Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

Limin Ma, Yong Zuo, Sihan Liu, Fu Guo, Andre Lee, K. N. Subramanian

    Research output: Contribution to journalArticle

    • 1 Citations

    Abstract

    As an ideal modifier, the cage-type polyhedral oligomeric silsesquioxane (POSS)-silanol creates a strong bonding with the solder without agglomeration. It has been shown that the addition of POSS-silanol improves both the mechanical performance and the solder's resistance to electromigration. This study further examined the effect of the addition of POSS-silanol on whisker growth in a Sn3.0Ag0.5Cu (SAC305) solder. The whisker growth was studied for pure SAC305 and SAC305 modified with POSS-silanol under isothermal aging and thermal cycling conditions. The results indicate that the added POSS-silanol not only reinforces the solder joint, but also inhibits whisker formation under both thermal aging and thermal cycling conditions. POSS-silanol can therefore be considered a promising modifier material which enhances the reliability of solders. During the thermal aging process, the added POSS-silanol was found to inhibit the interdiffusion of Sn and Cu atoms at the interface region, thereby preventing the formation of Cu6Sn5 but promoting the conversion of Cu6Sn5 into Cu3Sn. During the thermal cycling process, the added POSS-silanol significantly inhibited whisker formation and the deformation of the interface by stiffening the solder matrix and decreasing the driving force for whisker formation.

    Original languageEnglish (US)
    Pages (from-to)400-407
    Number of pages8
    JournalJournal of Alloys and Compounds
    Volume657
    DOIs
    StatePublished - Feb 5 2016

    Profile

    Soldering alloys
    Employee Grievances
    Thermal cycling
    Erythrasma
    Thermal aging
    Rift Valley Fever
    Electromigration
    Agglomeration
    Atoms
    Composite materials
    Enzyme Reactivators
    Amino Acid Oxidoreductases
    Fetal Macrosomia
    Carbamyl Phosphate
    Traffic Accidents
    Aldosterone
    Oxidoreductases Acting on CH-NH Group Donors

    Keywords

    • Composite solder
    • Microstructure
    • POSS-silanol
    • Whisker formation

    ASJC Scopus subject areas

    • Mechanical Engineering
    • Mechanics of Materials
    • Materials Chemistry
    • Metals and Alloys

    Cite this

    Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders. / Ma, Limin; Zuo, Yong; Liu, Sihan; Guo, Fu; Lee, Andre; Subramanian, K. N.

    In: Journal of Alloys and Compounds, Vol. 657, 05.02.2016, p. 400-407.

    Research output: Contribution to journalArticle

    Ma, Limin; Zuo, Yong; Liu, Sihan; Guo, Fu; Lee, Andre; Subramanian, K. N. / Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders.

    In: Journal of Alloys and Compounds, Vol. 657, 05.02.2016, p. 400-407.

    Research output: Contribution to journalArticle

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    AU - Liu,Sihan

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    AU - Lee,Andre

    AU - Subramanian,K. N.

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