJournal of Electronic Materials
Volume43
Issue number1
DOIs
StatePublished - Jan 2014

Profile

mechanical shock
Crystal microstructure
Thermal cycling
solders
Soldering alloys
Grain boundaries
shock
Silver
cycles
Aging of materials
Particle size analysis
grain boundaries
Microstructure
silver
spacing
particle size distribution
microstructure
energy

Keywords

  • isothermal aging
  • Mechanical shock
  • recrystallization
  • solder
  • thermal cycling

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Influence of high-g mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects. / Lee, Tae Kyu; Kim, Choong Un; Bieler, Thomas R.

In: Journal of Electronic Materials, Vol. 43, No. 1, 01.2014, p. 69-79.

Research output: Contribution to journalArticle

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