Material issues in electronic interconnects and packaging

K. N. Subramanian, A. Lee, S. Choi, P. Sonje

    Research output: Contribution to journalArticle

    • 16 Citations

    Abstract

    Electronic packages consist of metallic, polymeric, and sometimes ceramic materials as integral entities. Individual physical and mechanical properties of these constituents, and their influence on each other's behavior, affect the overall reliability of the electronic packages. The most common failures in electronic interconnects arise from thermomechanical fatigue of the solder joints. Mismatches in coefficient of thermal expansion (CTE) that exist between these constituent materials are the main cause of such failures. Several approaches such as alloying and composite methodology are being explored to improve the reliability of the solder, which is metallic in nature, by improving its mechanical attributes. Other avenues such as matching the CTE of the constituent materials are also being considered. In addition, the metallization of the electrical components and electrically non-conducting polymeric/ceramic layer to make it solderable has also been a source of concern regarding the joint reliability. Another concern relates to the high CTE of polymeric boards. This can cause significant CTE mismatch problems if silicon chips are directly mounted on them. Some of our significant findings in these respects are presented.

    Original languageEnglish (US)
    Pages (from-to)372-378
    Number of pages7
    JournalJournal of Electronic Materials
    Volume30
    Issue number4
    StatePublished - Apr 2001

    Profile

    thermal expansion
    coefficients
    electronics
    Dextrocardia
    Thermal expansion
    Traffic Accidents
    solders
    ceramics
    causes
    Employee Grievances
    Soldering alloys
    packaging
    alloying
    physical properties
    chips
    mechanical properties
    methodology
    composite materials
    silicon
    Acriflavine

    Keywords

    • CTE
    • Eutectic Sn-Ag
    • Mismatches
    • Sn-Ag-Cu solder

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Materials Science(all)
    • Electronic, Optical and Magnetic Materials
    • Physics and Astronomy (miscellaneous)

    Cite this

    Subramanian, K. N., Lee, A., Choi, S., & Sonje, P. (2001). Material issues in electronic interconnects and packaging. Journal of Electronic Materials, 30(4), 372-378.

    Material issues in electronic interconnects and packaging. / Subramanian, K. N.; Lee, A.; Choi, S.; Sonje, P.

    In: Journal of Electronic Materials, Vol. 30, No. 4, 04.2001, p. 372-378.

    Research output: Contribution to journalArticle

    Subramanian, KN, Lee, A, Choi, S & Sonje, P 2001, 'Material issues in electronic interconnects and packaging' Journal of Electronic Materials, vol 30, no. 4, pp. 372-378.

    Subramanian, K. N.; Lee, A.; Choi, S.; Sonje, P. / Material issues in electronic interconnects and packaging.

    In: Journal of Electronic Materials, Vol. 30, No. 4, 04.2001, p. 372-378.

    Research output: Contribution to journalArticle

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