Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

H. Rhee, K. N. Subramanian, A. Lee, J. G. Lee

    Research output: Contribution to journalArticle

    • 19 Citations

    Abstract

    Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1×1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.

    Original languageEnglish (US)
    Pages (from-to)21-26
    Number of pages6
    JournalSoldering and Surface Mount Technology
    Volume15
    Issue number3
    DOIs
    StatePublished - Dec 1 2003

    Profile

    Employee Grievances
    Acetanilides
    Soldering alloys
    Temperature
    solders
    temperature
    Protamine Kinase
    Shear strain
    Shear stress
    shear strain
    shear stress
    Cardanolides
    Blood Stains
    Carbamyl Phosphate
    Butylene Glycols
    Endometrial Hyperplasia
    Abdominal Muscles
    British Columbia
    Creep
    Eutectics

    Keywords

    • Deformation
    • Fatigue
    • Joining processes
    • Mechanical properties of materials
    • Soldering

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

    Cite this

    Mechanical characterization of Sn-3.5Ag solder joints at various temperatures. / Rhee, H.; Subramanian, K. N.; Lee, A.; Lee, J. G.

    In: Soldering and Surface Mount Technology, Vol. 15, No. 3, 01.12.2003, p. 21-26.

    Research output: Contribution to journalArticle

    Rhee, H.; Subramanian, K. N.; Lee, A.; Lee, J. G. / Mechanical characterization of Sn-3.5Ag solder joints at various temperatures.

    In: Soldering and Surface Mount Technology, Vol. 15, No. 3, 01.12.2003, p. 21-26.

    Research output: Contribution to journalArticle

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    abstract = "Deformation studies on eutectic Sn-Ag solder (Sn-3.5Ag in wt percent) joints were carried out at a range of temperatures using a rheometric solids analyzer (RSA-III). Various performance parameters were evaluated with this equipment by subjecting geometrically realistic solder joints to shear loading at various temperatures (25, 75, 100, 125, and 150°C) with a nominal joint thickness of ∼100 μm and 1×1 mm solder joint area. Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear-strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue.",
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