Microstructure and sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications

Bite Zhou, Govindarajan Muralidharan, Kanth Kurumadalli, Chad M. Parish, Scott Leslie, Thomas R. Bieler

    Research output: Contribution to journalArticle

    • 12 Citations

    Abstract

    Understanding the reliability of eutectic Sn-3.5Ag lead-free solders in high-temperature packaging applications is of significant interest in power electronics for the next-generation electric grid. Large-area (2.5 mm × 2.5 mm) Sn-3.5Ag solder joints between silicon dies and direct bonded copper substrates were thermally cycled between 5 C and 200 C. Sn crystal orientation and microstructure evolution during thermal cycling were characterized by electron backscatter diffraction in the scanning electron microscope. Comparisons were made between the observed initial texture and microstructure and its evolution during thermal cycling. Gradual lattice rotation and grain boundary misorientation evolution observed due to thermal cycling suggested a continuous recrystallization mechanism. Recrystallization behavior was correlated with dislocation slip activities.

    Original languageEnglish (US)
    Pages (from-to)57-68
    Number of pages12
    JournalJournal of Electronic Materials
    Volume43
    Issue number1
    DOIs
    StatePublished - Jan 2014

    Profile

    Thermal cycling
    solders
    microstructure
    cycles
    Crystal orientation
    Packaging
    Microstructure
    Temperature
    Lead-free solders
    Acetanilides
    Thrombosis
    packaging
    crystals
    Crystal microstructure
    Power electronics
    Electron diffraction
    Crystal lattices
    Soldering alloys
    Eutectics
    Grain boundaries

    Keywords

    • dislocation slip
    • High-temperature packaging
    • recrystallization
    • texture evolution
    • thermal cycling

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Materials Chemistry

    Cite this

    Microstructure and sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications. / Zhou, Bite; Muralidharan, Govindarajan; Kurumadalli, Kanth; Parish, Chad M.; Leslie, Scott; Bieler, Thomas R.

    In: Journal of Electronic Materials, Vol. 43, No. 1, 01.2014, p. 57-68.

    Research output: Contribution to journalArticle

    Zhou, Bite; Muralidharan, Govindarajan; Kurumadalli, Kanth; Parish, Chad M.; Leslie, Scott; Bieler, Thomas R. / Microstructure and sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high-temperature packaging applications.

    In: Journal of Electronic Materials, Vol. 43, No. 1, 01.2014, p. 57-68.

    Research output: Contribution to journalArticle

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    AU - Parish,Chad M.

    AU - Leslie,Scott

    AU - Bieler,Thomas R.

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