The tensile and tensile-creep deformation behavior of Ti-8Al-1Mo-1V(wt%)

I. G. Dastidar, V. Khademi, T. R. Bieler, A. L. Pilchak, M. A. Crimp, C. J. Boehlert

Research output: Contribution to journalArticle

  • 6 Citations

Abstract

The deformation behavior of titanium (Ti) can be complex due to the lower crystal symmetry of the hexagonal α phase compared with metals based on cubic phases. The tensile and tensile-creep deformation behavior of a Ti-8Al-1Mo-1V(wt%) alloy with a weak crystallographic texture was investigated in-situ straining scanning electron microscopy. Tensile experiments were performed at room temperature (RT), 260. °C, 455. °C, and 650. °C, while tensile-creep experiments were performed at 370. °C and 455. °C. Electron backscattered diffraction (EBSD) was performed both before and after the deformation, and slip trace analysis was used to identify the activation of the slip modes as a function of temperature and the associated global-stress-state Schmid factors. While extensive slip was characterized during the tensile tests, no twinning was observed. During the RT tensile tests the majority of the slip observed was on prismatic planes, while the relative activity of basal slip increased with temperature, such that at 455. °C, basal slip and prismatic slip were equally active. Some grain boundary and triple point cracking occurred during the elevated-temperature tensile deformation, while less slip activity and more grain boundary ledge formation were observed during the tensile-creep deformation. During tensile-creep, basal slip was more prevalent than prismatic slip and some transgranular cracks formed.

LanguageEnglish (US)
Pages289-300
Number of pages12
JournalMaterials Science and Engineering A
Volume636
DOIs
StatePublished - Jun 1 2015

Profile

tensile creep
Titanium
Creep
slip
titanium
Grain boundaries
Temperature
Trace analysis
Twinning
Crystal symmetry
tensile tests
Electron diffraction
grain boundaries
Textures
Metals
Experiments
Chemical activation
Cracks
ledges
tensile deformation

Keywords

  • Creep
  • Deformation mode
  • EBSD
  • In-situ SEM
  • Tension
  • Titanium alloy

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

The tensile and tensile-creep deformation behavior of Ti-8Al-1Mo-1V(wt%). / Dastidar, I. G.; Khademi, V.; Bieler, T. R.; Pilchak, A. L.; Crimp, M. A.; Boehlert, C. J.

In: Materials Science and Engineering A, Vol. 636, 01.06.2015, p. 289-300.

Research output: Contribution to journalArticle

@article{744b2d60e4e34f00b6ca8c67f31fb3d3,
title = "The tensile and tensile-creep deformation behavior of Ti-8Al-1Mo-1V(wt{\%})",
abstract = "The deformation behavior of titanium (Ti) can be complex due to the lower crystal symmetry of the hexagonal α phase compared with metals based on cubic phases. The tensile and tensile-creep deformation behavior of a Ti-8Al-1Mo-1V(wt{\%}) alloy with a weak crystallographic texture was investigated in-situ straining scanning electron microscopy. Tensile experiments were performed at room temperature (RT), 260. °C, 455. °C, and 650. °C, while tensile-creep experiments were performed at 370. °C and 455. °C. Electron backscattered diffraction (EBSD) was performed both before and after the deformation, and slip trace analysis was used to identify the activation of the slip modes as a function of temperature and the associated global-stress-state Schmid factors. While extensive slip was characterized during the tensile tests, no twinning was observed. During the RT tensile tests the majority of the slip observed was on prismatic planes, while the relative activity of basal slip increased with temperature, such that at 455. °C, basal slip and prismatic slip were equally active. Some grain boundary and triple point cracking occurred during the elevated-temperature tensile deformation, while less slip activity and more grain boundary ledge formation were observed during the tensile-creep deformation. During tensile-creep, basal slip was more prevalent than prismatic slip and some transgranular cracks formed.",
keywords = "Creep, Deformation mode, EBSD, In-situ SEM, Tension, Titanium alloy",
author = "Dastidar, {I. G.} and V. Khademi and Bieler, {T. R.} and Pilchak, {A. L.} and Crimp, {M. A.} and Boehlert, {C. J.}",
year = "2015",
month = "6",
day = "1",
doi = "10.1016/j.msea.2015.03.059",
language = "English (US)",
volume = "636",
pages = "289--300",
journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",
issn = "0921-5093",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - The tensile and tensile-creep deformation behavior of Ti-8Al-1Mo-1V(wt%)

AU - Dastidar,I. G.

AU - Khademi,V.

AU - Bieler,T. R.

AU - Pilchak,A. L.

AU - Crimp,M. A.

AU - Boehlert,C. J.

PY - 2015/6/1

Y1 - 2015/6/1

N2 - The deformation behavior of titanium (Ti) can be complex due to the lower crystal symmetry of the hexagonal α phase compared with metals based on cubic phases. The tensile and tensile-creep deformation behavior of a Ti-8Al-1Mo-1V(wt%) alloy with a weak crystallographic texture was investigated in-situ straining scanning electron microscopy. Tensile experiments were performed at room temperature (RT), 260. °C, 455. °C, and 650. °C, while tensile-creep experiments were performed at 370. °C and 455. °C. Electron backscattered diffraction (EBSD) was performed both before and after the deformation, and slip trace analysis was used to identify the activation of the slip modes as a function of temperature and the associated global-stress-state Schmid factors. While extensive slip was characterized during the tensile tests, no twinning was observed. During the RT tensile tests the majority of the slip observed was on prismatic planes, while the relative activity of basal slip increased with temperature, such that at 455. °C, basal slip and prismatic slip were equally active. Some grain boundary and triple point cracking occurred during the elevated-temperature tensile deformation, while less slip activity and more grain boundary ledge formation were observed during the tensile-creep deformation. During tensile-creep, basal slip was more prevalent than prismatic slip and some transgranular cracks formed.

AB - The deformation behavior of titanium (Ti) can be complex due to the lower crystal symmetry of the hexagonal α phase compared with metals based on cubic phases. The tensile and tensile-creep deformation behavior of a Ti-8Al-1Mo-1V(wt%) alloy with a weak crystallographic texture was investigated in-situ straining scanning electron microscopy. Tensile experiments were performed at room temperature (RT), 260. °C, 455. °C, and 650. °C, while tensile-creep experiments were performed at 370. °C and 455. °C. Electron backscattered diffraction (EBSD) was performed both before and after the deformation, and slip trace analysis was used to identify the activation of the slip modes as a function of temperature and the associated global-stress-state Schmid factors. While extensive slip was characterized during the tensile tests, no twinning was observed. During the RT tensile tests the majority of the slip observed was on prismatic planes, while the relative activity of basal slip increased with temperature, such that at 455. °C, basal slip and prismatic slip were equally active. Some grain boundary and triple point cracking occurred during the elevated-temperature tensile deformation, while less slip activity and more grain boundary ledge formation were observed during the tensile-creep deformation. During tensile-creep, basal slip was more prevalent than prismatic slip and some transgranular cracks formed.

KW - Creep

KW - Deformation mode

KW - EBSD

KW - In-situ SEM

KW - Tension

KW - Titanium alloy

UR - http://www.scopus.com/inward/record.url?scp=84927740494&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84927740494&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2015.03.059

DO - 10.1016/j.msea.2015.03.059

M3 - Article

VL - 636

SP - 289

EP - 300

JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

T2 - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

ER -