Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints

H. Rhee, K. N. Subramanian, A. Lee

Research output: Contribution to journalArticle

  • 9 Citations

Abstract

Solder joints experience repeated reverse straining during thermal excursions encountered in service, as a consequence of stresses that arise due to coefficient of thermal expansion (CTE) mismatches between entities present in the joint. They also undergo stress relaxation under fixed strain during dwell times at temperature extremes encountered during service. In order to understand the fundamental processes involved under such conditions, cyclic shear straining with associated stress relaxation at the shear strain extremes were imposed during stress relaxation of pre-strained solder joints at various temperatures. Results of such studies were compared with previously reported findings from monotonic shear stressing and stress relaxation tests. Residual stress during stress relaxation under repeated reverse straining exhibited significant decrease for specimens deformed to a higher pre-strain at a higher pre-strain rate, at lower temperature. Stress relaxation during subsequent cycles of straining was found to be strongly dependant on the test temperature and the imposed pre-strain amplitude and pre-strain rate.

LanguageEnglish (US)
Pages169-176
Number of pages8
JournalJournal of Materials Science: Materials in Electronics
Volume16
Issue number3
DOIs
StatePublished - Mar 2005

Profile

stress relaxation
Stress relaxation
solders
eutectics
Soldering alloys
Eutectics
Joints
Temperature
Hot Temperature
strain rate
Strain rate
Exercise Test
shear
dwell
shear strain
Shear strain
residual stress
Thermal expansion
temperature
thermal expansion

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints. / Rhee, H.; Subramanian, K. N.; Lee, A.

In: Journal of Materials Science: Materials in Electronics, Vol. 16, No. 3, 03.2005, p. 169-176.

Research output: Contribution to journalArticle

@article{70fda9d4387b4e8c9ec46fc03f31d022,
title = "Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints",
abstract = "Solder joints experience repeated reverse straining during thermal excursions encountered in service, as a consequence of stresses that arise due to coefficient of thermal expansion (CTE) mismatches between entities present in the joint. They also undergo stress relaxation under fixed strain during dwell times at temperature extremes encountered during service. In order to understand the fundamental processes involved under such conditions, cyclic shear straining with associated stress relaxation at the shear strain extremes were imposed during stress relaxation of pre-strained solder joints at various temperatures. Results of such studies were compared with previously reported findings from monotonic shear stressing and stress relaxation tests. Residual stress during stress relaxation under repeated reverse straining exhibited significant decrease for specimens deformed to a higher pre-strain at a higher pre-strain rate, at lower temperature. Stress relaxation during subsequent cycles of straining was found to be strongly dependant on the test temperature and the imposed pre-strain amplitude and pre-strain rate.",
author = "H. Rhee and Subramanian, {K. N.} and A. Lee",
year = "2005",
month = "3",
doi = "10.1007/s10854-005-6597-2",
language = "English (US)",
volume = "16",
pages = "169--176",
journal = "Journal of Materials Science: Materials in Electronics",
issn = "0957-4522",
publisher = "Springer New York",
number = "3",

}

TY - JOUR

T1 - Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints

AU - Rhee,H.

AU - Subramanian,K. N.

AU - Lee,A.

PY - 2005/3

Y1 - 2005/3

N2 - Solder joints experience repeated reverse straining during thermal excursions encountered in service, as a consequence of stresses that arise due to coefficient of thermal expansion (CTE) mismatches between entities present in the joint. They also undergo stress relaxation under fixed strain during dwell times at temperature extremes encountered during service. In order to understand the fundamental processes involved under such conditions, cyclic shear straining with associated stress relaxation at the shear strain extremes were imposed during stress relaxation of pre-strained solder joints at various temperatures. Results of such studies were compared with previously reported findings from monotonic shear stressing and stress relaxation tests. Residual stress during stress relaxation under repeated reverse straining exhibited significant decrease for specimens deformed to a higher pre-strain at a higher pre-strain rate, at lower temperature. Stress relaxation during subsequent cycles of straining was found to be strongly dependant on the test temperature and the imposed pre-strain amplitude and pre-strain rate.

AB - Solder joints experience repeated reverse straining during thermal excursions encountered in service, as a consequence of stresses that arise due to coefficient of thermal expansion (CTE) mismatches between entities present in the joint. They also undergo stress relaxation under fixed strain during dwell times at temperature extremes encountered during service. In order to understand the fundamental processes involved under such conditions, cyclic shear straining with associated stress relaxation at the shear strain extremes were imposed during stress relaxation of pre-strained solder joints at various temperatures. Results of such studies were compared with previously reported findings from monotonic shear stressing and stress relaxation tests. Residual stress during stress relaxation under repeated reverse straining exhibited significant decrease for specimens deformed to a higher pre-strain at a higher pre-strain rate, at lower temperature. Stress relaxation during subsequent cycles of straining was found to be strongly dependant on the test temperature and the imposed pre-strain amplitude and pre-strain rate.

UR - http://www.scopus.com/inward/record.url?scp=15344339799&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=15344339799&partnerID=8YFLogxK

U2 - 10.1007/s10854-005-6597-2

DO - 10.1007/s10854-005-6597-2

M3 - Article

VL - 16

SP - 169

EP - 176

JO - Journal of Materials Science: Materials in Electronics

T2 - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

SN - 0957-4522

IS - 3

ER -