Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

H. Rhee, K. N. Subramanian, A. Lee, J. G. Lee

    Research output: Research - peer-reviewArticle

    • 19 Citations

    Abstract

    Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1×1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.

    LanguageEnglish (US)
    Pages21-26
    Number of pages6
    JournalSoldering and Surface Mount Technology
    Volume15
    Issue number3
    DOIs
    StatePublished - Dec 1 2003

    Profile

    Soldering alloys
    Temperature
    solders
    temperature
    Shear strain
    Shear stress
    shear strain
    shear stress
    Eutectics
    Creep
    Fatigue of materials
    Mechanical properties
    Testing
    eutectics
    analyzers
    mechanical properties
    shear

    Keywords

    • Deformation
    • Fatigue
    • Joining processes
    • Mechanical properties of materials
    • Soldering

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

    Cite this

    Mechanical characterization of Sn-3.5Ag solder joints at various temperatures. / Rhee, H.; Subramanian, K. N.; Lee, A.; Lee, J. G.

    In: Soldering and Surface Mount Technology, Vol. 15, No. 3, 01.12.2003, p. 21-26.

    Research output: Research - peer-reviewArticle

    Rhee, H. ; Subramanian, K. N. ; Lee, A. ; Lee, J. G./ Mechanical characterization of Sn-3.5Ag solder joints at various temperatures. In: Soldering and Surface Mount Technology. 2003 ; Vol. 15, No. 3. pp. 21-26
    @article{2365d18c312e41398145855fea5d6cd1,
    title = "Mechanical characterization of Sn-3.5Ag solder joints at various temperatures",
    abstract = "Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1×1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.",
    keywords = "Deformation, Fatigue, Joining processes, Mechanical properties of materials, Soldering",
    author = "H. Rhee and Subramanian, {K. N.} and A. Lee and Lee, {J. G.}",
    year = "2003",
    month = "12",
    doi = "10.1108/09540910310505080",
    volume = "15",
    pages = "21--26",
    journal = "Soldering and Surface Mount Technology",
    issn = "0954-0911",
    publisher = "Emerald Group Publishing Ltd.",
    number = "3",

    }

    TY - JOUR

    T1 - Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

    AU - Rhee,H.

    AU - Subramanian,K. N.

    AU - Lee,A.

    AU - Lee,J. G.

    PY - 2003/12/1

    Y1 - 2003/12/1

    N2 - Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1×1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.

    AB - Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1×1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.

    KW - Deformation

    KW - Fatigue

    KW - Joining processes

    KW - Mechanical properties of materials

    KW - Soldering

    UR - http://www.scopus.com/inward/record.url?scp=84986052291&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=84986052291&partnerID=8YFLogxK

    U2 - 10.1108/09540910310505080

    DO - 10.1108/09540910310505080

    M3 - Article

    VL - 15

    SP - 21

    EP - 26

    JO - Soldering and Surface Mount Technology

    T2 - Soldering and Surface Mount Technology

    JF - Soldering and Surface Mount Technology

    SN - 0954-0911

    IS - 3

    ER -