Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints

H. Rhee, K. N. Subramanian, A. Lee

    Research output: Contribution to journalArticle

    • 9 Citations

    Abstract

    Solder joints experience repeated reverse straining during thermal excursions encountered in service, as a consequence of stresses that arise due to coefficient of thermal expansion (CTE) mismatches between entities present in the joint. They also undergo stress relaxation under fixed strain during dwell times at temperature extremes encountered during service. In order to understand the fundamental processes involved under such conditions, cyclic shear straining with associated stress relaxation at the shear strain extremes were imposed during stress relaxation of pre-strained solder joints at various temperatures. Results of such studies were compared with previously reported findings from monotonic shear stressing and stress relaxation tests. Residual stress during stress relaxation under repeated reverse straining exhibited significant decrease for specimens deformed to a higher pre-strain at a higher pre-strain rate, at lower temperature. Stress relaxation during subsequent cycles of straining was found to be strongly dependant on the test temperature and the imposed pre-strain amplitude and pre-strain rate.

    Original languageEnglish (US)
    Pages (from-to)169-176
    Number of pages8
    JournalJournal of Materials Science: Materials in Electronics
    Volume16
    Issue number3
    DOIs
    StatePublished - Mar 2005

    Profile

    Stress relaxation
    stress relaxation
    Temperature
    Acetanilides
    Hot Temperature
    Carbamoyl-Phosphate Synthase (Glutamine-Hydrolyzing)
    Employee Grievances
    solders
    temperature
    Soldering alloys
    Levodopa
    strain rate
    shear
    Strain rate
    Exercise Test
    Cardanolides
    Epimestrol
    Dextrocardia
    Addison Disease
    Shear strain

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Materials Science(all)
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics

    Cite this

    Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints. / Rhee, H.; Subramanian, K. N.; Lee, A.

    In: Journal of Materials Science: Materials in Electronics, Vol. 16, No. 3, 03.2005, p. 169-176.

    Research output: Contribution to journalArticle

    Rhee, H.; Subramanian, K. N.; Lee, A. / Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints.

    In: Journal of Materials Science: Materials in Electronics, Vol. 16, No. 3, 03.2005, p. 169-176.

    Research output: Contribution to journalArticle

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    abstract = "Solder joints experience repeated reverse straining during thermal excursions encountered in service, as a consequence of stresses that arise due to coefficient of thermal expansion (CTE) mismatches between entities present in the joint. They also undergo stress relaxation under fixed strain during dwell times at temperature extremes encountered during service. In order to understand the fundamental processes involved under such conditions, cyclic shear straining with associated stress relaxation at the shear strain extremes were imposed during stress relaxation of pre-strained solder joints at various temperatures. Results of such studies were compared with previously reported findings from monotonic shear stressing and stress relaxation tests. Residual stress during stress relaxation under repeated reverse straining exhibited significant decrease for specimens deformed to a higher pre-strain at a higher pre-strain rate, at lower temperature. Stress relaxation during subsequent cycles of straining was found to be strongly dependant on the test temperature and the imposed pre-strain amplitude and pre-strain rate.",
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