Multiscale modeling of the effect of micro-alloying Mn and Sb on the viscoplastic response of SAC105 solder

Subhasis Mukherjee, Abhijit Dasgupta, Bite Zhou, Thomas R. Bieler

    Research output: Research - peer-reviewArticle

    • 5 Citations

    Abstract

    This study investigates the time-dependent viscoplastic response of two relatively new SAC105-X solders - SAC105-05Mn (Sn1.0Ag 0.5Cu (SAC105) doped with 0.05 wt.% Mn), and SAC105-55Sb (SAC105 doped with 0.55 wt.% Sb). The results showed that the addition of Mn or Sb increases the creep resistance of SAC105 solder by one to two orders of magnitude at the tested stress levels of 2-20 MPa. The addition of Mn as a fourth alloying element promotes homogeneous distribution of micron-scale Cu6Sn5 intermetallic compounds (IMCs), thereby reducing their interparticle spacing as compared to that of SAC105. On the other hand, addition of Sb does not change the spacing of the Cu6Sn5 particle, but promotes the formation of uniformly sized Sn dendritic lobes, homogeneously distributed in the whole solder joint. Moreover, Sb also forms a solid solution with Sn and strengthens the Sn matrix in SAC105-55Sb itself. The effects of these microstructural changes (obtained using image processing) on the secondary creep constitutive response of SAC105 solder interconnects were then modeled using a mechanistic multiscale creep model. The mechanistic model was able to accurately capture the trends in the secondary creep constitutive response of the alloys and to explain the improvement in creep resistance of SAC105 due to the addition of Mn and Sb.

    LanguageEnglish (US)
    Pages1119-1130
    Number of pages12
    JournalJournal of Electronic Materials
    Volume43
    Issue number4
    DOIs
    StatePublished - 2014

    Profile

    solders
    alloying
    Alloying
    Soldering alloys
    Creep
    creep strength
    spacing
    Creep resistance
    lobes
    intermetallics
    image processing
    solid solutions
    trends
    matrices
    Alloying elements
    Intermetallics
    Solid solutions
    Image processing

    Keywords

    • Creep
    • dislocation
    • grain
    • homogenization
    • lead-free solder
    • micro-alloying
    • multiscale
    • OIM
    • Rosler
    • synchrotron

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Materials Chemistry

    Cite this

    Multiscale modeling of the effect of micro-alloying Mn and Sb on the viscoplastic response of SAC105 solder. / Mukherjee, Subhasis; Dasgupta, Abhijit; Zhou, Bite; Bieler, Thomas R.

    In: Journal of Electronic Materials, Vol. 43, No. 4, 2014, p. 1119-1130.

    Research output: Research - peer-reviewArticle

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    abstract = "This study investigates the time-dependent viscoplastic response of two relatively new SAC105-X solders - SAC105-05Mn (Sn1.0Ag 0.5Cu (SAC105) doped with 0.05 wt.% Mn), and SAC105-55Sb (SAC105 doped with 0.55 wt.% Sb). The results showed that the addition of Mn or Sb increases the creep resistance of SAC105 solder by one to two orders of magnitude at the tested stress levels of 2-20 MPa. The addition of Mn as a fourth alloying element promotes homogeneous distribution of micron-scale Cu6Sn5 intermetallic compounds (IMCs), thereby reducing their interparticle spacing as compared to that of SAC105. On the other hand, addition of Sb does not change the spacing of the Cu6Sn5 particle, but promotes the formation of uniformly sized Sn dendritic lobes, homogeneously distributed in the whole solder joint. Moreover, Sb also forms a solid solution with Sn and strengthens the Sn matrix in SAC105-55Sb itself. The effects of these microstructural changes (obtained using image processing) on the secondary creep constitutive response of SAC105 solder interconnects were then modeled using a mechanistic multiscale creep model. The mechanistic model was able to accurately capture the trends in the secondary creep constitutive response of the alloys and to explain the improvement in creep resistance of SAC105 due to the addition of Mn and Sb.",
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    AU - Bieler,Thomas R.

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    N2 - This study investigates the time-dependent viscoplastic response of two relatively new SAC105-X solders - SAC105-05Mn (Sn1.0Ag 0.5Cu (SAC105) doped with 0.05 wt.% Mn), and SAC105-55Sb (SAC105 doped with 0.55 wt.% Sb). The results showed that the addition of Mn or Sb increases the creep resistance of SAC105 solder by one to two orders of magnitude at the tested stress levels of 2-20 MPa. The addition of Mn as a fourth alloying element promotes homogeneous distribution of micron-scale Cu6Sn5 intermetallic compounds (IMCs), thereby reducing their interparticle spacing as compared to that of SAC105. On the other hand, addition of Sb does not change the spacing of the Cu6Sn5 particle, but promotes the formation of uniformly sized Sn dendritic lobes, homogeneously distributed in the whole solder joint. Moreover, Sb also forms a solid solution with Sn and strengthens the Sn matrix in SAC105-55Sb itself. The effects of these microstructural changes (obtained using image processing) on the secondary creep constitutive response of SAC105 solder interconnects were then modeled using a mechanistic multiscale creep model. The mechanistic model was able to accurately capture the trends in the secondary creep constitutive response of the alloys and to explain the improvement in creep resistance of SAC105 due to the addition of Mn and Sb.

    AB - This study investigates the time-dependent viscoplastic response of two relatively new SAC105-X solders - SAC105-05Mn (Sn1.0Ag 0.5Cu (SAC105) doped with 0.05 wt.% Mn), and SAC105-55Sb (SAC105 doped with 0.55 wt.% Sb). The results showed that the addition of Mn or Sb increases the creep resistance of SAC105 solder by one to two orders of magnitude at the tested stress levels of 2-20 MPa. The addition of Mn as a fourth alloying element promotes homogeneous distribution of micron-scale Cu6Sn5 intermetallic compounds (IMCs), thereby reducing their interparticle spacing as compared to that of SAC105. On the other hand, addition of Sb does not change the spacing of the Cu6Sn5 particle, but promotes the formation of uniformly sized Sn dendritic lobes, homogeneously distributed in the whole solder joint. Moreover, Sb also forms a solid solution with Sn and strengthens the Sn matrix in SAC105-55Sb itself. The effects of these microstructural changes (obtained using image processing) on the secondary creep constitutive response of SAC105 solder interconnects were then modeled using a mechanistic multiscale creep model. The mechanistic model was able to accurately capture the trends in the secondary creep constitutive response of the alloys and to explain the improvement in creep resistance of SAC105 due to the addition of Mn and Sb.

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