Microstructure and sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications

Bite Zhou, Govindarajan Muralidharan, Kanth Kurumadalli, Chad M. Parish, Scott Leslie, Thomas R. Bieler

Research output: Contribution to journalArticle

  • 16 Citations

Abstract

Understanding the reliability of eutectic Sn-3.5Ag lead-free solders in high-temperature packaging applications is of significant interest in power electronics for the next-generation electric grid. Large-area (2.5 mm × 2.5 mm) Sn-3.5Ag solder joints between silicon dies and direct bonded copper substrates were thermally cycled between 5 C and 200 C. Sn crystal orientation and microstructure evolution during thermal cycling were characterized by electron backscatter diffraction in the scanning electron microscope. Comparisons were made between the observed initial texture and microstructure and its evolution during thermal cycling. Gradual lattice rotation and grain boundary misorientation evolution observed due to thermal cycling suggested a continuous recrystallization mechanism. Recrystallization behavior was correlated with dislocation slip activities.

LanguageEnglish (US)
Pages57-68
Number of pages12
JournalJournal of Electronic Materials
Volume43
Issue number1
DOIs
StatePublished - Jan 2014

Profile

Thermal cycling
solders
packaging
Crystal orientation
Packaging
microstructure
Microstructure
cycles
crystals
Crystal microstructure
Silicon
Power electronics
Electron diffraction
Crystal lattices
misalignment
eutectics
Soldering alloys
Temperature
Eutectics
Copper

Keywords

  • dislocation slip
  • High-temperature packaging
  • recrystallization
  • texture evolution
  • thermal cycling

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Microstructure and sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications. / Zhou, Bite; Muralidharan, Govindarajan; Kurumadalli, Kanth; Parish, Chad M.; Leslie, Scott; Bieler, Thomas R.

In: Journal of Electronic Materials, Vol. 43, No. 1, 01.2014, p. 57-68.

Research output: Contribution to journalArticle

Zhou, Bite ; Muralidharan, Govindarajan ; Kurumadalli, Kanth ; Parish, Chad M. ; Leslie, Scott ; Bieler, Thomas R./ Microstructure and sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications. In: Journal of Electronic Materials. 2014 ; Vol. 43, No. 1. pp. 57-68
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