Study of Joule heating effects in lead-free solder joints under Electromigration

Guangchen Xu, Fu Guo, Andre Lee, K. N. Subramanian, Neil Wright

    Research output: ResearchConference contribution

    Abstract

    Basic understanding of heating conduction in lead-free solder joints due to the Joule heating effect was carried out by using the infrared (IR) microscopy. In order to interpret the corresponding mechanism and provide a better understanding to Electromigration (EM) studies, a newly developed ID solder joint with same cross-sectional area in solder alloy and Cu electrodes was employed in our thermal imaging analysis. Both eutectic SnBi and SnAgCu solder alloy were used to fabricate the joints due to their distinct electrical resistivity and thermal conductivity. Various electrical current inputs combined with joints' thickness of 500 μm were investigated. Accordingly, transient and steady-state heat conduction were identified and compared with different experimental conditions.

    LanguageEnglish (US)
    Title of host publicationICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
    Pages464-467
    Number of pages4
    DOIs
    StatePublished - 2011
    Event2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China
    Duration: Aug 8 2011Aug 11 2011

    Other

    Other2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
    CountryChina
    CityShanghai
    Period8/8/118/11/11

    Profile

    Joule heating
    Electromigration
    Soldering alloys
    Lead-free solders
    Infrared imaging
    Heat conduction
    Eutectics
    Thermal conductivity
    Microscopic examination
    Infrared radiation
    Heating
    Electrodes

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Xu, G., Guo, F., Lee, A., Subramanian, K. N., & Wright, N. (2011). Study of Joule heating effects in lead-free solder joints under Electromigration. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 464-467). [6066877] DOI: 10.1109/ICEPT.2011.6066877

    Study of Joule heating effects in lead-free solder joints under Electromigration. / Xu, Guangchen; Guo, Fu; Lee, Andre; Subramanian, K. N.; Wright, Neil.

    ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 464-467 6066877.

    Research output: ResearchConference contribution

    Xu, G, Guo, F, Lee, A, Subramanian, KN & Wright, N 2011, Study of Joule heating effects in lead-free solder joints under Electromigration. in ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066877, pp. 464-467, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China, 8/8/11. DOI: 10.1109/ICEPT.2011.6066877
    Xu G, Guo F, Lee A, Subramanian KN, Wright N. Study of Joule heating effects in lead-free solder joints under Electromigration. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 464-467. 6066877. Available from, DOI: 10.1109/ICEPT.2011.6066877
    Xu, Guangchen ; Guo, Fu ; Lee, Andre ; Subramanian, K. N. ; Wright, Neil. / Study of Joule heating effects in lead-free solder joints under Electromigration. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. pp. 464-467
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