The evolution of grain-boundary cracking evaluated through in situ tensile-creep testing of Udimet alloy 188

C. J. Boehlert, S. C. Longanbach, M. Nowell, S. Wright

    Research output: Contribution to journalArticle

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    Abstract

    In situ scanning electron microscopy was performed during elevated-temperature (≤76O °C) tensile-creep deformation of a face-centered-cubic cobalt-based Udimet 188 alloy to characterize the deformation evolution and, in particular, the grain boundary-cracking evolution. In situ electron backscatter diffraction observations combined with in situ secondary electron imaging indicated that general high-angle grain boundaries were more susceptible to cracking than low-angle grain boundaries and coincident site-lattice boundaries. The extent of general high-angle grain-boundary cracking increased with increasing creep time. Grain-boundary cracking was also observed throughout subsurface locations as observed for postdeformed samples. The electron backscattered diffraction orientation mapping performed during in situ tensile-creep deformation proved to be a powerful means for characterizing the surface deformation evolution and in particular for quantifying the types of grain boundaries that preferentially cracked.

    Original languageEnglish (US)
    Pages (from-to)500-506
    Number of pages7
    JournalJournal of Materials Research
    Volume23
    Issue number2
    DOIs
    StatePublished - Feb 2008

    Profile

    Grain boundaries
    grain boundaries
    Carbamyl Phosphate
    Creep
    tensile creep
    Electron diffraction
    electrons
    Edema Disease of Swine
    Acetanilides
    Adenofibroma
    Erythrocebus patas
    Hereditary Corneal Dystrophies
    Creep testing
    Dinitrophenols
    Scanning electron microscopy
    Electrons
    Tensile testing
    Crystal lattices
    Cobalt
    Imaging techniques

    ASJC Scopus subject areas

    • Materials Science(all)

    Cite this

    The evolution of grain-boundary cracking evaluated through in situ tensile-creep testing of Udimet alloy 188. / Boehlert, C. J.; Longanbach, S. C.; Nowell, M.; Wright, S.

    In: Journal of Materials Research, Vol. 23, No. 2, 02.2008, p. 500-506.

    Research output: Contribution to journalArticle

    Boehlert, C. J.; Longanbach, S. C.; Nowell, M.; Wright, S. / The evolution of grain-boundary cracking evaluated through in situ tensile-creep testing of Udimet alloy 188.

    In: Journal of Materials Research, Vol. 23, No. 2, 02.2008, p. 500-506.

    Research output: Contribution to journalArticle

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    abstract = "In situ scanning electron microscopy was performed during elevated-temperature (≤76O °C) tensile-creep deformation of a face-centered-cubic cobalt-based Udimet 188 alloy to characterize the deformation evolution and, in particular, the grain boundary-cracking evolution. In situ electron backscatter diffraction observations combined with in situ secondary electron imaging indicated that general high-angle grain boundaries were more susceptible to cracking than low-angle grain boundaries and coincident site-lattice boundaries. The extent of general high-angle grain-boundary cracking increased with increasing creep time. Grain-boundary cracking was also observed throughout subsurface locations as observed for postdeformed samples. The electron backscattered diffraction orientation mapping performed during in situ tensile-creep deformation proved to be a powerful means for characterizing the surface deformation evolution and in particular for quantifying the types of grain boundaries that preferentially cracked.",
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