Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

H. Rhee, K. N. Subramanian, A. Lee, J. G. Lee

    Research output: Research - peer-reviewArticle

    • 20 Citations

    Abstract

    Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1 × 1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.

    Translated title of the contributionMechanical characterization of Sn-3.5Ag solder joints at various temperatures
    LanguageFrench
    Pages4-5+21
    JournalSoldering and Surface Mount Technology
    Volume15
    Issue number3
    StatePublished - 2003

    Profile

    Soldering alloys
    Temperature
    solders
    temperature
    Shear strain
    Shear stress
    shear strain
    shear stress
    Eutectics
    Creep
    Fatigue of materials
    Mechanical properties
    Testing
    eutectics
    analyzers
    mechanical properties
    shear

    Keywords

    • Deformation
    • Fatigue
    • Joining processes
    • Mechanical properties of materials
    • Soldering

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering
    • Materials Science(all)
    • Metals and Alloys

    Cite this

    Caractérisation mécanique des joints de brasage Sn-3,5Ag à diverses températures. / Rhee, H.; Subramanian, K. N.; Lee, A.; Lee, J. G.

    In: Soldering and Surface Mount Technology, Vol. 15, No. 3, 2003, p. 4-5+21.

    Research output: Research - peer-reviewArticle

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    AU - Lee,J. G.

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    KW - Joining processes

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    KW - Soldering

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