Study of Joule heating effects in lead-free solder joints under Electromigration

Guangchen Xu, Fu Guo, Andre Lee, K. N. Subramanian, Neil Wright

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Basic understanding of heating conduction in lead-free solder joints due to the Joule heating effect was carried out by using the infrared (IR) microscopy. In order to interpret the corresponding mechanism and provide a better understanding to Electromigration (EM) studies, a newly developed ID solder joint with same cross-sectional area in solder alloy and Cu electrodes was employed in our thermal imaging analysis. Both eutectic SnBi and SnAgCu solder alloy were used to fabricate the joints due to their distinct electrical resistivity and thermal conductivity. Various electrical current inputs combined with joints' thickness of 500 μm were investigated. Accordingly, transient and steady-state heat conduction were identified and compared with different experimental conditions.

LanguageEnglish (US)
Title of host publicationICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
Pages464-467
Number of pages4
DOIs
StatePublished - 2011
Event2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China
Duration: Aug 8 2011Aug 11 2011

Other

Other2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
CountryChina
CityShanghai
Period8/8/118/11/11

Profile

Joule heating
Electromigration
Soldering alloys
Infrared imaging
Heat conduction
Eutectics
Thermal conductivity
Microscopic examination
Infrared radiation
Heating
Electrodes
Lead-free solders

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Xu, G., Guo, F., Lee, A., Subramanian, K. N., & Wright, N. (2011). Study of Joule heating effects in lead-free solder joints under Electromigration. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 464-467). [6066877] DOI: 10.1109/ICEPT.2011.6066877

Study of Joule heating effects in lead-free solder joints under Electromigration. / Xu, Guangchen; Guo, Fu; Lee, Andre; Subramanian, K. N.; Wright, Neil.

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 464-467 6066877.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Xu, G, Guo, F, Lee, A, Subramanian, KN & Wright, N 2011, Study of Joule heating effects in lead-free solder joints under Electromigration. in ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066877, pp. 464-467, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China, 8/8/11. DOI: 10.1109/ICEPT.2011.6066877
Xu G, Guo F, Lee A, Subramanian KN, Wright N. Study of Joule heating effects in lead-free solder joints under Electromigration. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 464-467. 6066877. Available from, DOI: 10.1109/ICEPT.2011.6066877
Xu, Guangchen ; Guo, Fu ; Lee, Andre ; Subramanian, K. N. ; Wright, Neil. / Study of Joule heating effects in lead-free solder joints under Electromigration. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. pp. 464-467
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