Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal

S. Mukherjee, B. Zhou, A. Dasgupta, T. R. Bieler

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    This paper provides fundamental mechanistic insights into the significant piece-to-piece variability that many researchers have reported in the creep response of micron-scale high-Sn SAC solder joints in the as-fabricated state, due to coarse-grained microstructure and the anisotropy of Sn. A multiscale mechanistic creep modeling approach is proposed, by combining the individual contributions of the eutectic Sn-Ag phase and the pro-eutectic Sn dendritic phase. The anisotropic transient creep deformation in the eutectic Sn-Ag phase is termed Tier 1 and is modeled with dislocation mechanics. The creep rate of the pure Sn dendritic phase is similarly modeled with dislocation mechanics and combined with that of the eutectic phase, in Tier 2, using an anisotropic load-sharing scheme that utilizes Eshelby methods and Mori-Tanaka homogenization. The creep rate calculations are performed along the dominant slip systems of the Sn grain in a single crystal of SAC solder material, to obtain the transient creep response of a SAC305 single crystal along global loading directions. This model has been calibrated using experimentally obtained transient creep response of a SAC305 single crystal specimen of a particular orientation and then verified against a second SAC305 single crystal specimen of a different orientation. The effect of grain orientation () on the transient creep response of SAC305 single crystal is parametrically demonstrated by varying one of the Euler angles of the grain.

    Original languageEnglish (US)
    Title of host publication2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    ISBN (Electronic)9781479999507
    DOIs
    StatePublished - May 6 2015
    Event2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 - Budapest, Hungary

    Other

    Other2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
    CountryHungary
    CityBudapest
    Period4/19/154/22/15

    Profile

    Creep
    Eutectics
    Crystal orientation
    Soldering alloys
    Mechanics
    Dislocations (crystals)
    Anisotropy
    Microstructure

    ASJC Scopus subject areas

    • Computational Theory and Mathematics
    • Electrical and Electronic Engineering
    • Control and Systems Engineering
    • Industrial and Manufacturing Engineering

    Cite this

    Mukherjee, S., Zhou, B., Dasgupta, A., & Bieler, T. R. (2015). Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 [7103155] Institute of Electrical and Electronics Engineers Inc.. DOI: 10.1109/EuroSimE.2015.7103155

    Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal. / Mukherjee, S.; Zhou, B.; Dasgupta, A.; Bieler, T. R.

    2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7103155.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Mukherjee, S, Zhou, B, Dasgupta, A & Bieler, TR 2015, Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015., 7103155, Institute of Electrical and Electronics Engineers Inc., 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015, Budapest, Hungary, 19-22 April. DOI: 10.1109/EuroSimE.2015.7103155
    Mukherjee S, Zhou B, Dasgupta A, Bieler TR. Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc.2015. 7103155. Available from, DOI: 10.1109/EuroSimE.2015.7103155

    Mukherjee, S.; Zhou, B.; Dasgupta, A.; Bieler, T. R. / Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal.

    2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7103155.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    @inbook{52cb99d0534f4e96a030b5bd4749b404,
    title = "Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal",
    abstract = "This paper provides fundamental mechanistic insights into the significant piece-to-piece variability that many researchers have reported in the creep response of micron-scale high-Sn SAC solder joints in the as-fabricated state, due to coarse-grained microstructure and the anisotropy of Sn. A multiscale mechanistic creep modeling approach is proposed, by combining the individual contributions of the eutectic Sn-Ag phase and the pro-eutectic Sn dendritic phase. The anisotropic transient creep deformation in the eutectic Sn-Ag phase is termed Tier 1 and is modeled with dislocation mechanics. The creep rate of the pure Sn dendritic phase is similarly modeled with dislocation mechanics and combined with that of the eutectic phase, in Tier 2, using an anisotropic load-sharing scheme that utilizes Eshelby methods and Mori-Tanaka homogenization. The creep rate calculations are performed along the dominant slip systems of the Sn grain in a single crystal of SAC solder material, to obtain the transient creep response of a SAC305 single crystal along global loading directions. This model has been calibrated using experimentally obtained transient creep response of a SAC305 single crystal specimen of a particular orientation and then verified against a second SAC305 single crystal specimen of a different orientation. The effect of grain orientation () on the transient creep response of SAC305 single crystal is parametrically demonstrated by varying one of the Euler angles of the grain.",
    author = "S. Mukherjee and B. Zhou and A. Dasgupta and Bieler, {T. R.}",
    year = "2015",
    month = "5",
    doi = "10.1109/EuroSimE.2015.7103155",
    booktitle = "2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015",
    publisher = "Institute of Electrical and Electronics Engineers Inc.",

    }

    TY - CHAP

    T1 - Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal

    AU - Mukherjee,S.

    AU - Zhou,B.

    AU - Dasgupta,A.

    AU - Bieler,T. R.

    PY - 2015/5/6

    Y1 - 2015/5/6

    N2 - This paper provides fundamental mechanistic insights into the significant piece-to-piece variability that many researchers have reported in the creep response of micron-scale high-Sn SAC solder joints in the as-fabricated state, due to coarse-grained microstructure and the anisotropy of Sn. A multiscale mechanistic creep modeling approach is proposed, by combining the individual contributions of the eutectic Sn-Ag phase and the pro-eutectic Sn dendritic phase. The anisotropic transient creep deformation in the eutectic Sn-Ag phase is termed Tier 1 and is modeled with dislocation mechanics. The creep rate of the pure Sn dendritic phase is similarly modeled with dislocation mechanics and combined with that of the eutectic phase, in Tier 2, using an anisotropic load-sharing scheme that utilizes Eshelby methods and Mori-Tanaka homogenization. The creep rate calculations are performed along the dominant slip systems of the Sn grain in a single crystal of SAC solder material, to obtain the transient creep response of a SAC305 single crystal along global loading directions. This model has been calibrated using experimentally obtained transient creep response of a SAC305 single crystal specimen of a particular orientation and then verified against a second SAC305 single crystal specimen of a different orientation. The effect of grain orientation () on the transient creep response of SAC305 single crystal is parametrically demonstrated by varying one of the Euler angles of the grain.

    AB - This paper provides fundamental mechanistic insights into the significant piece-to-piece variability that many researchers have reported in the creep response of micron-scale high-Sn SAC solder joints in the as-fabricated state, due to coarse-grained microstructure and the anisotropy of Sn. A multiscale mechanistic creep modeling approach is proposed, by combining the individual contributions of the eutectic Sn-Ag phase and the pro-eutectic Sn dendritic phase. The anisotropic transient creep deformation in the eutectic Sn-Ag phase is termed Tier 1 and is modeled with dislocation mechanics. The creep rate of the pure Sn dendritic phase is similarly modeled with dislocation mechanics and combined with that of the eutectic phase, in Tier 2, using an anisotropic load-sharing scheme that utilizes Eshelby methods and Mori-Tanaka homogenization. The creep rate calculations are performed along the dominant slip systems of the Sn grain in a single crystal of SAC solder material, to obtain the transient creep response of a SAC305 single crystal along global loading directions. This model has been calibrated using experimentally obtained transient creep response of a SAC305 single crystal specimen of a particular orientation and then verified against a second SAC305 single crystal specimen of a different orientation. The effect of grain orientation () on the transient creep response of SAC305 single crystal is parametrically demonstrated by varying one of the Euler angles of the grain.

    UR - http://www.scopus.com/inward/record.url?scp=84944769216&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=84944769216&partnerID=8YFLogxK

    U2 - 10.1109/EuroSimE.2015.7103155

    DO - 10.1109/EuroSimE.2015.7103155

    M3 - Conference contribution

    BT - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015

    PB - Institute of Electrical and Electronics Engineers Inc.

    ER -