The evolution of grain-boundary cracking evaluated through in situ tensile-creep testing of Udimet alloy 188

C. J. Boehlert, S. C. Longanbach, M. Nowell, S. Wright

Research output: Contribution to journalArticle

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Abstract

In situ scanning electron microscopy was performed during elevated-temperature (≤76O °C) tensile-creep deformation of a face-centered-cubic cobalt-based Udimet 188 alloy to characterize the deformation evolution and, in particular, the grain boundary-cracking evolution. In situ electron backscatter diffraction observations combined with in situ secondary electron imaging indicated that general high-angle grain boundaries were more susceptible to cracking than low-angle grain boundaries and coincident site-lattice boundaries. The extent of general high-angle grain-boundary cracking increased with increasing creep time. Grain-boundary cracking was also observed throughout subsurface locations as observed for postdeformed samples. The electron backscattered diffraction orientation mapping performed during in situ tensile-creep deformation proved to be a powerful means for characterizing the surface deformation evolution and in particular for quantifying the types of grain boundaries that preferentially cracked.

LanguageEnglish (US)
Pages500-506
Number of pages7
JournalJournal of Materials Research
Volume23
Issue number2
DOIs
StatePublished - Feb 2008

Profile

Udimet alloys
tensile creep
Creep testing
Tensile testing
Grain boundaries
grain boundaries
Creep
Electron diffraction
Cobalt
Crystal lattices
electrons
cobalt
electron diffraction
Imaging techniques
Scanning electron microscopy
scanning electron microscopy

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

The evolution of grain-boundary cracking evaluated through in situ tensile-creep testing of Udimet alloy 188. / Boehlert, C. J.; Longanbach, S. C.; Nowell, M.; Wright, S.

In: Journal of Materials Research, Vol. 23, No. 2, 02.2008, p. 500-506.

Research output: Contribution to journalArticle

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