Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

H. Rhee, K. N. Subramanian, A. Lee, J. G. Lee

Research output: Contribution to journalArticle

  • 20 Citations

Abstract

Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1 × 1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.

Translated title of the contributionMechanical characterization of Sn-3.5Ag solder joints at various temperatures
LanguageFrench
Pages4-5+21
JournalSoldering and Surface Mount Technology
Volume15
Issue number3
StatePublished - 2003

Profile

solders
Soldering alloys
shear strain
Shear strain
shear stress
Shear stress
eutectics
Temperature
Eutectics
temperature
analyzers
Creep
Fatigue of materials
mechanical properties
shear
Mechanical properties
Testing

Keywords

  • Deformation
  • Fatigue
  • Joining processes
  • Mechanical properties of materials
  • Soldering

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)
  • Metals and Alloys

Cite this

Caractérisation mécanique des joints de brasage Sn-3,5Ag à diverses températures. / Rhee, H.; Subramanian, K. N.; Lee, A.; Lee, J. G.

In: Soldering and Surface Mount Technology, Vol. 15, No. 3, 2003, p. 4-5+21.

Research output: Contribution to journalArticle

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AB - Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1 × 1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.

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