Material issues in electronic interconnects and packaging

K. N. Subramanian, A. Lee, S. Choi, P. Sonje

Research output: Contribution to journalArticle

  • 16 Citations

Abstract

Electronic packages consist of metallic, polymeric, and sometimes ceramic materials as integral entities. Individual physical and mechanical properties of these constituents, and their influence on each other's behavior, affect the overall reliability of the electronic packages. The most common failures in electronic interconnects arise from thermomechanical fatigue of the solder joints. Mismatches in coefficient of thermal expansion (CTE) that exist between these constituent materials are the main cause of such failures. Several approaches such as alloying and composite methodology are being explored to improve the reliability of the solder, which is metallic in nature, by improving its mechanical attributes. Other avenues such as matching the CTE of the constituent materials are also being considered. In addition, the metallization of the electrical components and electrically non-conducting polymeric/ceramic layer to make it solderable has also been a source of concern regarding the joint reliability. Another concern relates to the high CTE of polymeric boards. This can cause significant CTE mismatch problems if silicon chips are directly mounted on them. Some of our significant findings in these respects are presented.

LanguageEnglish (US)
Pages372-378
Number of pages7
JournalJournal of Electronic Materials
Volume30
Issue number4
StatePublished - Apr 2001

Profile

packaging
Thermal expansion
thermal expansion
Packaging
coefficients
solders
electronics
Soldering alloys
ceramics
causes
Silicon
Ceramic materials
Metallizing
Alloying
alloying
Physical properties
physical properties
chips
Fatigue of materials
mechanical properties

Keywords

  • CTE
  • Eutectic Sn-Ag
  • Mismatches
  • Sn-Ag-Cu solder

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Physics and Astronomy (miscellaneous)

Cite this

Subramanian, K. N., Lee, A., Choi, S., & Sonje, P. (2001). Material issues in electronic interconnects and packaging. Journal of Electronic Materials, 30(4), 372-378.

Material issues in electronic interconnects and packaging. / Subramanian, K. N.; Lee, A.; Choi, S.; Sonje, P.

In: Journal of Electronic Materials, Vol. 30, No. 4, 04.2001, p. 372-378.

Research output: Contribution to journalArticle

Subramanian, KN, Lee, A, Choi, S & Sonje, P 2001, 'Material issues in electronic interconnects and packaging' Journal of Electronic Materials, vol. 30, no. 4, pp. 372-378.
Subramanian, K. N. ; Lee, A. ; Choi, S. ; Sonje, P./ Material issues in electronic interconnects and packaging. In: Journal of Electronic Materials. 2001 ; Vol. 30, No. 4. pp. 372-378
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