The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance

Tae Kyu Lee, Bite Zhou, Thomas R. Bieler, Chien Fu Tseng, Jeng Gong Duh

Research output: Contribution to journalArticle

  • 11 Citations

Abstract

The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high-G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.

LanguageEnglish (US)
Pages215-223
Number of pages9
JournalJournal of Electronic Materials
Volume42
Issue number2
DOIs
StatePublished - 2013

Profile

mechanical shock
solders
Soldering alloys
shock
Masks
Mechanical stability
Grain refinement
masks
shock tests
Printed circuit boards
Failure modes
test vehicles
Crack propagation
Aging of materials
failure modes
crack propagation

Keywords

  • interconnect
  • microalloying
  • Pb-free solder
  • Pd, Sn orientation
  • shock test

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance. / Lee, Tae Kyu; Zhou, Bite; Bieler, Thomas R.; Tseng, Chien Fu; Duh, Jeng Gong.

In: Journal of Electronic Materials, Vol. 42, No. 2, 2013, p. 215-223.

Research output: Contribution to journalArticle

Lee, Tae Kyu ; Zhou, Bite ; Bieler, Thomas R. ; Tseng, Chien Fu ; Duh, Jeng Gong. / The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance. In: Journal of Electronic Materials. 2013 ; Vol. 42, No. 2. pp. 215-223
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