Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses

Bruce X. Fu, Madhu Namani, Andre Lee

Research output: Contribution to journalArticle

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Abstract

The influence of phenyl-trisilanol polyhedral silsesquioxane (POSS-triol) on the thermo-mechanical properties and curing of epoxy-amine networks were investigated using dynamic mechanical analysis (DMA) and Fourier transform infrared spectroscopy (FT-IR). Two of the most common epoxy monomers, diglycidyl ether of Bisphenol A (DGEBA), tetraglycidyl diamino diphenyl methane (TGDDM) were used. These epoxies were cured with linear aliphatic diamine: 2-Methyl-1,5-pentadiamine (Dytek® A) or diamine terminated polypropylene oxide (Jeffamine® D230). Using an identical curing schedule, when minor amounts of POSS-triol were added to the epoxy-amine networks, we found a significant improvement on value of Tg. Due to the small quantity of POSS-triol used, this enhancement in Tg is attributed to the catalytic activity of phenyl-trisilanol POSS in promoting a more completely cured epoxy network. This argument is consistent with observed increases in the rubbery plateau modulus due to increases in the crosslink density. But unlike other catalysts such as phenol, we did not observe acceleration of reaction in the pre-gelation stage by this acidic POSS-silanol. Because of its nanoscopic size, this acidic POSS-silanol promotes additional epoxy-amine crosslinking in the post-vitrification stage, which is dominated by diffusion-control mechanisms. We believe this can be utilized in fabrication of fiber-reinforced composites using the resin transfer molding process, where maintaining the low viscosity for a period of time is required to eliminate porosity and to produce higher Tg materials at a lower post-cure temperature.

LanguageEnglish (US)
Pages7739-7747
Number of pages9
JournalPolymer
Volume44
Issue number25
DOIs
StatePublished - Nov 14 2003

Profile

Amines
Diamines
Glass
Curing
Polypropylene oxides
Vitrification
Resin transfer molding
Composite Resins
Methane
Dynamic mechanical analysis
Gelation
Phenol
Crosslinking
Phenols
Fourier transform infrared spectroscopy
Ethers
Catalyst activity
Porosity
Monomers
Viscosity

Keywords

  • Epoxy
  • POSS-silanol
  • Silsesquioxane

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics

Cite this

Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses. / Fu, Bruce X.; Namani, Madhu; Lee, Andre.

In: Polymer, Vol. 44, No. 25, 14.11.2003, p. 7739-7747.

Research output: Contribution to journalArticle

Fu, Bruce X. ; Namani, Madhu ; Lee, Andre. / Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses. In: Polymer. 2003 ; Vol. 44, No. 25. pp. 7739-7747
@article{32af06028c114e338252dc801bd0619a,
title = "Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses",
abstract = "The influence of phenyl-trisilanol polyhedral silsesquioxane (POSS-triol) on the thermo-mechanical properties and curing of epoxy-amine networks were investigated using dynamic mechanical analysis (DMA) and Fourier transform infrared spectroscopy (FT-IR). Two of the most common epoxy monomers, diglycidyl ether of Bisphenol A (DGEBA), tetraglycidyl diamino diphenyl methane (TGDDM) were used. These epoxies were cured with linear aliphatic diamine: 2-Methyl-1,5-pentadiamine (Dytek{\circledR} A) or diamine terminated polypropylene oxide (Jeffamine{\circledR} D230). Using an identical curing schedule, when minor amounts of POSS-triol were added to the epoxy-amine networks, we found a significant improvement on value of Tg. Due to the small quantity of POSS-triol used, this enhancement in Tg is attributed to the catalytic activity of phenyl-trisilanol POSS in promoting a more completely cured epoxy network. This argument is consistent with observed increases in the rubbery plateau modulus due to increases in the crosslink density. But unlike other catalysts such as phenol, we did not observe acceleration of reaction in the pre-gelation stage by this acidic POSS-silanol. Because of its nanoscopic size, this acidic POSS-silanol promotes additional epoxy-amine crosslinking in the post-vitrification stage, which is dominated by diffusion-control mechanisms. We believe this can be utilized in fabrication of fiber-reinforced composites using the resin transfer molding process, where maintaining the low viscosity for a period of time is required to eliminate porosity and to produce higher Tg materials at a lower post-cure temperature.",
keywords = "Epoxy, POSS-silanol, Silsesquioxane",
author = "Fu, {Bruce X.} and Madhu Namani and Andre Lee",
year = "2003",
month = "11",
day = "14",
doi = "10.1016/j.polymer.2003.09.033",
language = "English (US)",
volume = "44",
pages = "7739--7747",
journal = "Polymer (United Kingdom)",
issn = "0032-3861",
publisher = "Elsevier BV",
number = "25",

}

TY - JOUR

T1 - Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses

AU - Fu,Bruce X.

AU - Namani,Madhu

AU - Lee,Andre

PY - 2003/11/14

Y1 - 2003/11/14

N2 - The influence of phenyl-trisilanol polyhedral silsesquioxane (POSS-triol) on the thermo-mechanical properties and curing of epoxy-amine networks were investigated using dynamic mechanical analysis (DMA) and Fourier transform infrared spectroscopy (FT-IR). Two of the most common epoxy monomers, diglycidyl ether of Bisphenol A (DGEBA), tetraglycidyl diamino diphenyl methane (TGDDM) were used. These epoxies were cured with linear aliphatic diamine: 2-Methyl-1,5-pentadiamine (Dytek® A) or diamine terminated polypropylene oxide (Jeffamine® D230). Using an identical curing schedule, when minor amounts of POSS-triol were added to the epoxy-amine networks, we found a significant improvement on value of Tg. Due to the small quantity of POSS-triol used, this enhancement in Tg is attributed to the catalytic activity of phenyl-trisilanol POSS in promoting a more completely cured epoxy network. This argument is consistent with observed increases in the rubbery plateau modulus due to increases in the crosslink density. But unlike other catalysts such as phenol, we did not observe acceleration of reaction in the pre-gelation stage by this acidic POSS-silanol. Because of its nanoscopic size, this acidic POSS-silanol promotes additional epoxy-amine crosslinking in the post-vitrification stage, which is dominated by diffusion-control mechanisms. We believe this can be utilized in fabrication of fiber-reinforced composites using the resin transfer molding process, where maintaining the low viscosity for a period of time is required to eliminate porosity and to produce higher Tg materials at a lower post-cure temperature.

AB - The influence of phenyl-trisilanol polyhedral silsesquioxane (POSS-triol) on the thermo-mechanical properties and curing of epoxy-amine networks were investigated using dynamic mechanical analysis (DMA) and Fourier transform infrared spectroscopy (FT-IR). Two of the most common epoxy monomers, diglycidyl ether of Bisphenol A (DGEBA), tetraglycidyl diamino diphenyl methane (TGDDM) were used. These epoxies were cured with linear aliphatic diamine: 2-Methyl-1,5-pentadiamine (Dytek® A) or diamine terminated polypropylene oxide (Jeffamine® D230). Using an identical curing schedule, when minor amounts of POSS-triol were added to the epoxy-amine networks, we found a significant improvement on value of Tg. Due to the small quantity of POSS-triol used, this enhancement in Tg is attributed to the catalytic activity of phenyl-trisilanol POSS in promoting a more completely cured epoxy network. This argument is consistent with observed increases in the rubbery plateau modulus due to increases in the crosslink density. But unlike other catalysts such as phenol, we did not observe acceleration of reaction in the pre-gelation stage by this acidic POSS-silanol. Because of its nanoscopic size, this acidic POSS-silanol promotes additional epoxy-amine crosslinking in the post-vitrification stage, which is dominated by diffusion-control mechanisms. We believe this can be utilized in fabrication of fiber-reinforced composites using the resin transfer molding process, where maintaining the low viscosity for a period of time is required to eliminate porosity and to produce higher Tg materials at a lower post-cure temperature.

KW - Epoxy

KW - POSS-silanol

KW - Silsesquioxane

UR - http://www.scopus.com/inward/record.url?scp=0242696180&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0242696180&partnerID=8YFLogxK

U2 - 10.1016/j.polymer.2003.09.033

DO - 10.1016/j.polymer.2003.09.033

M3 - Article

VL - 44

SP - 7739

EP - 7747

JO - Polymer (United Kingdom)

T2 - Polymer (United Kingdom)

JF - Polymer (United Kingdom)

SN - 0032-3861

IS - 25

ER -