Multiscale modeling of the effect of micro-alloying Mn and Sb on the viscoplastic response of SAC105 solder

Subhasis Mukherjee, Abhijit Dasgupta, Bite Zhou, Thomas R. Bieler

Research output: Contribution to journalArticle

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Abstract

This study investigates the time-dependent viscoplastic response of two relatively new SAC105-X solders - SAC105-05Mn (Sn1.0Ag 0.5Cu (SAC105) doped with 0.05 wt.% Mn), and SAC105-55Sb (SAC105 doped with 0.55 wt.% Sb). The results showed that the addition of Mn or Sb increases the creep resistance of SAC105 solder by one to two orders of magnitude at the tested stress levels of 2-20 MPa. The addition of Mn as a fourth alloying element promotes homogeneous distribution of micron-scale Cu6Sn5 intermetallic compounds (IMCs), thereby reducing their interparticle spacing as compared to that of SAC105. On the other hand, addition of Sb does not change the spacing of the Cu6Sn5 particle, but promotes the formation of uniformly sized Sn dendritic lobes, homogeneously distributed in the whole solder joint. Moreover, Sb also forms a solid solution with Sn and strengthens the Sn matrix in SAC105-55Sb itself. The effects of these microstructural changes (obtained using image processing) on the secondary creep constitutive response of SAC105 solder interconnects were then modeled using a mechanistic multiscale creep model. The mechanistic model was able to accurately capture the trends in the secondary creep constitutive response of the alloys and to explain the improvement in creep resistance of SAC105 due to the addition of Mn and Sb.

LanguageEnglish (US)
Pages1119-1130
Number of pages12
JournalJournal of Electronic Materials
Volume43
Issue number4
DOIs
StatePublished - 2014

Profile

solders
Alloying
Soldering alloys
alloying
creep strength
Creep
Creep resistance
spacing
Alloying elements
lobes
Intermetallics
intermetallics
image processing
Solid solutions
Image processing
solid solutions
trends
matrices

Keywords

  • Creep
  • dislocation
  • grain
  • homogenization
  • lead-free solder
  • micro-alloying
  • multiscale
  • OIM
  • Rosler
  • synchrotron

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Multiscale modeling of the effect of micro-alloying Mn and Sb on the viscoplastic response of SAC105 solder. / Mukherjee, Subhasis; Dasgupta, Abhijit; Zhou, Bite; Bieler, Thomas R.

In: Journal of Electronic Materials, Vol. 43, No. 4, 2014, p. 1119-1130.

Research output: Contribution to journalArticle

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abstract = "This study investigates the time-dependent viscoplastic response of two relatively new SAC105-X solders - SAC105-05Mn (Sn1.0Ag 0.5Cu (SAC105) doped with 0.05 wt.{\%} Mn), and SAC105-55Sb (SAC105 doped with 0.55 wt.{\%} Sb). The results showed that the addition of Mn or Sb increases the creep resistance of SAC105 solder by one to two orders of magnitude at the tested stress levels of 2-20 MPa. The addition of Mn as a fourth alloying element promotes homogeneous distribution of micron-scale Cu6Sn5 intermetallic compounds (IMCs), thereby reducing their interparticle spacing as compared to that of SAC105. On the other hand, addition of Sb does not change the spacing of the Cu6Sn5 particle, but promotes the formation of uniformly sized Sn dendritic lobes, homogeneously distributed in the whole solder joint. Moreover, Sb also forms a solid solution with Sn and strengthens the Sn matrix in SAC105-55Sb itself. The effects of these microstructural changes (obtained using image processing) on the secondary creep constitutive response of SAC105 solder interconnects were then modeled using a mechanistic multiscale creep model. The mechanistic model was able to accurately capture the trends in the secondary creep constitutive response of the alloys and to explain the improvement in creep resistance of SAC105 due to the addition of Mn and Sb.",
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AB - This study investigates the time-dependent viscoplastic response of two relatively new SAC105-X solders - SAC105-05Mn (Sn1.0Ag 0.5Cu (SAC105) doped with 0.05 wt.% Mn), and SAC105-55Sb (SAC105 doped with 0.55 wt.% Sb). The results showed that the addition of Mn or Sb increases the creep resistance of SAC105 solder by one to two orders of magnitude at the tested stress levels of 2-20 MPa. The addition of Mn as a fourth alloying element promotes homogeneous distribution of micron-scale Cu6Sn5 intermetallic compounds (IMCs), thereby reducing their interparticle spacing as compared to that of SAC105. On the other hand, addition of Sb does not change the spacing of the Cu6Sn5 particle, but promotes the formation of uniformly sized Sn dendritic lobes, homogeneously distributed in the whole solder joint. Moreover, Sb also forms a solid solution with Sn and strengthens the Sn matrix in SAC105-55Sb itself. The effects of these microstructural changes (obtained using image processing) on the secondary creep constitutive response of SAC105 solder interconnects were then modeled using a mechanistic multiscale creep model. The mechanistic model was able to accurately capture the trends in the secondary creep constitutive response of the alloys and to explain the improvement in creep resistance of SAC105 due to the addition of Mn and Sb.

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