Influence of high-g mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects

Tae Kyu Lee, Choong Un Kim, Thomas R. Bieler

    Research output: Contribution to journalArticle

    • 17 Citations

    Abstract

    The impact of isothermal aging and recrystallized grain structure distribution on mechanical shock and thermal cycling performance of solder joints with 1% and 3% silver content Sn-Ag-Cu interconnects were investigated. Localized recrystallized grain structure distributions were analyzed to identify correlations between the microstructure evolution and shock performance. The results reveal that the shock tolerance depends on the amount of shock energy that can be absorbed during each shock cycle, which depends on microstructural features. Based on the recrystallized grain distribution, additional isothermal aging in 1% silver Sn-Ag-Cu interconnects shows improved shock performance, whereas degraded shock performance was observed in 3% Sn-Ag-Cu interconnects. Using the same grain boundary distribution analysis on thermally cycled samples, relationships between the particle size distribution, localized recrystallized grain structure development, shock, and thermomechanical performance were identified: finer particle spacing is beneficial for thermal cycling as it resists grain boundary generation, while conversely, wider particle spacing facilitates recrystallization and grain boundary mobility that allows Sn to absorb shock energy.

    Original languageEnglish (US)
    Pages (from-to)69-79
    Number of pages11
    JournalJournal of Electronic Materials
    Volume43
    Issue number1
    DOIs
    StatePublished - Jan 2014

    Profile

    Erwinia
    Thermal cycling
    Grain boundaries
    Crystal microstructure
    shock
    Employee Grievances
    Oxidoreductases Acting on CH-NH Group Donors
    Soldering alloys
    Silver
    cycles
    grain boundaries
    Mysticism
    Human Engineering
    Microstructure
    Particle size analysis
    mechanical shock
    solders
    silver
    spacing
    energy

    Keywords

    • isothermal aging
    • Mechanical shock
    • recrystallization
    • solder
    • thermal cycling

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Materials Chemistry

    Cite this

    Influence of high-g mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects. / Lee, Tae Kyu; Kim, Choong Un; Bieler, Thomas R.

    In: Journal of Electronic Materials, Vol. 43, No. 1, 01.2014, p. 69-79.

    Research output: Contribution to journalArticle

    Lee, Tae Kyu; Kim, Choong Un; Bieler, Thomas R. / Influence of high-g mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects.

    In: Journal of Electronic Materials, Vol. 43, No. 1, 01.2014, p. 69-79.

    Research output: Contribution to journalArticle

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    abstract = "The impact of isothermal aging and recrystallized grain structure distribution on mechanical shock and thermal cycling performance of solder joints with 1% and 3% silver content Sn-Ag-Cu interconnects were investigated. Localized recrystallized grain structure distributions were analyzed to identify correlations between the microstructure evolution and shock performance. The results reveal that the shock tolerance depends on the amount of shock energy that can be absorbed during each shock cycle, which depends on microstructural features. Based on the recrystallized grain distribution, additional isothermal aging in 1% silver Sn-Ag-Cu interconnects shows improved shock performance, whereas degraded shock performance was observed in 3% Sn-Ag-Cu interconnects. Using the same grain boundary distribution analysis on thermally cycled samples, relationships between the particle size distribution, localized recrystallized grain structure development, shock, and thermomechanical performance were identified: finer particle spacing is beneficial for thermal cycling as it resists grain boundary generation, while conversely, wider particle spacing facilitates recrystallization and grain boundary mobility that allows Sn to absorb shock energy.",
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