The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance

Tae Kyu Lee, Bite Zhou, Thomas R. Bieler, Chien Fu Tseng, Jeng Gong Duh

    Research output: Contribution to journalArticle

    • 11 Citations

    Abstract

    The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high-G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.

    Original languageEnglish (US)
    Pages (from-to)215-223
    Number of pages9
    JournalJournal of Electronic Materials
    Volume42
    Issue number2
    DOIs
    StatePublished - 2013

    Profile

    Employee Grievances
    shock
    Soldering alloys
    solders
    Bibliography of Medicine
    Alcoholic Cardiomyopathy
    Carbamyl Phosphate
    Masks
    masks
    Carbamoyl-Phosphate Synthase (Glutamine-Hydrolyzing)
    Pharmacological Phenomena
    Erythrina
    Histamine H2 Antagonists
    Mechanical stability
    Analgesia
    Crack propagation
    Oxidoreductases Acting on CH-NH Group Donors
    Grain refinement
    Printed circuit boards
    Failure modes

    Keywords

    • interconnect
    • microalloying
    • Pb-free solder
    • Pd, Sn orientation
    • shock test

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Materials Chemistry

    Cite this

    The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance. / Lee, Tae Kyu; Zhou, Bite; Bieler, Thomas R.; Tseng, Chien Fu; Duh, Jeng Gong.

    In: Journal of Electronic Materials, Vol. 42, No. 2, 2013, p. 215-223.

    Research output: Contribution to journalArticle

    Lee, Tae Kyu; Zhou, Bite; Bieler, Thomas R.; Tseng, Chien Fu; Duh, Jeng Gong / The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance.

    In: Journal of Electronic Materials, Vol. 42, No. 2, 2013, p. 215-223.

    Research output: Contribution to journalArticle

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    abstract = "The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high-G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.",
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    AU - Duh,Jeng Gong

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